N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

表面贴装

81

Tray

A54SX16

活跃

微芯片技术

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

3.3 V

40

3 V

70 °C

有

A54SX16P-1VQG100

280 MHz

TFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

Commercial grade

1452

VQFP

3.3, 5 V

2.97, 4.75 V

24000

81

16000

3.63, 5.25 V

0 to 70 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

100

S-PQFP-G100

81

不合格

3.3,3.3/5 V

COMMERCIAL

81

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

Commercial

1

528

0.8 ns

1452

1452

16000

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

Tray

微芯片技术

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

2.5 V

30

2.3 V

70 °C

无

APA750-FG896

180 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.7 V

5.26

Commercial grade

FBGA

2.5000 V

2.3 V

750000

562

750000

2.7 V

表面贴装

562

Compliant

活跃

APA750

0 to 70 °C

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

180 MHz

896

S-PBGA-B896

562

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

18 kB

562

750000 GATES

2.44 mm

现场可编程门阵列

147456

750000

180 MHz

Commercial

STD

32768

32768

750000

1.73 mm

31 mm

31 mm

无

2518 In Stock

• 1: ¥1,428.051698
• 10: ¥1,347.218586
• 100: ¥1,270.960928
• 500: ¥1,199.019744
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

1.26 V

5.3

377

Compliant

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

有

M2GL050TS-1FGG896I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

PLASTIC/EPOXY

微芯片技术

-40 °C

1.5 V

未说明

1.425 V

100 °C

无

AGL1000V5-CS281I

108 MHz

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.28

Industrial grade

CSP

1.5000 V

1000000

215

1000000

表面贴装

215

Tray

AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

-40 to 85 °C

IGLOO

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

281

S-PBGA-B281

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

Industrial

STD

24576

24576

1000000

10 mm

10 mm

2178 In Stock

• 1: ¥2,687.554062
• 10: ¥2,535.428363
• 100: ¥2,391.913548
• 500: ¥2,256.522216
查看所有的价格

-

表面贴装

329-BBGA

329-PBGA (31x31)

微芯片技术

Tray

A54SX32

活跃

2.5000 V

2.25 V

2.75 V

249

0 to 70 °C

SX-A

2.25V ~ 5.25V

48000

2880

STD

97 In Stock

• 1: ¥814.301540
• 10: ¥768.208999
• 100: ¥724.725469
• 500: ¥683.703275
查看所有的价格

-

表面贴装

VFBGA-400

YES

400-VFBGA (17x17)

400

SMD/SMT

Microchip

微芯片技术

IGLOO2

Details

Tray

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

有

M2GL050-VFG400I

LFBGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

1.53

90

Microchip Technology / Atmel

M2GL050

MICROSEMI CORP

有

56340 LE

207 I/O

+ 100 C

1.26 V

- 40 C

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

可编程逻辑集成电路

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

207

不合格

1.2 V

1.2 V

667 Mb/s

207

1.51 mm

现场可编程门阵列

56340

FPGA - Field Programmable Gate Array

1869824

STD

4 Transceiver

56340

FPGA - Field Programmable Gate Array

17 mm

17 mm

2087 In Stock

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

MICROSEMI CORP

1.575 V

1.48

68

Tray

AGLN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

1.14 V

85 °C

有

AGLN250V2-VQG100I

TFQFP

SQUARE

Microsemi Corporation

活跃

-40°C ~ 100°C (TJ)

IGLOO nano

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

14 mm

14 mm

2269 In Stock

• 1: ¥1,272.859432
• 10: ¥1,200.810782
• 100: ¥1,132.840360
• 500: ¥1,068.717320
查看所有的价格

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

微芯片技术

85 °C

有

A40MX04-PQG100I

80 MHz

QFP

RECTANGULAR

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.28

3.3, 5 V

3 V

5.5 V

69

Tray

A40MX04

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

3 V

-40 to 85 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

STD

2.7 ns

547

6000

20 mm

14 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

Ceramic

微芯片技术

MICROSEMI CORP

3.6 V

5.2

LCC

表面贴装

72

Compliant

Tray

A42MX24

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX24-FPL84

50.4 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

-55°C to +125°C

MX

0.05

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

5 V

COMMERCIAL

5.25 V

3 V

Pb

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

1410

3.4 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

无

48 In Stock

• 1: ¥509.619673
• 10: ¥480.773280
• 100: ¥453.559692
• 500: ¥427.886505
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

M2GL005

活跃

209

Tray

-40°C ~ 135°C (TJ)

Automotive, AEC-Q100, IGLOO2

1.14V ~ 2.625V

6060

719872

2281 In Stock

• 1: ¥823.424992
• 10: ¥776.816029
• 100: ¥732.845309
• 500: ¥691.363500
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

PLASTIC/EPOXY

3

网格排列

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

5.25

1.26 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

M2GL050-FCSG325

有

85 °C

1.14 V

30

1.2 V

BGA325,21X21,20

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

663 In Stock

• 1: ¥4,003.014413
• 10: ¥3,776.428692
• 100: ¥3,562.668578
• 500: ¥3,361.008092
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

