N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

1.14 V

有

M2GL150TS-1FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

625 kB

3.15 mm

现场可编程门阵列

146124

5120000

240

100 °C

3.45 V

1.14 V

3.15 mm

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

85 °C

未说明

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

GRID ARRAY, LOW PROFILE, FINE PITCH

LFBGA, BGA400,20X20,32

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

活跃

MICROSEMI CORP

5.27

BGA

SQUARE

LFBGA

M2GL025-VF400

无

0°C ~ 85°C (TJ)

Tray

M2GL025

无

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

STD

27696

1.26 V

1.14 V

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

无

M2GL025TS-1VF400I

LFBGA

SQUARE

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

100 °C

-40 °C

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

6060 LE

171 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL005

活跃

1.26 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL005-VF400

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

128 kB

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

400 MHz

11

STD

6060

17 mm

17 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152

1152-FCBGA (35x35)

1152

微芯片技术

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

有

24

IGLOO2

1.2000 V

1.14 V

1.26 V

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

1.14 V

85 °C

有

M2GL150-FCG1152

BGA

SQUARE

0 to 85 °C

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

146124

35 mm

35 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

20

85 °C

无

M2GL090TS-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

1.2 V

323.3 kB

86316

2648064

STD

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL010TS-FG484

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

23 X 23 MM, 1 MM PITCH, FBGA-484

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

M2GL060

活跃

This product may require additional documentation to export from the United States.

N

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

5.61

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

147

Compliant

Tray

A3PE1500

Obsolete

1.425 V

A3PE1500-2PQ208I

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

-40°C ~ 100°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1.5e+06

310 MHz

2

38400

38400

38400

1.575 V

1.425 V

1500000

3.4 mm

28 mm

28 mm

无

含铅

N/A

-

表面贴装

YES

176

176

LFQFP,

5.31

320 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

40

128

Compliant

3 V

A54SX08-2TQG176I

有

Obsolete

MICROSEMI CORP

e3

哑光锡

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

5 V

QUAD

鸥翼

260

0.5 mm

compliant

320 MHz

S-PQFP-G176

不合格

INDUSTRIAL

700 ps

700 ps

768 CLBS, 8000 GATES

1.6 mm

现场可编程门阵列

768

12000

320 MHz

768

2

256

0.7 ns

768

5.5 V

4.5 V

8000

1.4 mm

24 mm

24 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.2 V

30

147

Compliant

Tray

A3PE3000L

Obsolete

1.14 V

A3PE3000L-1PQ208

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.61

250 MHz

0°C ~ 85°C (TJ)

ProASIC3L

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

1.2 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.2/1.5,1.2/3.3 V

COMMERCIAL

63 kB

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3e+06

892.86 MHz

1

75264

75264

75264

1.26 V

1.14 V

3000000

3.4 mm

28 mm

28 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

160-BQFP

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

-40 °C

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

3.6 V

3.3 V

30

125

Compliant

Tray

A42MX24

Obsolete

3 V

A42MX24-3PQ160I

无

Obsolete

MICROSEMI CORP

QFP

QFP,

5.25

3

85 °C

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G160

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

YES

176

176

Obsolete

MICROSEMI CORP

QFP

LFQFP, QFP176,1.0SQ,20

5.23

108 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A42MX16-1TQ176I

无

e0

锡铅

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

140

不合格

3.3,3.3/5,5 V

INDUSTRIAL

140

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

2.4 ns

1232

1232

24000

24 mm

24 mm

N/A

-

YES

176

176

Obsolete

MICROSEMI CORP

QFP

1.40 MM HEIGHT, PLASTIC, TQFP-176

5.25

114.75 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A42MX24-2TQ176I

无

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G176

150

不合格

3.3,3.3/5,5 V

INDUSTRIAL

150

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

1.8 ns

1890

1866

36000

24 mm

24 mm

N/A

-

表面贴装

144-LQFP

YES

144

144-TQFP (20x20)

