N/A

-

Lead, Tin

通孔

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

Compliant

-

有

This product may require additional documentation to export from the United States.

109000 LE

170 I/O

7.6 Mbit

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Tray

MPF100

活跃

0°C ~ 100°C (TJ)

Bulk

MPF100T

0.5 %

2

50 ppm/°C

7.41 kΩ

175 °C

-65 °C

Metal Film

可编程逻辑集成电路

100 mW

100 mW

1 V, 1.05 V

MIL-PRF-55182

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7600Kbit

4 Transceiver

Military, Moisture Resistant, Weldable

FPGA - Field Programmable Gate Array

1.78 mm

3.81 mm

1.78 mm

含铅

N/A

-

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

有

This product may require additional documentation to export from the United States.

192000 LE

170 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF200

活跃

0°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

Axial

YES

Axial

100

SMD/SMT

Microchip

Microchip Technology / Atmel

微芯片技术

250 MHz

IGLOO nano

N

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AGLN125V5-VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

2.22

71

Tray

AGLN125

活跃

有

1500 LE

+ 100 C

1.575 V

- 40 C

90

1.425 V

-65°C ~ 175°C

Bulk

Military, MIL-R-10509/1, RN60

0.145 Dia x 0.344 L (3.68mm x 8.74mm)

±1%

e0

活跃

2

±25ppm/°C

35.7 kOhms

Tin/Lead (Sn/Pb)

Metal Film

0.25W, 1/4W

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

--

INDUSTRIAL

-

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

FPGA - Field Programmable Gate Array

36864

125000

STD

-

3072

125000

Flame Retardant Coating, Military, Moisture Resistant, Safety

FPGA - Field Programmable Gate Array

1 mm

--

14 mm

14 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

2.7 V

5.3

158

Compliant

Tray

APA1000

Obsolete

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

30

2.3 V

70 °C

无

APA1000-PQ208

180 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

0°C ~ 70°C (TA)

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

2.5 V

QUAD

鸥翼

225

0.5 mm

unknown

180 MHz

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

COMMERCIAL

24.8 kB

158

1000000 GATES

4.1 mm

现场可编程门阵列

202752

1e+06

180 MHz

56320

56320

2.7 V

2.3 V

1000000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

324-BGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

1.2 V

-40 °C

BGA324,18X18,40

PLASTIC/EPOXY

3

网格排列

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

1.14 V

1.26 V

221

Tray

A3PE3000

活跃

Compliant

5.29

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

250 MHz

A3PE3000L-FGG324I

有

85 °C

1.14 V

40

-40°C ~ 100°C (TJ)

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.2/1.5,1.2/3.3 V

INDUSTRIAL

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

1.26 V

1.14 V

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

A3PE3000L-FGG896I

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.29

1.2000 V

1.14 V

1.26 V

620

Compliant

Tray

A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.2 V

40

1.14 V

85 °C

有

-40 to 85 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.2 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.2/1.5,1.2/3.3 V

INDUSTRIAL

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3e+06

781.25 MHz

STD

75264

75264

75264

1.26 V

1.14 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

活跃

有

11000 LE

147456 bit

+ 85 C

1.575 V

2 oz

0 C

微芯片技术

24

1.425 V

SMD/SMT

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P1000-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

0.74

1.5000 V

1.425 V

1.575 V

154

Tray

A3P1000

0 to 70 °C

Tray

ProASIC3

e3

3A991.D

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

8 mA

-

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

147456

1000000

STD

-

24576

1000000

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

有

This product may require additional documentation to export from the United States.

192000 LE

284 I/O

+ 100 C

1.08 V

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF200

活跃

-40°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

325-LFBGA, FC

YES

325-FCBGA (11x14.5)

325

微芯片技术

5.8

170

Tray

MPF200

活跃

1.03 V/1.08 V

970 mV/1.02 V

SMD/SMT

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1 V

未说明

100 °C

有

MPF200TS-1FCSG325I

LFBGA

RECTANGULAR

Microsemi Corporation

活跃

MICROSEMI CORP

-40°C ~ 100°C (TJ)

PolarFire™

CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL

0.97V ~ 1.08V

BOTTOM

BALL

未说明

0.5 mm

compliant

R-PBGA-B325

INDUSTRIAL

1.45 mm

现场可编程门阵列

192000

13619200

14.5 mm

11 mm

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

Details

PolarFire

Microchip Technology / Atmel

Microchip

SMD/SMT

0.97 V

1

- 40 C

1.08 V

+ 100 C

284 I/O

20.6 Mbit

300000 LE

This product may require additional documentation to export from the United States.

有

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

有

This product may require additional documentation to export from the United States.

192000 LE

284 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF200

活跃

0°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

Gold

Flanges, Panel, Wall

表面贴装

BGA-325

325-FCBGA (11x11)

Aluminium

微芯片技术

Compliant

有

This product may require additional documentation to export from the United States.

