品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 制造商包装标识符 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 温度系数 | 连接器类型 | 类型 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 性别 | HTS代码 | 子类别 | 额定功率 | 触点类型 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 电阻器类型 | Reach合规守则 | 频率 | 频率稳定性 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 电感,电感 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 负载电容 | 电源电流 | 内存大小 | 频率容差 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 反向恢复时间 | 屏蔽的 | 电感容差 | 总 RAM 位数 | 均方根电流(Irms) | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 电阻公差 | 寄存器数量 | 逻辑块数量 | 最大结点温度(Tj) | 逻辑单元数 | 重复峰值反向电压 | 等效门数 | 产品类别 | 产品长度 | 产品宽度 | 高度 | 长度 | 宽度 | 辐射硬化 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | A3P250-2FG256I | Microchip | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | 310 MHz | ProASIC3 | N | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | A3P250-2FG256I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 1.5000 V | 157 | Tray | A3P250 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 3000 LE | + 100 C | 1.575 V | 0.014110 oz | - 40 C | 90 | 1.425 V | -40 to 85 °C | Tray | ProASIC3 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.8 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | 2 | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-0054301QYC | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 208-CQFP (75x75) | 微芯片技术 | Non-Compliant | Tray | 5962-0054301 | 活跃 | 171 | -55°C ~ 125°C (TJ) | SX-A | 125 °C | -55 °C | 2.25V ~ 5.25V | 217 MHz | 2.5 V | 2.75 V | 2.25 V | 1.5 ns | 1.5 ns | 4024 | 108000 | 217 MHz | 6036 | 6036 | 4024 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-FGG144 | Microchip | 数据表 | 61163 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | 0.013369 oz | 0 C | 微芯片技术 | 160 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P250-FGG144 | 1.32 | MICROSEMI CORP | FPGA - Field Programmable Gate Array A3P250-FGG144 LEAD FREE | 活跃 | SQUARE | LBGA | 350 MHz | 1.575 V | 1.425 V | 1.5000 V | 97 | Tray | A3P250 | 活跃 | 有 | 3000 LE | 36864 bit | + 85 C | 1.575 V | 0 to 70 °C | Tray | ProASIC3 | e1 | 100 ppm/K | 470 Ohm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 可编程逻辑集成电路 | 0.25 W | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | 通用型 | compliant | S-PBGA-B144 | 不合格 | 1.5 V | COMMERCIAL | 3 mA | - | 6144 CLBS, 250000 GATES | 1.55 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 1 | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-FGG256 | Microchip | 数据表 | 3600 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | SMD/SMT | 微芯片技术 | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | Tray | A3P250 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P250-FGG256 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.32 | 1.5000 V | 1.425 V | 1.575 V | 有 | 3000 LE | 36864 bit | 157 I/O | + 85 C | 1.575 V | 0.031747 oz | 0 C | 90 | 1.425 V | 0 to 70 °C | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | COMMERCIAL | 10 uH | 3 mA | - | 6144 CLBS, 250000 GATES | 1.8 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 20 | 36864 | 16 A | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 17.15 | 17.15 mm | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | 100 | Tray | A3P125 | Obsolete | -65 to 200 °C | ProASIC3 | 1.425V ~ 1.575V | 36864 | 125000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-FG256I | Microchip | 数据表 | 15 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | ProASIC3 | N | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | A3P250-FG256I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.47 | 157 | Tray | A3P250 | 活跃 | 有 | 3000 LE | + 100 C | 1.575 V | 0.014110 oz | - 40 C | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | -40°C ~ 100°C (TJ) | Tray | ProASIC3 | e0 | 3A001.A.7.B | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.8 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-2FG144I | Microchip | 数据表 | 146 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | Microchip | 微芯片技术 | Microchip Technology / Atmel | 350 MHz | ProASIC3 | N | Tray | A3P250 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 1.5 | MICROSEMI CORP | 活跃 | SQUARE | LBGA | 350 MHz | A3P250-2FG144I | 无 | 100 °C | 30 | 1.5 V | -40 °C | PLASTIC/EPOXY | 3 | 1.5000 V | 1.425 V | 1.575 V | 有 | 3000 LE | 97 I/O | + 100 C | 1.575 V | 0.014110 oz | - 40 C | 160 | 