N/A

-

YES

84

84

5.25 V

8.76

LCC

PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC84,1.2SQ

5 V

30

4.75 V

70 °C

无

A1020B-PL84C

45 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

e0

Tin/Lead (Sn/Pb)

MAX 69 I/OS

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

J BEND

225

1.27 mm

unknown

S-PQCC-J84

69

不合格

5 V

COMMERCIAL

69

547 CLBS, 2000 GATES

4.572 mm

现场可编程门阵列

4.5 ns

547

547

2000

29.3116 mm

29.3116 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

1206 (3216 Metric)

YES

144

1206

400.011771 mg

144

KOA Speer Electronics, Inc.

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.37

Tape & Reel (TR)

RS73F2BRT

活跃

8542390000/8542390000/8542390000/8542390000/8542390000

97

Compliant

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

40

1.14 V

70 °C

有

A3P600L-1FGG144

350 MHz

LBGA

-55°C ~ 155°C

RS73-RT

0.126 L x 0.063 W (3.20mm x 1.60mm)

±0.25%

e1

2

±25ppm/°C

360 Ohms

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

厚膜

0.333W, 1/3W

8542.39.00.01

现场可编程门阵列

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

-

1.5/3.3 V

COMMERCIAL

13.5 kB

5 mA

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

892.86 MHz

1

13824

13824

13824

1.26 V

1.14 V

600000

Automotive AEC-Q200

1.05 mm

0.028 (0.70mm)

13 mm

13 mm

无

AEC-Q200

N/A

-

表面贴装

YES

68

68

有

60 MHz

QCCJ

SQUARE

Obsolete

MICROSEMI CORP

5.25 V

5.8

HS35R40968557

CE

Hollowshaft

Hollow

Dynapar

有

57

PLASTIC, MS-007-AD, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

5 V

40

4.75 V

70 °C

-40 to 85 Degrees C

e3

10 Pin Connector

Matte Tin (Sn)

70 °C

0 °C

MAX 57 I/OS

8542.39.00.01

CMOS

5 V

QUAD

J BEND

245

1.27 mm

compliant

65 MHz

S-PQCC-J68

不合格

5 VDC

Differential

COMMERCIAL

3.4 ns

3.4 ns

547 CLBS, 2000 GATES

4.445 mm

现场可编程门阵列

547

2000

547

2

273

3.4 ns

547

5.25 V

4.75 V

2000

5~26 VDC

有

IP67

Included

24.13 mm

24.13 mm

无

N/A

-

表面贴装

YES

132

132

4.5 V

125 °C

无

150 MHz

GQFF

SQUARE

Obsolete

MICROSEMI CORP

5.5 V

5.85

BSPA200120N5P

CSA, UL

Bussmann

Wall

有

8542390000/8542390000/8542390000/8542390000/8542390000

100

HERMETIC SEALED, CERAMIC, QFP-132

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

TPAK132,2.5SQ,25

-55 °C

5 V

30

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

6250 PLD EQUIVALENT GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

FLAT

225

0.635 mm

not_compliant

150 MHz

S-CQFP-F132

100

不合格

5 V

MILITARY

2.6 ns

100

310 CLBS, 2500 GATES

2.9464 mm

现场可编程门阵列

310

2500

310

2.6 ns

310

310

5.5 V

4.5 V

2500

24.13 mm

24.13 mm

N/A

-

表面贴装

YES

100

不锈钢

100

70 °C

无

90 MHz

QFP

RECTANGULAR

Obsolete

MICROSEMI CORP

5.25 V

5.84

Straight

ADE4N0502SSNK3

Armored

Crouse-Hinds Industrial Products

电缆接线盒

无

83

PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

QFP100,.7X.9

5 V

30

4.75 V

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

Metallic

PLD EQUIVALENT GATES=6250

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

鸥翼

225

0.65 mm

unknown

120 MHz

R-PQFP-G100

83

不合格

5 V

COMMERCIAL

4.3 ns

83

451 CLBS, 2500 GATES

3.4 mm

现场可编程门阵列

451

2500

451

4.3 ns

451

451

5.25 V

4.75 V

2500

20 mm

14 mm

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

- 40 C

40

1.14 V

SMD/SMT

微芯片技术

Microchip

Microchip Technology / Atmel

IGLOO2

N

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

无

M2GL090-FG676I

BGA

SQUARE

活跃

5.25

MICROSEMI CORP

425

Tray

M2GL090

活跃

有

This product may require additional documentation to export from the United States.

