对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

触点镀层

底架

安装类型

包装/外壳

表面安装

引脚数

触点形状

供应商器件包装

材料

房屋材料

质量

本体材质

终端数量

PCB安装方向

PCB安装固定

PCB安装对准

厂商

操作温度

包装

系列

容差

JESD-609代码

终止次数

终端

ECCN 代码

温度系数

连接器类型

电阻

定位的数量

端子表面处理

最高工作温度

最小工作温度

组成

行数

性别

附加功能

HTS代码

紧固类型

子类别

额定功率

螺距

最大功率耗散

技术

电压 - 供电

端子位置

方向

终端形式

峰值回流焊温度(摄氏度)

端子间距

深度

Reach合规守则

额定电流

频率

军用标准

JESD-30代码

输出的数量

资历状况

接头数量

触点性别

输出电压

房屋颜色

电源

触点样式

温度等级

弱电

镀层

内存大小

传播延迟

接通延迟时间

电流源

数据率

输入数量

组织结构

配套固定装置

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

产品类别

总 RAM 位数

阀门数量

最高频率

逻辑块数(LABs)

速度等级

收发器数量

预载

外径

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

电压 - 供电 (最大值)

电压 - 供电 (最小值)

可充电性

等效门数

特征

化工技术

产品类别

直径

高度

长度

宽度

辐射硬化

达到SVHC

无铅

评级结果

AFS600-1FGG484I
AFS600-1FGG484I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

Compliant

Tray

AFS600

活跃

3MRT2N-316

Parker

1.575 V

1.425 V

1.5000 V

172

-40 to 85 °C

Fusion®

85 °C

-40 °C

1.5 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

A3PE3000L-FG324I
A3PE3000L-FG324I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

324-BGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324

网格排列

微芯片技术

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.2 V

30

1.14 V

85 °C

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

1.2000 V

1.14 V

1.26 V

023708617

Entrelec

221

Tray

A3PE3000

活跃

Compliant

-40 to 85 °C

ProASIC3L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.2/1.5,1.2/3.3 V

INDUSTRIAL

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

1.26 V

1.14 V

3000000

1.25 mm

19 mm

19 mm

A3P030-VQG100I
A3P030-VQG100I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

Honeywell-Microswitch

1.5000 V

1.425 V

1.575 V

330 LE

77 I/O

+ 100 C

1.575 V

- 40 C

90

1.425 V

微芯片技术

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

Tray

A3P030

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

A3P030-VQG100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.36

-40 to 85 °C

Tray

A3P030

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

15 mA

-

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

30000

STD

-

768

30000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

M1AFS1500-1FGG676I
M1AFS1500-1FGG676I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

676-BGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

Compliant

Tray

M1AFS1500

活跃

VH7441RT+3008D

Johnson Controls

1.5000 V

1.425 V

1.575 V

252

-40 to 85 °C

Fusion®

85 °C

-40 °C

1.5 V

33.8 kB

276480

1.5e+06

1.28205 GHz

1

38400

1.575 V

1.425 V

1.73 mm

27 mm

27 mm

M2GL010-TQG144I
M2GL010-TQG144I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

SMD/SMT

PLASTIC/EPOXY

3

微芯片技术

FLATPACK, LOW PROFILE, FINE PITCH

LFQFP,

1.2 V

30

M2GL010-TQG144I

LFQFP

SQUARE

Microsemi Corporation

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

5.57

84

Tray

M2GL010

活跃

12084 LE

+ 100 C

1.26 V

- 40 C

1.14 V

-40°C ~ 100°C (TJ)

IGLOO2

e3

Matte Tin (Sn)

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

-

1.6 mm

现场可编程门阵列

12084

933888

STD

-

20 mm

20 mm

A54SX08-2PL84I
A54SX08-2PL84I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

YES

84

6.777889 g

84

5.27

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

69

Compliant

QCCJ,

A54SX08-2PL84I

320 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

5 V

QUAD

J BEND

225

1.27 mm

compliant

320 MHz

S-PQCC-J84

不合格

INDUSTRIAL

700 ps

700 ps

768 CLBS, 8000 GATES

4.572 mm

现场可编程门阵列

768

12000

320 MHz

768

2

256

0.7 ns

768

5.5 V

4.5 V

8000

3.68 mm

29.31 mm

29.31 mm

A54SX08-2VQ100I
A54SX08-2VQ100I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

YES

100

100

TFQFP

320 MHz

A54SX08-2VQ100I

85 °C

3 V

30

3.3 V

-40 °C

81

Compliant

1 MM HEIGHT, MO-136, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.28

SQUARE

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

225

0.5 mm

compliant

320 MHz

S-PQFP-G100

不合格

INDUSTRIAL

700 ps

700 ps

768 CLBS, 8000 GATES

1.2 mm

现场可编程门阵列

768

12000

320 MHz

768

2

256

0.7 ns

768

5.5 V

4.5 V

8000

1 mm

14 mm

14 mm

A3P125-2VQG100
A3P125-2VQG100
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

