对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

尺寸/尺寸

容差

JESD-609代码

零件状态

终止次数

ECCN 代码

温度系数

电阻

端子表面处理

最高工作温度

最小工作温度

组成

功率(瓦特)

附加功能

HTS代码

子类别

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

失败率

电源

温度等级

最大电源电压

最小电源电压

内存大小

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

LABs数量/ CLBs数量

筛选水平

逻辑块数(LABs)

速度等级

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

等效门数

特征

高度

座位高度(最大)

长度

宽度

辐射硬化

评级结果

A42MX09-FTQ176
A42MX09-FTQ176
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

176

A42MX09-FTQ176

Obsolete

MICROSEMI CORP

QFP

LFQFP, QFP176,1.0SQ,20

5.23

70 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

e0

锡铅

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

176

S-PQFP-G176

104

不合格

3.3,3.3/5,5 V

COMMERCIAL

104

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

3.5 ns

684

684

14000

24 mm

24 mm

A40MX04-PL84I
A40MX04-PL84I
Microchip 数据表

41 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

微芯片技术

3.3 V

3.6 V

CHIP CARRIER

SQUARE

QCCJ

PLASTIC/EPOXY

-40 °C

85 °C

3

80 MHz

5.23

QCCJ,

LCC

MICROSEMI CORP

Obsolete

A40MX04-PL84I

30

69

Tray

A40MX04

Obsolete

3 V

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.7 ns

547

6000

29.3116 mm

29.3116 mm

A54SX08-PQ208
A54SX08-PQ208
Microchip 数据表

963 In Stock

-

最小起订量: 1

最小包装量: 1

YES

208

FLATPACK

A54SX08-PQ208

活跃

MICROSEMI CORP

5.84

240 MHz

70 °C

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G208

130

不合格

3.3,5 V

COMMERCIAL

130

现场可编程门阵列

768

A42MX36-CQ256
A42MX36-CQ256
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-BFCQFP with Tie Bar

YES

256

256-CQFP (75x75)

256

微芯片技术

QFP

CERAMIC, QFP-256

5.18

73 MHz

70 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

FLATPACK, GUARD RING

3.6 V

3.3 V

8542390000/8542390000/8542390000/8542390000/8542390000

202

Compliant

Tray

A42MX36

活跃

3 V

A42MX36-CQ256

活跃

MICROSEMI CORP

0°C ~ 70°C (TA)

MX

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

FLAT

0.5 mm

compliant

256

S-CQFP-F256

不合格

3.3 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

STD

1822

2.7 ns

2438

54000

36 mm

36 mm

APA075-TQG144
APA075-TQG144
Microchip 数据表

2266 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

Tray

APA075

活跃

2.3 V

FLATPACK, LOW PROFILE, FINE PITCH

SQUARE

QFP144,.87SQ,20

LFQFP

PLASTIC/EPOXY

70 °C

3

180 MHz

1.59

LFQFP, QFP144,.87SQ,20

MICROSEMI CORP

活跃

APA075-TQG144

40

2.5 V

2.7 V

2.5000 V

2.3 V

2.7 V

107

0 to 70 °C

ProASICPLUS

e3

Matte Tin (Sn)

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

107

不合格

2.5,2.5/3.3 V

COMMERCIAL

107

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

STD

3072

75000

20 mm

20 mm

A40MX02-PL68I
A40MX02-PL68I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

68-LCC (J-Lead)

YES

68-PLCC (24.23x24.23)

68

LCC

QCCJ,

5.23

80 MHz

3

85 °C

-40 °C

微芯片技术

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

40MX

85C

Industrial

PLCC

3000

-40C to 85C

57

3000

295

0.45UM

5.5(V)

3.3/5(V)

3(V)

-40C

295

147

表面贴装

57

Tray

A40MX02

Obsolete

3 V

A40MX02-PL68I

Obsolete

MICROSEMI CORP

-40°C ~ 85°C (TA)

Box

MX

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

83/139(MHz)

68

S-PQCC-J68

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.7 ns

295

3000

24.2316 mm

24.2316 mm

A42MX24-2PL84
A42MX24-2PL84
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

