品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 触点形状 | 供应商器件包装 | 材料 | 房屋材料 | 质量 | 本体材质 | 终端数量 | PCB安装方向 | PCB安装固定 | PCB安装对准 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | JESD-609代码 | 终止次数 | 终端 | ECCN 代码 | 温度系数 | 连接器类型 | 电阻 | 定位的数量 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 行数 | 性别 | 附加功能 | HTS代码 | 紧固类型 | 子类别 | 额定功率 | 螺距 | 最大功率耗散 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 深度 | Reach合规守则 | 额定电流 | 频率 | 军用标准 | JESD-30代码 | 输出的数量 | 资历状况 | 接头数量 | 触点性别 | 输出电压 | 房屋颜色 | 电源 | 触点样式 | 温度等级 | 弱电 | 镀层 | 内存大小 | 传播延迟 | 接通延迟时间 | 电流源 | 数据率 | 输入数量 | 组织结构 | 配套固定装置 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 预载 | 外径 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 可充电性 | 等效门数 | 特征 | 化工技术 | 产品类别 | 直径 | 高度 | 长度 | 宽度 | 辐射硬化 | 达到SVHC | 无铅 | 评级结果 | ||||||||||||||||||||||||||||||||||||||||||||||
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![]() | AFS600-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | 微芯片技术 | Compliant | Tray | AFS600 | 活跃 | 3MRT2N-316 | Parker | 1.575 V | 1.425 V | 1.5000 V | 172 | -40 to 85 °C | Fusion® | 85 °C | -40 °C | 1.5 V | 13.5 kB | 110592 | 600000 | 1.28205 GHz | 1 | 13824 | 1.575 V | 1.425 V | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-FG324I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324 | 网格排列 | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | 250 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 1.2000 V | 1.14 V | 1.26 V | 023708617 | Entrelec | 221 | Tray | A3PE3000 | 活跃 | Compliant | -40 to 85 °C | ProASIC3L | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | 不合格 | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | 现场可编程门阵列 | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 1.26 V | 1.14 V | 3000000 | 1.25 mm | 19 mm | 19 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P030-VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | Honeywell-Microswitch | 1.5000 V | 1.425 V | 1.575 V | 有 | 330 LE | 77 I/O | + 100 C | 1.575 V | - 40 C | 90 | 1.425 V | 微芯片技术 | SMD/SMT | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | Tray | A3P030 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P030-VQG100I | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.36 | -40 to 85 °C | Tray | A3P030 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 15 mA | - | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 30000 | STD | - | 768 | 30000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS1500-1FGG676I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771 mg | 微芯片技术 | Compliant | Tray | M1AFS1500 | 活跃 | VH7441RT+3008D | Johnson Controls | 1.5000 V | 1.425 V | 1.575 V | 252 | -40 to 85 °C | Fusion® | 85 °C | -40 °C | 1.5 V | 33.8 kB | 276480 | 1.5e+06 | 1.28205 GHz | 1 | 38400 | 1.575 V | 1.425 V | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-TQG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | SMD/SMT | PLASTIC/EPOXY | 3 | 微芯片技术 | FLATPACK, LOW PROFILE, FINE PITCH | LFQFP, | 1.2 V | 30 | 有 | M2GL010-TQG144I | LFQFP | SQUARE | Microsemi Corporation | 活跃 | FPGA - Field Programmable Gate Array IGLOO 2 | MICROSEMI CORP | 5.57 | 84 | Tray | M2GL010 | 活跃 | 12084 LE | + 100 C | 1.26 V | - 40 C | 1.14 V | -40°C ~ 100°C (TJ) | IGLOO2 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | - | 1.6 mm | 现场可编程门阵列 | 12084 | 933888 | STD | - | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 6.777889 g | 84 | 5.27 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 69 | Compliant | QCCJ, | 无 | A54SX08-2PL84I | 320 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 225 | 1.27 mm | compliant | 320 MHz | S-PQCC-J84 | 不合格 | INDUSTRIAL | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 4.572 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 5.5 V | 4.5 V | 8000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | TFQFP | 320 MHz | A54SX08-2VQ100I | 无 | 85 °C | 3 V | 30 | 3.3 V | -40 °C | 81 | Compliant | 1 MM HEIGHT, MO-136, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.28 | SQUARE | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 320 MHz | S-PQFP-G100 | 不合格 | INDUSTRIAL | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 5.5 V | 4.5 V | 8000 | 1 mm | 14 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-2VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 有 | 1500 LE | 36864 bit | 71 I/O | + 85 C | 1.575 V | 0.257182 oz | 0 C | 90 | 1.425 V | SMD/SMT | Microchip | 微芯片技术 | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | Tray | A3P125 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.37 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P125-2VQG100 | 0°C ~ 85°C (TJ) | Tray | A3P125 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 2 mA | - | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 36864 | 125000 | 2 | - | 3072 | 125000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2PLG84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 6.777889 g | 84 | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.27 | 69 | Compliant | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX08-2PLG84 | 320 MHz | e3 | 哑光锡 | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 5 V | QUAD | J BEND | 245 | 1.27 mm | compliant | 320 MHz | S-PQCC-J84 | 不合格 | COMMERCIAL | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 4.572 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 5.25 V | 4.75 V | 8000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025-FCSG325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | + 100 C | 1.26 V | 0.740878 oz | - 40 C | 176 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 微芯片技术 | IGLOO2 | Details | Tray | M2GL025 | 活跃 | 11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325 | 网格排列 | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 有 | M2GL025-FCSG325I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | 有 | 27696 LE | 180 I/O | -40°C ~ 100°C (TJ) | Tray | M2GL025 | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.2 V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 667 Mb/s | 180 | 现场可编程门阵列 | 27696 | SoC FPGA | 1130496 | STD | 2 Transceiver | 27696 | FPGA - Field Programmable Gate Array | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-FGG896I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 3 | PLASTIC/EPOXY | 微芯片技术 | BGA896,30X30,40 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3PE3000L-FGG896I | 250 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.29 | 1.2000 V | 1.14 V | 1.26 V | 620 | Compliant | Tray | A3PE3000 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 620 | 不合格 | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 516096 | 3e+06 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 1.26 V | 1.14 V | 3000000 | 1.73 mm | 31 mm | 31 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 1.5000 V | 1.425 V | 1.575 V | 154 | Tray | A3P1000 | 活跃 | 有 | 11000 LE | 147456 bit | + 85 C | 1.575 V | 微芯片技术 | 2 oz | 0 C | 24 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P1000-PQG208 | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 0.74 | 0 to 70 °C | Tray | ProASIC3 | e3 | 3A991.D | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 8 mA | - | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 147456 | 1000000 | STD | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200T-FCG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (23x23) | 微芯片技术 | MPF200 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 192000 LE | 284 I/O | + 100 C | 1.08 V | - 40 C | 1 | 0.97 V | SMD/SMT | Microchip | Microchip Technology / Atmel | PolarFire | Details | Tray | -40°C ~ 100°C (TJ) | Tray | MPF200T | 可编程逻辑集成电路 | 1 V, 1.05 V | 12.5 Gb/s | 192000 | FPGA - Field Programmable Gate Array | 13619200 | 4 Transceiver | FPGA - Field Programmable Gate Array | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200TS-1FCSG325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-LFBGA, FC | YES | 325-FCBGA (11x14.5) | 325 | 微芯片技术 | 未说明 | 100 °C | 有 | MPF200TS-1FCSG325I | LFBGA | RECTANGULAR | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.8 | 170 | Tray | MPF200 | 活跃 | 1.03 V/1.08 V | 970 mV/1.02 V | SMD/SMT | LFBGA, | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | -40 °C | 1 V | -40°C ~ 100°C (TJ) | PolarFire™ | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 0.97V ~ 1.08V | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | R-PBGA-B325 | INDUSTRIAL | 1.45 mm | 现场可编程门阵列 | 192000 | 13619200 | 14.5 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TS-FCVG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (19x19) | 微芯片技术 | 有 | Tray | MPF300 | 活跃 | Details | PolarFire | Microchip Technology / Atmel | Microchip | SMD/SMT | 0.97 V | 1 | - 40 C | 1.08 V | + 100 C | 284 I/O | 20.6 Mbit | 300000 LE | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | MPF300TS | 可编程逻辑集成电路 | 1 V, 1.05 V | 12.5 Gb/s | 300000 | FPGA - Field Programmable Gate