1500 LE

36864 bit

71 I/O

+ 85 C

1.575 V

0.257182 oz

0 C

90

1.425 V

SMD/SMT

Microchip

微芯片技术

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

Tray

A3P125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.37

3

PLASTIC/EPOXY

1.5 V

40

85 °C

A3P125-2VQG100

0°C ~ 85°C (TJ)

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

2 mA

-

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

125000

2

-

3072

125000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

A54SX08-2PLG84
A54SX08-2PLG84
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

YES

84

6.777889 g

84

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.27

69

Compliant

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

3 V

70 °C

A54SX08-2PLG84

320 MHz

e3

哑光锡

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

5 V

QUAD

J BEND

245

1.27 mm

compliant

320 MHz

S-PQCC-J84

不合格

COMMERCIAL

700 ps

700 ps

768 CLBS, 8000 GATES

4.572 mm

现场可编程门阵列

768

12000

320 MHz

768

2

256

0.7 ns

768

5.25 V

4.75 V

8000

3.68 mm

29.31 mm

29.31 mm

M2GL025-FCSG325I
M2GL025-FCSG325I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

+ 100 C

1.26 V

0.740878 oz

- 40 C

176

1.14 V

SMD/SMT

Microchip

Microchip Technology / Atmel

微芯片技术

IGLOO2

Details

Tray

M2GL025

活跃

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

M2GL025-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

27696 LE

180 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL025

8542.39.00.01

可编程逻辑集成电路

CMOS

1.2 V

BOTTOM

BALL

260

compliant

S-PBGA-B325

180

不合格

1.2 V

667 Mb/s

180

现场可编程门阵列

27696

SoC FPGA

1130496

STD

2 Transceiver

27696

FPGA - Field Programmable Gate Array

A3PE3000L-FGG896I
A3PE3000L-FGG896I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

3

PLASTIC/EPOXY

微芯片技术

BGA896,30X30,40

-40 °C

1.2 V

40

1.14 V

85 °C

A3PE3000L-FGG896I

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.29

1.2000 V

1.14 V

1.26 V

620

Compliant

Tray

A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

-40 to 85 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.2 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.2/1.5,1.2/3.3 V

INDUSTRIAL

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3e+06

781.25 MHz

STD

75264

75264

75264

1.26 V

1.14 V

3000000

1.73 mm

31 mm

31 mm

A3P1000-PQG208
A3P1000-PQG208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

1.5000 V

1.425 V

1.575 V

154

Tray

A3P1000

活跃

11000 LE

147456 bit

+ 85 C

1.575 V

微芯片技术

2 oz

0 C

24

1.425 V

SMD/SMT

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

A3P1000-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

0.74

0 to 70 °C

Tray

ProASIC3

e3

3A991.D

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

8 mA

-

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

147456

1000000

STD

-

24576

1000000

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

MPF200T-FCG484I
MPF200T-FCG484I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

MPF200

活跃

This product may require additional documentation to export from the United States.

192000 LE

284 I/O

+ 100 C

1.08 V

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

-40°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

MPF200TS-1FCSG325I
MPF200TS-1FCSG325I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

325-LFBGA, FC

YES

325-FCBGA (11x14.5)

325

微芯片技术

未说明

100 °C

MPF200TS-1FCSG325I

LFBGA

RECTANGULAR

Microsemi Corporation

活跃

MICROSEMI CORP

5.8

170

Tray

MPF200

活跃

1.03 V/1.08 V

970 mV/1.02 V

SMD/SMT

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1 V

-40°C ~ 100°C (TJ)

PolarFire™

CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL

0.97V ~ 1.08V

BOTTOM

BALL

未说明

0.5 mm

compliant

R-PBGA-B325

INDUSTRIAL

1.45 mm

现场可编程门阵列

192000

13619200

14.5 mm

11 mm

MPF300TS-FCVG484I
MPF300TS-FCVG484I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

Tray

MPF300

活跃

Details

PolarFire

Microchip Technology / Atmel

Microchip

SMD/SMT

0.97 V

1

- 40 C

1.08 V

+ 100 C

284 I/O

20.6 Mbit

300000 LE

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

4 Transceiver

FPGA - Field Programmable Gate Array

MPF200T-FCVG484E
MPF200T-FCVG484E
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

MPF200

活跃

This product may require additional documentation to export from the United States.

192000 LE

284 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

0°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

MPF100TL-FCSG325I
MPF100TL-FCSG325I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Gold

Flanges, Panel, Wall

表面贴装

BGA-325

325-FCBGA (11x11)

Aluminium

微芯片技术

Tray

MPF100

活跃

Copper

Compliant

This product may require additional documentation to export from the United States.