LCC

QCCJ,

5.25

105 MHz

3

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

72

Compliant

Tray

A42MX24

Obsolete

3 V

A42MX24-2PL84

Obsolete

MICROSEMI CORP

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

3.68 mm

29.3116 mm

29.3116 mm

A42MX09-1PL84
A42MX09-1PL84
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

微芯片技术

A42MX09-1PL84

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.23

135 MHz

3

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

72

Tray

A42MX09

Obsolete

3 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

COMMERCIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

2.1 ns

684

14000

29.3116 mm

29.3116 mm

A3P125-1PQ208
A3P125-1PQ208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

A3P125-1PQ208

Obsolete

MICROSEMI CORP

FQFP,

5.26

350 MHz

3

85 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

133

Tray

A3P125

Obsolete

1.425 V

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

3072

125000

28 mm

28 mm

A40MX04-VQ80A
A40MX04-VQ80A
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

80-TQFP

YES

80-VQFP (14x14)

80

微芯片技术

A40MX04-VQ80A

Obsolete

MICROSEMI CORP

QFP

TQFP,

5.53

116 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

5.25 V

4.75 V

5 V

30

69

Tray

A40MX04

Obsolete

-40°C ~ 125°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 3V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

80

S-PQFP-G80

不合格

AUTOMOTIVE

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2.2 ns

547

6000

14 mm

14 mm

A40MX04-3PL44
A40MX04-3PL44
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

微芯片技术

A40MX04-3PL44

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.24

109 MHz

3

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

34

Tray

A40MX04

Obsolete

3 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

44

S-PQCC-J44

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

1.7 ns

547

6000

16.5862 mm

16.5862 mm

A42MX24-PQ160
A42MX24-PQ160
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

160-BQFP

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

QFP

PLASTIC, QFP-160

5.23

84 MHz

3

70 °C

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

3.6 V

3.3 V

30

125

Compliant

Tray

A42MX24

Obsolete

3 V

A42MX24-PQ160

Obsolete

MICROSEMI CORP

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

160

S-PQFP-G160

不合格

5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1410

2.5 ns

1890

36000

3.4 mm

28 mm

28 mm

A40MX02-3VQ80
A40MX02-3VQ80
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

80-TQFP

YES

80-VQFP (14x14)

80

微芯片技术

A40MX02-3VQ80

Obsolete

MICROSEMI CORP

QFP

TQFP,

5.26

109 MHz

3

70 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

3.6 V

3.3 V

30

57

Tray

A40MX02

Obsolete

3 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

80

S-PQFP-G80

不合格

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

1.7 ns

295

3000

14 mm

14 mm

A42MX09-3PL84
A42MX09-3PL84
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

微芯片技术

A42MX09-3PL84

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.24

161 MHz

3

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

72

Tray

A42MX09

Obsolete

3 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

COMMERCIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

1.6 ns

684

14000

29.3116 mm

29.3116 mm

A3P060-2TQ144
A3P060-2TQ144
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

A3P060-2TQ144

Obsolete

MICROSEMI CORP

LFQFP,

5.25

350 MHz

3

85 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.575 V

1.5 V

30

91

Tray

A3P060

Obsolete

1.425 V

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

COMMERCIAL

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

18432

60000

1536

60000

20 mm

20 mm

A54SX32A-1TQG176I
A54SX32A-1TQG176I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

176

A54SX32A-1TQG176I

Obsolete

MICROSEMI CORP

LFQFP, QFP176,1.0SQ,20

5.8

278 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

40

2.25 V

e3

哑光锡

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

2.5,2.5/5 V

INDUSTRIAL

147

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

1.1 ns

2880

2880

48000

24 mm

24 mm

A54SX16P-1VQG100I
A54SX16P-1VQG100I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

A54SX16P-1VQG100I

活跃

MICROSEMI CORP

TFQFP, TQFP100,.63SQ

5.24

280 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

3.3 V

40

81

Tray

A54SX16

活跃

3 V

-40°C ~ 85°C (TA)