Microsemi Corporation

活跃

MICROSEMI CORP

5.79

267

Tray

M2GL090

活跃

,

未说明

有

M2GL090-1FGG484T1

-40°C ~ 135°C (TJ)

Automotive, AEC-Q100, IGLOO2

有

1.14V ~ 2.625V

未说明

compliant

现场可编程门阵列

86316

2648064

35 In Stock

• 1: ¥478.467160
• 10: ¥451.384114
• 100: ¥425.834070
• 500: ¥401.730251
查看所有的价格

-

表面贴装

256-LFBGA

256-FPBGA (14x14)

微芯片技术

138

Tray

M2GL010

活跃

12084 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

-40°C ~ 100°C (TJ)

IGLOO2

1.14V ~ 2.625V

1.2 V

12084

933888

2224 In Stock

• 1: ¥1,882.551558
• 10: ¥1,775.992037
• 100: ¥1,675.464185
• 500: ¥1,580.626586
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

85 °C

无

M2GL090TS-1FCS325

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.27

180

Tray

M2GL090

活跃

86184 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

OTHER

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

2614 In Stock

• 1: ¥1,364.240382
• 10: ¥1,287.019226
• 100: ¥1,214.169080
• 500: ¥1,145.442531
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

267

Tray

M2GL060

活跃

56520 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

2490 In Stock

• 1: ¥1,036.311180
• 10: ¥977.652058
• 100: ¥922.313261
• 500: ¥870.106849
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

M2GL010

活跃

233

Tray

-40°C ~ 135°C (TJ)

Automotive, AEC-Q100, IGLOO2

1.14V ~ 2.625V

12084

933888

N/A

-

表面贴装

100-BQFP

100-PQFP (20x14)

微芯片技术

A40MX04

Obsolete

69

Tray

0°C ~ 70°C (TA)

MX

3V ~ 3.6V, 4.75V ~ 5.25V

6000

N/A

-

51

Non-Compliant

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

Crimp

D-Sub

125 °C

-55 °C

5 V

12 mm

5.2 ns

1

998

无

46 In Stock

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

微芯片技术

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.22

QFP

83

Tray

A42MX16

Obsolete

PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX16-1PQ100I

108 MHz

QFP

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

20 mm

14 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

PLASTIC/EPOXY

3

FLATPACK, LOW PROFILE, FINE PITCH

100

Tray

A3P125

Obsolete

LFQFP,

5.25

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

LFQFP

350 MHz

A3P125-1TQ144

无

85 °C

1.425 V

30

1.5 V

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

COMMERCIAL

3072 CLBS, 125000 GATES

1.6 mm

现场可编程门阵列

36864

125000

3072

125000

20 mm

20 mm

N/A

-

YES

108

Microsemi Corporation

SQUARE

VBCC

350 MHz

AFS090-2QNG108

有

85 °C

1.425 V

未说明

1.5 V

LGA108,17X17,20

UNSPECIFIED

3

CHIP CARRIER, VERY THIN PROFILE

VBCC, LGA108,17X17,20

5.31

1.575 V

MICROSEMI CORP

Obsolete

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B108

37

不合格

1.5,3.3 V

OTHER

37

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

8 mm

8 mm

N/A

-

YES

180

5.32

VBCC, LGA180,20X20,20

CHIP CARRIER, VERY THIN PROFILE

3

UNSPECIFIED

LGA180,20X20,20

1.5 V

30

1.425 V

85 °C

有

AFS090-QNG180

350 MHz

VBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

260

0.5 mm

compliant

S-XBCC-B180

60

不合格

1.5,3.3 V

OTHER

60

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

10 mm

10 mm

N/A

-

YES

108

VBCC, LGA108,17X17,20

85 °C

有

AFS090-QNG108

350 MHz

VBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.31

1.425 V

未说明

1.5 V

LGA108,17X17,20

UNSPECIFIED

3

CHIP CARRIER, VERY THIN PROFILE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B108

37

不合格

1.5,3.3 V

OTHER

37

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

8 mm

8 mm

N/A

-

YES

132

MICROSEMI CORP

1.575 V

5.6

HVBCC, LGA132(UNSPEC)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LGA132(UNSPEC)

-40 °C

1.2 V

未说明

1.14 V

85 °C

有

AGL060V2-QNG132I

108 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B132

80

不合格

1.2/1.5 V

INDUSTRIAL

80

1536 CLBS, 60000 GATES

0.8 mm

现场可编程门阵列

1536

1536

60000

8 mm

8 mm

N/A

-

YES

132

8.31

HVBCC, LGA132(UNSPEC)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LGA132(UNSPEC)

1.5 V

未说明

1.425 V

70 °C

有

AGL125V5-QNG132

108 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B132

84

不合格

1.5 V

COMMERCIAL

84

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

3072

3072

125000

8 mm

8 mm