144

微芯片技术

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

30

SX-A

85C

INDUSTRIALC

TQFP

48000

-40C to 85C

113

32000

2880

0.25um

2.75(V)

2.5(V)

无

2.25(V)

-40C

有

1800

1980

表面贴装

113

Tray

A54SX32A

Obsolete

2.25 V

A54SX32A-TQ144I

无

Obsolete

MICROSEMI CORP

1.40 MM, TQFP-144

5.18

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

-40°C ~ 85°C (TA)

Tray

SX-A

e0

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

238(MHz)

S-PQFP-G144

不合格

INDUSTRIAL

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.2 ns

2880

48000

20 mm

20 mm

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

105 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

Compliant

176

Tray

A42MX24

Obsolete

3 V

A42MX24-2PQ208

无

Obsolete

MICROSEMI CORP

QFP

FQFP,

5.25

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

5.25 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

129 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

140

Compliant

Obsolete

A42MX16

Tray

3 V

A42MX16-3PQ208

无

Obsolete

MICROSEMI CORP

QFP

FQFP,

5.24

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

5.25 V

3 V

24000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

YES

144

1.319103 g

144

280 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

40

113

Compliant

3 V

A54SX08-1TQG144I

有

Obsolete

MICROSEMI CORP

LFQFP,

5.31

e3

哑光锡

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

5 V

QUAD

鸥翼

260

0.5 mm

compliant

280 MHz

S-PQFP-G144

不合格

INDUSTRIAL

800 ps

800 ps

768 CLBS, 8000 GATES

1.6 mm

现场可编程门阵列

768

12000

280 MHz

768

1

256

0.8 ns

768

5.5 V

4.5 V

8000

1.4 mm

20 mm

20 mm

无

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

FQFP

PLASTIC/EPOXY

-40 °C

85 °C

3

105.57 MHz

5.23

PLASTIC, QFP-208

QFP

MICROSEMI CORP

Obsolete

无

A42MX24-1PQ208I

Compliant

176

Tray

A42MX24

Obsolete

3 V

30

3.3 V

3.6 V

FLATPACK, FINE PITCH

SQUARE

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1

1410

2.1 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

YES

176

176

Obsolete

MICROSEMI CORP

QFP

LFQFP, QFP176,1.0SQ,20

5.23

108 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A42MX16-1TQ176M

无

e0

3A001.A.2.C

锡铅

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

140

不合格

3.3,3.3/5,5 V

MILITARY

140

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

2.4 ns

1232

1232

24000

24 mm

24 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44

44-PLCC (16.59x16.59)

44

微芯片技术

MICROSEMI CORP

LCC

QCCJ,

5.23

48 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

34

Tray

A40MX04

Obsolete

3 V

A40MX04-1PL44I

无

Obsolete

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J44

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

16.5862 mm

16.5862 mm

N/A

-

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

84

微芯片技术

MICROSEMI CORP

LCC

QCCJ,

5.23

48 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

69

Tray

A40MX04

Obsolete

3 V

A40MX04-1PL84I

无

Obsolete

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

29.3116 mm

29.3116 mm

N/A

-

表面贴装

80-TQFP

YES

80

80-VQFP (14x14)

80

微芯片技术

MICROSEMI CORP

QFP

TQFP,

5.26

101 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

3.6 V

3.3 V

30

69

Tray

A40MX04

Obsolete

3 V

A40MX04-2VQ80I

无

Obsolete

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G80

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2 ns

547

6000

14 mm

14 mm

N/A

-

表面贴装

YES

240

240

A42MX36-PQ240I

无

Obsolete

MICROSEMI CORP

QFP

PLASTIC, QFP-240

5.79

73 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

202

Compliant

3 V

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G240

202

不合格

3.3,3.3/5,5 V

INDUSTRIAL

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

131 MHz

1184

1822

2.7 ns

2438

2414

5.5 V

3 V

54000

3.4 mm

32.1 mm

32.1 mm

无