品牌是'Microchip' (5152)
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![]() | A3P1000-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | + 100 C | 1.575 V | - 40 C | 24 | 1.425 V | SMD/SMT | 微芯片技术 | - | Microchip | Microchip Technology / Atmel | 272 MHz | ProASIC3 | Details | Tray | A3P1000 | 活跃 | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P1000-1PQG208I | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 有 | 11000 LE | 147456 bit | 154 I/O | -40°C ~ 100°C (TJ) | Tray | A3P1000 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 75 mA | - | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 147456 | 1000000 | 1 | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||
![]() | A1225A-PL84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 84 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 5.84 | 72 | Non-Compliant | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC84,1.2SQ | 5 V | 30 | 4.75 V | 70 °C | 无 | A1225A-PL84C | 75 MHz | QCCJ | SQUARE | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | PLD EQUIVALENT GATES=6250 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | J BEND | 225 | 1.27 mm | compliant | 110 MHz | S-PQCC-J84 | 83 | 不合格 | 5 V | COMMERCIAL | 5 ns | 83 | 451 CLBS, 2500 GATES | 4.572 mm | 现场可编程门阵列 | 451 | 2500 | 451 | 5 ns | 451 | 451 | 5.25 V | 4.75 V | 2500 | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-1PL44I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 44 | 44 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.81 | LCC | 8542390000/8542390000/8542390000/8542390000/8542390000 | 34 | Compliant | PLASTIC, LCC-44 | CHIP CARRIER | PLASTIC/EPOXY | LDCC44,.7SQ | -40 °C | 5 V | 4.5 V | 85 °C | 无 | A1010B-1PL44I | 47.7 MHz | QCCJ | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | J BEND | 1.27 mm | unknown | 57 MHz | S-PQCC-J44 | 57 | 不合格 | 5 V | INDUSTRIAL | 3.8 ns | 3.8 ns | 57 | 547 CLBS, 2000 GATES | 4.572 mm | 现场可编程门阵列 | 295 | 1200 | 295 | 1 | 147 | 547 | 295 | 5.5 V | 4.5 V | 2000 | 16.5862 mm | 16.5862 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PLG68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 68 | 68 | MICROSEMI CORP | 5.5 V | 8.59 | 57 | Compliant | PLASTIC, MS-007-AD, LCC-68 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 40 | 4.5 V | 85 °C | 有 | A1020B-PLG68I | QCCJ | SQUARE | Microsemi Corporation | Obsolete | e3 | Tin (Sn) | 85 °C | -40 °C | MAX 57 I/OS | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 245 | 1.27 mm | compliant | 48 MHz | S-PQCC-J68 | 不合格 | INDUSTRIAL | 4.5 ns | 4.5 ns | 547 CLBS, 2000 GATES | 4.445 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 273 | 4.5 ns | 547 | 5.5 V | 4.5 V | 2000 | 24.13 mm | 24.13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250L-VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 100 | 100 | Obsolete | MICROSEMI CORP | 1.575 V | 5.28 | 68 | Compliant | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | 1.2 V | 30 | 1.14 V | 70 °C | 无 | A3P250L-VQ100 | 350 MHz | TFQFP | SQUARE | Microsemi Corporation | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 68 | 不合格 | 1.5/3.3 V | COMMERCIAL | 4.5 kB | 3 mA | 68 | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 250000 | 781.25 MHz | 6144 | 6144 | 6144 | 1.26 V | 1.14 V | 250000 | 1 mm | 14 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PL68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Lead, Tin | 表面贴装 | YES | 68 | 68 | A1020B-PL68I | 40.5 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 8.18 | LCC | Compliant | 57 | 8542390000/8542390000/8542390000/8542390000/8542390000 | PLASTIC, LCC-68 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC68,1.0SQ | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | e0 | EAR99 | 锡铅 | 85 °C | -40 °C | MAX 57 I/OS | 现场可编程门阵列 | CMOS | 5 V | QUAD | J BEND | 225 | 1.27 mm | unknown | 48 MHz | S-PQCC-J68 | 69 | 不合格 | 5 V | INDUSTRIAL | 4.5 ns | 4.5 ns | 69 | 547 CLBS, 2000 GATES | 4.572 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 273 | 4.5 ns | 547 | 547 | 5.5 V | 4.5 V | 2000 | 24.2316 mm | 24.2316 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | APA600-FG256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | 微芯片技术 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.29 | 186 | Compliant | Tray | APA600 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -55 °C | 2.5 V | 30 | 2.3 V | 125 °C | 无 | APA600-FG256M | 180 MHz | -55°C ~ 125°C (TC) | ProASICPLUS | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 186 | 不合格 | 2.5,2.5/3.3 V | MILITARY | 15.8 kB | 186 | 600000 GATES | 1.8 mm | 现场可编程门阵列 | 129024 | 600000 | 180 MHz | 21504 | 21504 | 2.7 V | 2.3 V | 600000 | 1.2 mm | 17 mm | 17 mm | 无 | |||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PQG100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 