86316

+ 100 C

1.26 V

-40°C ~ 100°C (TJ)

Tray

IGLOO2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

667 Mb/s

425

2.44 mm

现场可编程门阵列

86184

SoC FPGA

2648064

4 Transceiver

86316

FPGA - Field Programmable Gate Array

27 mm

27 mm

N/A

-

表面贴装

YES

172

172

Transferred

ACTEL CORP

5.25 V

5.87

8542390000/8542390000/8542390000/8542390000/8542390000

140

Non-Compliant

CERAMIC, CQFP-172

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK172,2.5SQ,25

5 V

30

4.75 V

70 °C

无

A1280A-1CQ172C

60 MHz

QFF

SQUARE

Actel Corporation

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

MAX 140 I/OS

现场可编程门阵列

CMOS

5 V

QUAD

FLAT

225

0.635 mm

compliant

90 MHz

S-CQFP-F172

140

不合格

5 V

COMMERCIAL

4.3 ns

140

1232 CLBS, 8000 GATES

2.9464 mm

现场可编程门阵列

1232

8000

1232

1

998

4.3 ns

1232

1232

5.25 V

4.75 V

8000

29.972 mm

29.972 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

QFP208,1.2SQ,20

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

0.50 MM PITCH, PLASTIC, QFP-208

158

Compliant

Tray

APA750

Obsolete

5.31

2.7 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

FQFP

180 MHz

APA750-PQ208

无

70 °C

2.3 V

30

2.5 V

0°C ~ 70°C (TA)

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

2.5 V

QUAD

鸥翼

225

0.5 mm

unknown

180 MHz

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

COMMERCIAL

18 kB

158

750000 GATES

4.1 mm

现场可编程门阵列

147456

750000

180 MHz

32768

32768

2.7 V

2.3 V

750000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

80-TQFP

YES

80

80-VQFP (14x14)

80

微芯片技术

48 MHz

A40MX04-1VQ80I

无

85 °C

3 V

30

3.3 V

69

Tray

A40MX04

Obsolete

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

QFP

5.25

3.6 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

TQFP

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G80

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2.3 ns

547

6000

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

有

119

IGLOO2

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

Tray

M2GL025

活跃

1.2 V

N

-40°C ~ 100°C (TJ)

Tray

M2GL025

1.2 V

27696

1130496

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

Tray

微芯片技术

M2GL025

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

无

M2GL025T-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

有

90

IGLOO2

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

Tray

M2GL090

微芯片技术

活跃

1.2 V

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

无

M2GL090T-FG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

400

400-VFBGA (17x17)

微芯片技术

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

100 °C

-40 °C

1.2 V

138 kB

27696

1130496

1

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

Tray

微芯片技术

M2GL010

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL010-1VFG400

有

85 °C

30

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE, FINE PITCH

LFBGA, BGA400,20X20,32

12084 LE

195 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

Details

This product may require additional documentation to export from the United States.

90

IGLOO2

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

12084

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

SMD/SMT

1.2 V

Tray

微芯片技术

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL025TS-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

有

60

IGLOO2

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

1.2 V

Tray

微芯片技术

M2GL090

活跃

MICROSEMI CORP

5.27

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

无

M2GL090-1FG676

BGA

SQUARE

活跃

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

86316

27 mm

27 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

119

有

SMD/SMT

+ 85 C

0 C

1.2 V

138 I/O

27696 LE

N

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL025

活跃

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

2 Transceiver

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

1.2 V

Tray

微芯片技术

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

85 °C

无

M2GL025TS-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

N

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

1.2 V

Tray

微芯片技术

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL025TS-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

有

60

IGLOO2

SMD/SMT

+ 85 C

0 C

1.2 V

267 I/O

27696 LE

Details

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

活跃

1.2 V

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

有

M2GL060TS-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL060

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

1.51 mm

现场可编程门阵列

56520

1869824

1

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

M2GL025

微芯片技术

Tray

活跃

5.27

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL025T-1VF256

无

85 °C

20

1.2 V

PLASTIC/EPOXY

GRID ARRAY, LOW PROFILE, FINE PITCH

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL025T

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP-100

100

100-VQFP (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

90

ProASIC3

8542310000

68

Tray

A3P250

活跃

-55°C ~ 125°C (TJ)

Tray

A3P250

125 °C

-55 °C

1.5 V

272 MHz

4.5 kB

36864

250000

1.575 V

1.425 V

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

60

IGLOO2

1.2000 V

1.14 V

微芯片技术

1.26 V

1.2 V

Tray

M2GL025

活跃

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

有

M2GL025TS-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

-40 to 100 °C

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

STD

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

IGLOO2

1.2 V

Tray

微芯片技术

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

85 °C

有

M2GL025T-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

Details

27696 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

0°C ~ 85°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

STD

2 Transceiver

27696