1.425 V | SMD/SMT | -40 to 85 °C | Tray | A3P250 | e0 | 300.0000 ppm/°C | 470 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | 1.0000 W | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 240 | 1 mm | Power | compliant | S-PBGA-B144 | 不合格 | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.55 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | 2 | - | 5 | 6144 | 250000 | FPGA - Field Programmable Gate Array | 6.8 mm | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025-1FGG484T1 | Microchip | 数据表 | 2384 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Tin | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | Straight | Crimp | 20 to 18, 20 AWG | Brass | 表面贴装 | 267 | Tray | M2GL025 | 活跃 | -40 to 85 °C | Automotive, AEC-Q100, IGLOO2 | 连接插座 | Pin | Power/Signal | 1.14V ~ 2.625V | 27696 | 无 | 1130496 | 16.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050TS-1FG484M | Microchip | 数据表 | 2538 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 267 | Tray | M2GL050 | 活跃 | -55°C ~ 125°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 56340 | 1869824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-VQ100I | Microchip | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | VQFP-100 | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Tray | A3P250 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | A3P250-VQ100I | 350 MHz | TFQFP | SQUARE | 活跃 | FPGA - Field Programmable Gate Array ProASIC3 | MICROSEMI CORP | 1.48 | 1.5000 V | 1.425 V | 1.575 V | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | 68 | Non-Compliant | 有 | 3000 LE | + 100 C | 1.575 V | 0.017813 oz | - 40 C | 90 | 1.425 V | -40 to 85 °C | Tray | A3P250 | e0 | TIN/LEAD (SN/PB) | 85 °C | -40 °C | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 231 MHz | S-PQFP-G100 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | - | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 250000 | 231 MHz | STD | - | 6144 | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | 无 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025T-1FG484M | Microchip | 数据表 | 2021 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | 1.26 V | 0.396232 oz | - 55 C | 60 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | N | Tray | M2GL025 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 27696 LE | 267 I/O | + 125 C | -55°C ~ 125°C (TJ) | Tray | M2GL025T | 100 ppm/K | 43.2 kOhm | 可编程逻辑集成电路 | 0.1 W | 1.14V ~ 2.625V | 通用型 | 1.2 V | 667 Mb/s | 27696 | FPGA - Field Programmable Gate Array | 1130496 | 4 Transceiver | 1 | FPGA - Field Programmable Gate Array | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600-2PQG208I | Microchip | 数据表 | 1 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 350 MHz | ProASIC3 | Tray | A3P600 | 活跃 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P600-2PQG208I | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 1.5000 V | 1.425 V | 1.575 V | 154 | Compliant | 有 | 7000 LE | + 100 C | 1.575 V | 1.230085 oz | - 40 C | 24 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | -40 to 85 °C | Tray | A3P600 | e3 | 100 ppm/K | 63.4 kOhm | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | 可编程逻辑集成电路 | 0.0625 W | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | 通用型 | compliant | 310 MHz | S-PQFP-G208 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | - | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 110592 | 600000 | 310 MHz | 2 | - | 1 | 13824 | 13824 | 600000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050T-1FG484I | Microchip | 数据表 | 2396 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 活跃 | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 1.14 V | 无 | M2GL050T-1FG484I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.29 | 267 | Tray | M2GL050 | -40°C ~ 100°C (TJ) | IGLOO2 | e0 | 100 ppm/K | 33.2 Ohm | Tin/Lead (Sn/Pb) | 现场可编程门阵列 | 0.125 W | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | 通用型 | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 267 | 2.44 mm | 现场可编程门阵列 | 56340 | 1869824 | 1 | 1 | 56340 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-1FG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | 60 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | N | Tray | M2GL090 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 86316 | 267 I/O | + 125 C | 1.26 V | - 55 C | -55°C ~ 125°C (TJ) | Tray | M2GL090T | 可编程逻辑集成电路 | 1.14V ~ 