8.59 | 69 | Compliant | QFP, QFP100,.7X.9 | FLATPACK | 3 | PLASTIC/EPOXY | QFP100,.7X.9 | 5 V | 40 | 4.75 V | 70 °C | 有 | A1020B-PQG100C | 45 MHz | QFP | RECTANGULAR | e3 | 哑光锡 | 70 °C | 0 °C | MAX 69 I/OS | 现场可编程门阵列 | CMOS | 5 V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | 48 MHz | R-PQFP-G100 | 69 | 不合格 | 5 V | COMMERCIAL | 4.5 ns | 4.5 ns | 69 | 547 CLBS, 2000 GATES | 3.4 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 273 | 4.5 ns | 547 | 547 | 5.25 V | 4.75 V | 2000 | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS600-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | MICROSEMI CORP | 1.575 V | 5.82 | 95 | Compliant | QFF, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AFS600-2PQG208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | e3 | 哑光锡 | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 1.47059 GHz | 2 | 13824 | 13824 | 1.575 V | 1.425 V | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-FGG896I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 896 | 400.011771 mg | Compliant | 516 | 85 °C | -40 °C | 1.5 V | 649 MHz | 20.3 kB | 990 ps | 990 ps | 12096 | 1e+06 | 649 MHz | 12096 | 12096 | 1.575 V | 1.425 V | 1.73 mm | 31 mm | 31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000-1PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 1.5 V | QFP208,1.2SQ,20 | PLASTIC/EPOXY | 3 | FLATPACK, FINE PITCH | FQFP, QFP208,1.2SQ,20 | 147 | Compliant | Tray | A3PE3000 | 活跃 | 5.6 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | FQFP | 350 MHz | A3PE3000-1PQG208 | 有 | 70 °C | 1.425 V | 40 | 0°C ~ 85°C (TJ) | ProASIC3E | e3 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | COMMERCIAL | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3e+06 | 272 MHz | 1 | 75264 | 75264 | 75264 | 1.575 V | 1.425 V | 3000000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||
![]() | A3P600L-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 208 | 208 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 7.65 | 154 | Compliant | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3P600L-1PQG208I | 350 MHz | FQFP | FLATPACK, FINE PITCH | FQFP, QFP208,1.2SQ,20 | e3 | 哑光锡 | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 13.5 kB | 5 mA | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 1.26 V | 1.14 V | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-TQG176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 176 | 147 | Compliant | 8542390000/8542390000/8542390000/8542390000/8542390000 | 70 °C | 0 °C | 2.5 V | 238 MHz | 1.2 ns | 1.2 ns | 2880 | 32000 | 238 MHz | 2880 | 1980 | 2.75 V | 2.25 V | 1.4 mm | 24 mm | 24 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-1FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | 60 | 1.14 V | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | N | Tray | M2GL090 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 无 | M2GL090T-1FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.76 | 有 | This product may require additional documentation to export from the United States. | 86316 | 267 I/O | + 100 C | 1.26 V | 0.538969 oz | - 40 C | -40°C ~ 100°C (TJ) | Tray | M2GL090T | 100 °C | -40 °C | 8542.39.00.01 | 可编程逻辑集成电路 | 1.2 V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 323.3 kB | 667 Mb/s | 267 | 2.44 mm | 现场可编程门阵列 | 86316 | SoC FPGA | 2648064 | 4 Transceiver | 86316 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010TS-VFG400 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | 195 | 活跃 | M2GL010 | Tray | 12084 LE | + 85 C | 1.2 V | 0 C | 1.2 V | SMD/SMT | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 12084 | 933888 | STD | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.59 | 147 | Compliant | Tray | A3PE3000 | 活跃 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3PE3000L-1PQG208I | FQFP | -40°C ~ 100°C (TJ) | ProASIC3L | e3 | 3A001.A.7.A | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 63 kB | 25 mA | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 1.26 V | 1.14 V | 3000000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||
![]() | AFS1500-FGG676 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 676-BGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | 1.425 V | 40 | 1.5 V | PLASTIC/EPOXY | 3 | 网格排列 | BGA, | 1.5000 V | 1.425 V | 1.575 V | 252 | Compliant | Tray | AFS1500 | 活跃 | 5.3 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | BGA | AFS1500-FGG676 | 有 | 85 °C | 0 to 70 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 250 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B676 | 不合格 | OTHER | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 276480 | 1.5e+06 | 1.0989 GHz | STD | 38400 | 38400 | 1.575 V | 1.425 V | 1500000 | 1.73 mm | 27 mm | 27 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||
