N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

Obsolete

MICROSEMI CORP

1.575 V

5.61

Non-Compliant

147

Tray

A3PE1500

Obsolete

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

30

1.425 V

85 °C

无

A3PE1500-1PQ208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

-40°C ~ 100°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

272 MHz

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1.5e+06

272 MHz

1

38400

38400

38400

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.26

Non-Compliant

81

Tray

A54SX16A

Obsolete

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

30

2.25 V

70 °C

无

A54SX16A-1TQ100

263 MHz

LFQFP

SQUARE

0°C ~ 70°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,3.3/5 V

COMMERCIAL

81

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

14 mm

14 mm

N/A

-

YES

176

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A54SX16-2TQ176

320 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

不合格

COMMERCIAL

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

0.7 ns

1452

16000

24 mm

24 mm

N/A

-

表面贴装

84

70

Compliant

85 °C

-40 °C

150 MHz

5 V

5.5 V

4.5 V

2.6 ns

2.6 ns

200

1500

200

1

264

无

N/A

-

Female

Pin

N/A

-

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

293

Tray

M2GL150

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150-1FCSG536I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

现场可编程门阵列

146124

5120000

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.27

207

Tray

M2GL025

活跃

27696 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

无

M2GL025-VF400I

LFBGA

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

1.2 V

207

1.51 mm

现场可编程门阵列

27696

1130496

STD

27696

17 mm

17 mm

N/A

-

表面贴装

80

Compliant

57

70 °C

0 °C

57 MHz

5 V

5.25 V

4.75 V

3.8 ns

295

1200

295

1

147

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

AFS600-2FGG256I

活跃

MICROSEMI CORP

This product may require additional documentation to export from the United States.

Details

7000 LE

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

LBGA,

有

-40°C ~ 100°C (TJ)

Tray

AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

649 MHz

有

27

Actel

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AX2000

活跃

5.25

MICROSEMI CORP

活跃

SQUARE

BGA

649 MHz

AX2000-FG896I

无

85 °C

30

1.5 V

-40 °C

BGA896,30X30,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA896,30X30,40

This product may require additional documentation to export from the United States.

N

586 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40 to 85 °C

Tray

AX2000

e0

Tin/Lead (Sn/Pb)

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

896

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

294912

2000000

32256

STD

0.99 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-PQG208

73 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.57

Actel

24

有

131 MHz

SMD/SMT

+ 70 C

0 C

3 V

176 I/O

Details

5.25 V

Tray

A42MX36

活跃

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

2560

54000

2.7 ns

2438

54000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

微芯片技术

1.575 V

1.575 V

Tray

M1A3P250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

90

ProASIC3

1.5000 V

0 to 70 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

325-TFBGA

325-BGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

192000 LE

170 I/O

0.97 V

- 55 C

+ 125 C

SMD/SMT

1

1.08 V

Tray

活跃

-55°C ~ 125°C (TJ)

Tray

MPF200TS

0.97V ~ 1.08V

1.05 V

12.5 Gb/s

192000

13946061

4 Transceiver

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN060-1VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

350 MHz

有

90

ProASIC3 nano

1.575 V

Tray

A3PN060

活跃

-20°C ~ 85°C (TJ)

Tray

A3PN060

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

活跃

BGA,

网格排列

PLASTIC/EPOXY

1 V

MPF500TS-FC1152M

BGA

SQUARE

活跃

MICROSEMI CORP

5.79

This product may require additional documentation to export from the United States.

970 mV/1.02 V

1

1.03 V/1.08 V

584

Tray

-55°C ~ 125°C (TJ)

Tray

MPF500TS

IT ALSO OPERATES AT 1.05 V SUPPLY

0.97V ~ 1.08V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

1.05 V

2.9 mm

现场可编程门阵列

481000

34603008

35 mm

35 mm

N/A

-

表面贴装

784-BBGA, FCBGA

784-FCBGA (29x29)

微芯片技术

This product may require additional documentation to export from the United States.

970 mV/1.02 V

1

388

Tray

活跃

1.03 V/1.08 V

-55°C ~ 125°C (TJ)

Tray

MPF500TS

0.97V ~ 1.08V

1.05 V

481000

34603008

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

微芯片技术

FBGA

1.5000 V

1.425 V

600000

235

600000

1.575 V

表面贴装

1.575 V

Tray

A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Commercial grade

This product may require additional documentation to export from the United States.

N

235 I/O

0 to 70 °C

Tray

A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

484

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

Commercial

1

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

0.014110 oz

1.575 V

Tray

AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

AFS600-2FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

7000 LE

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0°C ~ 85°C (TJ)

Tray

AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

48000 LE

176 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

Tray

活跃

1.03 V/1.08 V

0°C ~ 100°C (TJ)

Tray

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

-40°C ~ 100°C (TJ)

Tray

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

-40°C ~ 100°C (TJ)

Tray

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCV-484

484-FBGA (19x19)

微芯片技术

1.03 V/1.08 V

Tray

活跃

3.6 MB

1

500 MHz

SMD/SMT

+ 100 C

- 40 C

970 mV/1.02 V

176 I/O

48000 LE

MSL 3 - 168 hours

-40°C ~ 100°C (TJ)

Tray

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

3686.4Kbit

48000

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

-40°C ~ 100°C (TJ)

Tray

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCV-484

484-FBGA (19x19)

微芯片技术

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

Tray

活跃

1.03 V/1.08 V

-40°C ~ 100°C (TJ)

Tray

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCV-484

484-FBGA (19x19)

微芯片技术

48000 LE

176 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

0°C ~ 100°C (TJ)

Tray

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

48000