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

INDUSTRIAL

81

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

1

0.8 ns

1452

1452

16000

14 mm

14 mm

A42MX16-1PQG208I
A42MX16-1PQG208I
Microchip 数据表

2009 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

Tray

A42MX16

活跃

3 V

A42MX16-1PQG208I

活跃

MICROSEMI CORP

FQFP,

5.28

108 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

40

3.3, 5 V

3 V

5.5 V

140

-40 to 85 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

1

2.4 ns

1232

24000

28 mm

28 mm

A54SX32A-1PQ208M
A54SX32A-1PQ208M
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1210 (3225 Metric)

YES

1210

208

KOA Speer Electronics, Inc.

2.75 V

5.25

Tape & Reel (TR)

活跃

174

A54SX32A

PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

2.5 V

30

2.25 V

125 °C

A54SX32A-1PQ208M

278 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

-55°C ~ 155°C

SG73S-RT

0.126 L x 0.102 W (3.20mm x 2.60mm)

±1%

e0

2

3A001.A.2.C

±200ppm/°C

154 Ohms

Tin/Lead (Sn/Pb)

厚膜

1W

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

174

不合格

-

2.5,3.3/5 V

MILITARY

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding

0.028 (0.70mm)

28 mm

28 mm

-

A42MX16-1VQ100I
A42MX16-1VQ100I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

Axial

YES

Axial

100

微芯片技术

5.24

QFP

83

Tray

A42MX16

Obsolete

1 MM HEIGHT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

A42MX16-1VQ100I

108 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

-65°C ~ 175°C

Bulk

Military, MIL-R-10509/1, RN60

0.145 Dia x 0.344 L (3.68mm x 8.74mm)

±0.1%

活跃

2

±50ppm/°C

221 kOhms

Metal Film

0.25W, 1/4W

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

240

0.5 mm

compliant

100

S-PQFP-G100

不合格

--

INDUSTRIAL

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2.4 ns

1232

1232

24000

Flame Retardant Coating, Military, Moisture Resistant, Safety

--

14 mm

14 mm

AGL125V2-FGG144T
AGL125V2-FGG144T
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

144

97

Compliant

3

30

AGL125V2-FGG144T

Microsemi Corporation

活跃

MICROSEMI CORP

5.76

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

260

compliant

4.5 kB

现场可编程门阵列

3072

125000

AGLN010V2-QNG48I
AGLN010V2-QNG48I
Microchip 数据表

60 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

微芯片技术

34

Tray

AGLN010

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-40 °C

1.2 V

未说明

1.14 V

85 °C

AGLN010V2-QNG48I

HVQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.58

-40°C ~ 100°C (TJ)

Each

IGLOO nano

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N48

不合格

INDUSTRIAL

260 CLBS, 10000 GATES

1 mm

现场可编程门阵列

260

10000

STD

260

10000

6 mm

6 mm

A54SX16A-FFGG144
A54SX16A-FFGG144
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

144

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

40

2.25 V

70 °C

A54SX16A-FFGG144

167 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.27

e1

锡银铜

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

COMMERCIAL

111

1452 CLBS, 24000 GATES

1.55 mm

现场可编程门阵列

1.9 ns

1452

1452

24000

13 mm

13 mm

A3P1000-1FG256T
A3P1000-1FG256T
Microchip 数据表

2774 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

MICROSEMI CORP

1.575 V

5.22

Automotive grade

177

Tray

A3P1000

活跃

1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.5 V

20

1.425 V

125 °C

A3P1000-1FG256T

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e0

3A001.A.7.A

锡铅银

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

AUTOMOTIVE

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

AEC-Q100

1

24576

24576

1000000

17 mm

17 mm

A42MX24-1PQ160I
A42MX24-1PQ160I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

160-BQFP

YES

160-PQFP (28x28)

160

微芯片技术

5.23

QFP

125

Tray

A42MX24

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

A42MX24-1PQ160I

105.57 MHz

QFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

160

S-PQFP-G160

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

36000

2.1 ns

1890

36000

28 mm

28 mm