2.625V | 1.2 V | 667 Mb/s | 86184 | SoC FPGA | 2648064 | 4 Transceiver | FPGA - Field Programmable Gate Array | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P400-FGG256I | Microchip | 数据表 | 1807 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 0.014110 oz | - 40 C | 微芯片技术 | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P400-FGG256I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | 500 V | 1.5000 V | 1.425 V | 1.575 V | 178 | Tray | A3P400 | 活跃 | 有 | 5000 LE | + 100 C | 1.575 V | -40 to 85 °C | Tray | ProASIC3 | e1 | 3A001.A.7.B | 100 ppm/°C | 150 kOhm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 可编程逻辑集成电路 | 250 mW | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | 厚膜 | compliant | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | - | 9216 CLBS, 400000 GATES | 1.8 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 55296 | 400000 | STD | - | 1 | 9216 | 400000 | FPGA - Field Programmable Gate Array | 3.2 mm | 1.6 mm | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | A3P600-PQ208 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | 154 | Compliant | Tray | A3P600 | Obsolete | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 231 MHz | S-PQFP-G208 | 不合格 | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 110592 | 600000 | 231 MHz | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600-PQG208I | Microchip | 数据表 | 600 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | ProASIC3 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P600-PQG208I | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | 154 | Tray | A3P600 | 活跃 | Compliant | 有 | 7000 LE | 110592 bit | + 100 C | 1.575 V | 1 oz | - 40 C | 24 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | -40°C ~ 100°C (TJ) | Tray | ProASIC3 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 231 MHz | S-PQFP-G208 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 45 mA | 13.5 kB | - | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 6500 | FPGA - Field Programmable Gate Array | 110592 | 600000 | 231 MHz | STD | - | 13824 | 13824 | 600000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-VQG100I | Microchip | 数据表 | 30 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | VQFP100 | 1.575 V | 0.017637 oz | 微芯片技术 | - 40 C | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | 2048 | FLASH | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P250-VQG100I | 350 MHz | TFQFP | SQUARE | 活跃 | FPGA - Field Programmable Gate Array ProASIC3 | MICROSEMI CORP | 1.29 | 1.5000 V | 1.425 V | 1.575 V | 68 | Tray | A3P250 | 活跃 | MSL 3 - 168 hours | 有 | 3000 LE | 36864 bit | + 100 C | -40 to 85 °C | Tray | ProASIC3 | e3 | 3A001.A.7.B | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 231 MHz | S-PQFP-G100 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | 30 mA | 3 mA | 4.5 kB | - | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 3000 | FPGA - Field Programmable Gate Array | 36864 | 250000 | 231 MHz | STD | - | 6144 | 6144 | 100 °C | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | 无 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | APA075-TQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | 100-TQFP (14x14) | 微芯片技术 | 66 | Tray | APA075 | Obsolete | 0°C ~ 70°C (TA) | ProASICPLUS | 2.3V ~ 2.7V | 27648 | 75000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA150-TQG100I | Microchip | 数据表 | 2802 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | 180 MHz | Actel | Details | LFQFP, QFP100,.63SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP100,.63SQ,20 | -40 °C | 2.5 V | 40 | 85 °C | 有 | APA150-TQG100I | 180 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.58 | 66 | Tray | APA150 | 活跃 | 有 | 2000 LE | + 85 C | 2.7 V | 0.023175 oz | - 40 C | 90 | 2.3 V | SMD/SMT | Microchip | Microchip Technology / Atmel | -40°C ~ 85°C (TA) | Tray | ProASICPLUS | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 66 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | - | 66 | 150000 GATES | 1.6 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 4 | 36864 | 150000 | STD | - | 6144 | 75 | 150000 | FPGA - Field Programmable Gate Array | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA150-TQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | 66 | Tray | APA150 | Obsolete | 0.50 MM PITCH, TQFP-100 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP100,.63SQ,20 | 2.5 V | 30 | 2.3 V | 70 °C | 无 | APA150-TQ100 | 180 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.7 V | 5.32 | 0°C ~ 70°C (TA) | ProASICPLUS | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G100 | 66 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 66 | 150000 GATES | 1.6 mm | 现场可编程门阵列 | 36864 | 150000 | 6144 | 150000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA075-TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 107 | Tray | APA075 | Obsolete | 0.50 MM PITCH, TQFP-144 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 2.5 V | 30 | 2.3 V | 70 °C | 无 | APA075-TQ144 | 180 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.7 V | 5.31 | 0°C ~ 70°C (TA) | ProASICPLUS | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G144 | 107 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 107 | 75000 GATES | 1.6 mm | 现场可编程门阵列 | 27648 | 75000 | 3072 | 75000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL250V2-FGG144 | Microchip | 数据表 | 141 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | 3000 LE | 36864 bit | 97 I/O | + 85 C | 1.575 V | 0.152790 oz | 微芯片技术 | 0 C | 160 | 1.14 V | SMD/SMT | - | Microchip | Microchip Technology / Atmel | 526.32 MHz, 892.86 MHz | IGLOOe | Details | Tray | AGL250 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.2 V | 40 | 85 °C | 有 | AGL250V2-FGG144 | 108 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.36 | ±3 ppm/Year | 48 MHz | Fundamental | 表面贴装 | 1.2, 1.5 V | 1.14 V | 1.575 V | 有 | -10 to 60 °C | Tray | AGL250V2 | e1 | Crystal | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 10 ppm | 4 | S-PBGA-B144 | 不合格 | 1.2 V to 1.5 V | OTHER | 18 pF | ±10 ppm | - | 6144 CLBS, 250000 GATES | 1.55 mm | 现场可编程门阵列 | 6144 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL250V5-VQ100I | Microchip | 数据表 | 145 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | 892.86 MHz | IGLOOe | N | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | AGL250V5-VQ100I | 108 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 1.425 V | 1.575 V | 68 | Tray | AGL250 | 活跃 | 有 | 3000 LE | + 100 C | 1.575 V | 0.594778 oz | - 40 C | 90 | 1.425 V | -40°C ~ 85°C (TA) | Tray | IGLOO | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-CGS624M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 通孔 | 624 | 418 | Compliant | 125 °C | -55 °C | 1.5 V | 20.3 kB | 990 ps | 12096 | 1e+06 | 12096 | 无 |
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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184.956782
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263.756265
A3P250-2FG144I
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分类:Embedded - FPGAs (Field Programmable Gate Array)
312.912193
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分类:Embedded - FPGAs (Field Programmable Gate Array)
1,608.538072
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3,301.212018
A3P250-VQ100I
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分类:Embedded - FPGAs (Field Programmable Gate Array)
127.738908
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A3P600-2PQG208I
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618.348092
M2GL050T-1FG484I
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1,037.019182
M2GL090T-1FG484M
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A3P400-FGG256I
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324.548154
A3P600-PQ208
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分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600-PQG208I
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分类:Embedded - FPGAs (Field Programmable Gate Array)
474.177640
A3P250-VQG100I
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分类:Embedded - FPGAs (Field Programmable Gate Array)
127.738908
APA075-TQ100
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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APA150-TQ100
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APA075-TQ144
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分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL250V2-FGG144
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分类:Embedded - FPGAs (Field Programmable Gate Array)
273.740948
AGL250V5-VQ100I
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分类:Embedded - FPGAs (Field Programmable Gate Array)
159.895616
AX1000-CGS624M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