![]() | APA600-CQ352B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 352 | 8542390000/8542390000/8542390000/8542390000/8542390000 | 248 | Compliant | 125 °C | -55 °C | 2.5 V | 15.8 kB | 600000 | 5 MHz | 21504 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600L-PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 208 | 208 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | 154 | Compliant | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3P600L-PQG208I | 350 MHz | FQFP | e3 | 哑光锡 | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 13.5 kB | 13.5 kB | 45 mA | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 6500 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 1.575 V | 1.425 V | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-VQG100T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | Automotive grade | 68 | Compliant | Tray | A3P250 | 活跃 | -40 °C | 1.5 V | 1.425 V | TQFP100,.63SQ | PLASTIC/EPOXY | 3 | FLATPACK, THIN PROFILE, FINE PITCH | TFQFP, TQFP100,.63SQ | 125 °C | 有 | A3P250-VQG100T | 350 MHz | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e3 | Matte Tin (Sn) | 125 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.5 V | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G100 | 68 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 4.5 kB | 3 mA | 68 | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 36864 | 250000 | 231 MHz | AEC-Q100 | STD | 6144 | 6144 | 6144 | 1.575 V | 1.425 V | 250000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | AFS600-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | QFF | RECTANGULAR | Actel Corporation | Transferred | ACTEL CORP | 1.575 V | 5.77 | 95 | Compliant | 0.5 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AFS600-1PQG208I | 350 MHz | e3 | 哑光锡 | 85 °C | -40 °C | 现场可编程门阵列 | CMOS | 1.5 V | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 95 | 不合格 | 1.5,3.3 V | INDUSTRIAL | 13.5 kB | 95 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 1.28205 GHz | 1 | 13824 | 13824 | 13824 | 1.575 V | 1.425 V | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | 40.5 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 8.76 | QFP | 69 | Compliant | PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | QFP100,.7X.9 | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | A1020B-PQ100I | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | MAX 69 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.65 mm | unknown | 48 MHz | R-PQFP-G100 | 69 | 不合格 | 5 V | INDUSTRIAL | 4.5 ns | 4.5 ns | 69 | 547 CLBS, 2000 GATES | 3.4 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 273 | 4.5 ns | 547 | 547 | 5.5 V | 4.5 V | 2000 | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PLG84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 84 | MICROSEMI CORP | 5.25 V | 5.79 | 8542390000/8542390000/8542390000/8542390000/8542390000 | 69 | Compliant | PLASTIC, MS-007-AE, LCC-84 | CHIP CARRIER | PLASTIC/EPOXY | 5 V | 未说明 | 4.75 V | 70 °C | 有 | A1020B-PLG84C | 45 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | 70 °C | 0 °C | MAX 69 I/OS | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 未说明 | 1.27 mm | unknown | 48 MHz | S-PQCC-J84 | 不合格 | COMMERCIAL | 4.5 ns | 547 CLBS, 2000 GATES | 4.45 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 273 | 4.5 ns | 547 | 5.25 V | 4.75 V | 2000 | 29.21 mm | 29.21 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 84 | 40.5 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | LCC | 69 | Compliant | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC84,1.2SQ | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | A1020B-PL84I | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | MAX 69 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | J BEND | 225 | 1.27 mm | unknown | 48 MHz | S-PQCC-J84 | 69 | 不合格 | 5 V | INDUSTRIAL | 4.5 ns | 4.5 ns | 69 | 547 CLBS, 2000 GATES | 4.572 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 273 | 4.5 ns | 547 | 547 | 5.5 V | 4.5 V | 2000 | 29.3116 mm | 29.3116 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PL84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | 84 | MICROSEMI CORP | 5.25 V | 8.76 | LCC | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC84,1.2SQ | 5 V | 30 | 4.75 V | 70 °C | 无 | A1020B-PL84C | 45 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | e0 | Tin/Lead (Sn/Pb) | MAX 69 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 225 | 1.27 mm | unknown | S-PQCC-J84 | 69 | 不合格 | 5 V | COMMERCIAL | 69 | 547 CLBS, 2000 GATES | 4.572 mm | 现场可编程门阵列 | 4.5 ns | 547 | 547 | 2000 | 29.3116 mm | 29.3116 mm |
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