109000 LE

170 I/O

7.6 Mbit

+ 100 C

1.03 V/1.08 V

- 40 C

1

970 mV/1.02 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

-40°C ~ 100°C (TJ)

Bulk

MPF100TL

Crimp

Circular, Receptacle

26

200 °C

-65 °C

Receptacle

Bayonet

可编程逻辑集成电路

1 V, 1.05 V

Straight

30.96 mm

7.5 A

MIL-DTL-38999

26

Female

Socket

Cadmium

12.7 Gb/s

109000

FPGA - Field Programmable Gate Array

7782400

4 Transceiver

FPGA - Field Programmable Gate Array

23.54 mm

无SVHC

抗环境干扰

MPF300TLS-FCG1152I
MPF300TLS-FCG1152I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Lead, Tin

通孔

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

Compliant

512

Tray

MPF300

活跃

300000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

Bulk

PolarFire™

1 %

2

50 ppm/°C

3.7 kΩ

175 °C

-65 °C

Metal Film

125 mW

125 mW

0.97V ~ 1.08V

MIL-PRF-55182

12.7 Gb/s

300000

21094400

Military, Moisture Resistant, Weldable

2.39 mm

6.35 mm

2.39 mm

含铅

MPF300TS-FCG1152I
MPF300TS-FCG1152I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

Details

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

512 I/O

+ 100 C

1.08 V

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

16 Transceiver

FPGA - Field Programmable Gate Array

MPF500T-FCG784I
MPF500T-FCG784I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Details

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

481000 LE

388 I/O

+ 100 C

1.08 V

3.492228 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

-40°C ~ 100°C (TJ)

Tray

MPF500T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

481000

FPGA - Field Programmable Gate Array

33792000

16 Transceiver

FPGA - Field Programmable Gate Array

MPF500TS-FCG1152I
MPF500TS-FCG1152I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-1152

3

1152-FCBGA (35x35)

Lithium

2.8 g

微芯片技术

Tray

MPF500

活跃

Compliant

3 V

This product may require additional documentation to export from the United States.

481000 LE

584 I/O

+ 100 C

1.08 V

2.562565 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

-40°C ~ 100°C (TJ)

Tray

MPF500TS

通孔

可编程逻辑集成电路

1 V, 1.05 V

Horizontal

3 V

12.5 Gb/s

481000

FPGA - Field Programmable Gate Array

33792000

24 Transceiver

20 mm

Non-Rechargeable

Lithium

FPGA - Field Programmable Gate Array

20 mm

3.2 mm

20.2 mm

无铅

MPF100T-FCSG325E
MPF100T-FCSG325E
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Lead, Tin

通孔

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

PolarFire

Tray

MPF100

活跃

Compliant

-

This product may require additional documentation to export from the United States.

109000 LE

170 I/O

7.6 Mbit

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

0°C ~ 100°C (TJ)

Bulk

MPF100T

0.5 %

2

50 ppm/°C

7.41 kΩ

175 °C

-65 °C

Metal Film

可编程逻辑集成电路

100 mW

100 mW

1 V, 1.05 V

MIL-PRF-55182

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7600Kbit

4 Transceiver

Military, Moisture Resistant, Weldable

FPGA - Field Programmable Gate Array

1.78 mm

3.81 mm

1.78 mm

含铅

MPF200T-FCSG325E
MPF200T-FCSG325E
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

MPF200

活跃

This product may require additional documentation to export from the United States.

192000 LE

170 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

0°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

M2GL090-1FGG484
M2GL090-1FGG484
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 10 months ago)

Gold, Lead, Tin

通孔

表面贴装

484-BGA

YES

15

Round

484-FPBGA (23x23)

Aluminium

484

Vertical

Without

Without

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

M2GL090-1FGG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.3

2.29 mm

Non-Compliant

Brass

267

Tray

M2GL090

活跃

86184 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

BGA, BGA484,22X22,40

0°C ~ 85°C (TJ)

Bulk

IGLOO2

Solder

Male Pin, Pin, Plug

15

200 °C

-200 °C

1

8542.39.00.01

现场可编程门阵列

635 µm

1.2 V

BOTTOM

Vertical

BALL

260

1 mm

7.11 mm

compliant

S-PBGA-B484

267

不合格

15

Natural

1.2 V

Pin

OTHER

Non-Compliant

323.3 kB

267

With

2.44 mm

现场可编程门阵列

86316

2648064

86316

1.26 V

1.14 V

7.5184 mm

14.1859 mm

23 mm

含铅

APA1000-FG1152I
APA1000-FG1152I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

1152-BGA

YES

1152

1152-FPBGA (35x35)

400.011771 mg

1152

微芯片技术

2.3 V

85 °C

APA1000-FG1152I

180 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.7 V

5.26

712

Compliant

Tray

APA1000

活跃

BGA, BGA1152,34X34,40

网格排列

3

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

2.5 V

20

-40°C ~ 85°C (TA)

ProASICPLUS

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

unknown

180 MHz

S-PBGA-B1152

712

不合格

2.5,2.5/3.3 V

INDUSTRIAL

24.8 kB

712

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1e+06

180 MHz

56320

56320

2.7 V

2.3 V

1000000

1.73 mm

35 mm

35 mm