109000 LE

170 I/O

7.6 Mbit

+ 100 C

1.03 V/1.08 V

- 40 C

1

970 mV/1.02 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Tray

MPF100

活跃

Copper

-40°C ~ 100°C (TJ)

Bulk

MPF100TL

Crimp

Circular, Receptacle

26

200 °C

-65 °C

Receptacle

Bayonet

可编程逻辑集成电路

1 V, 1.05 V

Straight

30.96 mm

7.5 A

MIL-DTL-38999

26

Female

Socket

Cadmium

12.7 Gb/s

109000

FPGA - Field Programmable Gate Array

7782400

4 Transceiver

FPGA - Field Programmable Gate Array

23.54 mm

无

无SVHC

抗环境干扰

N/A

-

Lead, Tin

通孔

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

Compliant

512

Tray

MPF300

活跃

300000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

Bulk

PolarFire™

1 %

2

50 ppm/°C

3.7 kΩ

175 °C

-65 °C

Metal Film

125 mW

125 mW

0.97V ~ 1.08V

MIL-PRF-55182

12.7 Gb/s

300000

21094400

Military, Moisture Resistant, Weldable

2.39 mm

6.35 mm

2.39 mm

含铅

N/A

-

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

MICROSEMI CORP

3.6 V

5.25

T507117064AB

Miscellaneous

174

Compliant

Tray

A54SX32

Obsolete

PLASTIC, MO-143, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

240 MHz

FQFP

SQUARE

Obsolete

-55°C ~ 125°C (TC)

SX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

225

0.5 mm

unknown

240 MHz

S-PQFP-G208

不合格

MILITARY

900 ps

900 ps

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

0.9 ns

2880

2880

5.5 V

4.5 V

32000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

5.24

QFP

ABB

ACH580-BCR-273A-2+E213+F267+K465

140

Tray

A42MX16

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

117 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

3.6 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

28 mm

28 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

1.2 V

PLASTIC/EPOXY

3

网格排列

BGA,

200

Tray

M2GL060

活跃

56520 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

5.26

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

M2GL060TS-1FCSG325I

有

30

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

70 °C

无

50.4 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

3.6 V

5.2

QFP

36200-WONR

EAC, UL

50 Hz, 60 Hz

Woehner, LLC

无

无

DIN Rail

176

Tray

A42MX24

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

3 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

10 A

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1410

3.4 ns

1890

5.25 V

3 V

无

36000

480 VAC

3.4 mm

28 mm

28 mm

无

N/A

-

DIN Rail,Surface

484-BFBGA

484-FBGA (19x19)

微芯片技术

176

Tray

活跃

48000 LE

+ 100 C

1.03 V/1.08 V

0 C

970 mV/1.02 V

SMD/SMT

SHS10S110A

CSA, UL

Syrelec, Brand of Crouzet Control

无

10

0°C ~ 100°C (TJ)

-

0.250 in Flat Blade

0.97V ~ 1.08V

3774874

48000

Interval

固态

IP66

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

208

208-PQFP (28x28)

微芯片技术

Obsolete

Miscellaneous

171

Compliant

Tray

A54SX72A

0°C ~ 70°C (TA)

SX-A

70 °C

0 °C

2.5 V

217 MHz

1.5 ns

1.5 ns

6036

108000

217 MHz

6036

6036

4024

2.75 V

2.25 V

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

100-TQFP

YES

100

100-VQFP (14x14)

100

微芯片技术

5.24

QFP

ABB

83

Tray

A42MX16

Obsolete

1 MM HEIGHT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX16-VQ100

94 MHz

TFQFP

SQUARE

Obsolete

MICROSEMI CORP

3.6 V

0°C ~ 70°C (TA)

MX

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2.8 ns

1232

1232

24000

14 mm

14 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

896

400.011771 mg

896

5.8

516

Compliant

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

40

1.425 V

85 °C

有

AX1000-2FGG896I

870 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

e1

锡银铜

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B896

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

1e+06

870 MHz

12096

2

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

YES

208

208

95

Compliant

QFF,

FLATPACK

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

AFS600-2PQG208

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.8

e3

哑光锡

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

600000

1.47059 GHz

2

13824

13824

1.575 V

1.425 V

600000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

1.575 V

5.6

147

Compliant

Tray

A3PE3000

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

1.425 V

85 °C

有

A3PE3000-PQG208I

FQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

-40°C ~ 100°C (TJ)

ProASIC3E

e3

3A001.A.7.A

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

63 kB

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3e+06

231 MHz

STD

75264

75264

75264

1.575 V

1.425 V

3000000

3.4 mm

28 mm

28 mm

无

无铅

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

896

400.011771 mg

Compliant

516

85 °C

-40 °C

1.5 V

763 MHz

20.3 kB

850 ps

850 ps

12096

1e+06

763 MHz

12096

1

12096

1.575 V

1.425 V

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

5.24

97

Compliant

Tray

A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

A3P600-FGG144I

350 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

-40°C ~ 100°C (TJ)

ProASIC3

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B144

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

231 MHz

STD

13824

13824

1.575 V

1.425 V

600000

1.05 mm

13 mm

13 mm

无

无铅