Array | 21094400 | 4 Transceiver | FPGA - Field Programmable Gate Array | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200T-FCVG484E | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FPBGA (19x19) | 微芯片技术 | MPF200 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 192000 LE | 284 I/O | + 100 C | 1.08 V | 0 C | 1 | 0.97 V | SMD/SMT | Microchip | Microchip Technology / Atmel | PolarFire | Details | Tray | 0°C ~ 100°C (TJ) | Tray | MPF200T | 可编程逻辑集成电路 | 1 V, 1.05 V | 12.5 Gb/s | 192000 | FPGA - Field Programmable Gate Array | 13619200 | 4 Transceiver | FPGA - Field Programmable Gate Array | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF100TL-FCSG325I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Gold | Flanges, Panel, Wall | 表面贴装 | BGA-325 | 325-FCBGA (11x11) | Aluminium | 微芯片技术 | Tray | MPF100 | 活跃 | Copper | Compliant | 有 | This product may require additional documentation to export from the United States. | 109000 LE | 170 I/O | 7.6 Mbit | + 100 C | 1.03 V/1.08 V | - 40 C | 1 | 970 mV/1.02 V | SMD/SMT | Microchip | Microchip Technology / Atmel | PolarFire | -40°C ~ 100°C (TJ) | Bulk | MPF100TL | Crimp | Circular, Receptacle | 26 | 200 °C | -65 °C | Receptacle | Bayonet | 可编程逻辑集成电路 | 1 V, 1.05 V | Straight | 30.96 mm | 7.5 A | MIL-DTL-38999 | 26 | Female | Socket | Cadmium | 12.7 Gb/s | 109000 | FPGA - Field Programmable Gate Array | 7782400 | 4 Transceiver | FPGA - Field Programmable Gate Array | 23.54 mm | 无 | 无SVHC | 抗环境干扰 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TLS-FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Lead, Tin | 通孔 | 表面贴装 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | Compliant | 512 | Tray | MPF300 | 活跃 | 300000 LE | + 100 C | 1.03 V/1.08 V | - 40 C | 970 mV/1.02 V | SMD/SMT | -40°C ~ 100°C (TJ) | Bulk | PolarFire™ | 1 % | 2 | 50 ppm/°C | 3.7 kΩ | 175 °C | -65 °C | Metal Film | 125 mW | 125 mW | 0.97V ~ 1.08V | MIL-PRF-55182 | 12.7 Gb/s | 300000 | 21094400 | Military, Moisture Resistant, Weldable | 2.39 mm | 6.35 mm | 2.39 mm | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TS-FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-1152 | 1152-FCBGA (35x35) | 微芯片技术 | Details | Tray | MPF300 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 300000 LE | 20.6 Mbit | 512 I/O | + 100 C | 1.08 V | - 40 C | 1 | 0.97 V | SMD/SMT | Microchip | Microchip Technology / Atmel | PolarFire | -40°C ~ 100°C (TJ) | Tray | MPF300TS | 可编程逻辑集成电路 | 1.05 V | 12.5 Gb/s | 300000 | FPGA - Field Programmable Gate Array | 21094400 | 16 Transceiver | FPGA - Field Programmable Gate Array | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500T-FCG784I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-784 | 784-FCBGA (29x29) | 微芯片技术 | Details | Tray | MPF500 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 481000 LE | 388 I/O | + 100 C | 1.08 V | 3.492228 oz | - 40 C | 1 | 0.97 V | SMD/SMT | Microchip | Microchip Technology / Atmel | PolarFire | -40°C ~ 100°C (TJ) | Tray | MPF500T | 可编程逻辑集成电路 | 1 V, 1.05 V | 12.5 Gb/s | 481000 | FPGA - Field Programmable Gate Array | 33792000 | 16 Transceiver | FPGA - Field Programmable Gate Array | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TS-FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-1152 | 3 | 1152-FCBGA (35x35) | Lithium | 2.8 g | 微芯片技术 | Tray | MPF500 | 活跃 | Compliant | 3 V | 有 | This product may require additional documentation to export from the United States. | 481000 LE | 584 I/O | + 100 C | 1.08 V | 2.562565 oz | - 40 C | 1 | 0.97 V | SMD/SMT | Microchip | Microchip Technology / Atmel | PolarFire | -40°C ~ 100°C (TJ) | Tray | MPF500TS | 通孔 | 可编程逻辑集成电路 | 1 V, 1.05 V | Horizontal | 3 V | 12.5 Gb/s | 481000 | FPGA - Field Programmable Gate Array | 33792000 | 24 Transceiver | 20 mm | Non-Rechargeable | Lithium | FPGA - Field Programmable Gate Array | 20 mm | 3.2 mm | 20.2 mm | 有 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF100T-FCSG325E | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Lead, Tin | 通孔 | 表面贴装 | BGA-325 | 325-FCBGA (11x11) | 微芯片技术 | PolarFire | Tray | MPF100 | 活跃 | Compliant | - | 有 | This product may require additional documentation to export from the United States. | 109000 LE | 170 I/O | 7.6 Mbit | + 100 C | 1.08 V | 0 C | 1 | 0.97 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 0°C ~ 100°C (TJ) | Bulk | MPF100T | 0.5 % | 2 | 50 ppm/°C | 7.41 kΩ | 175 °C | -65 °C | Metal Film | 可编程逻辑集成电路 | 100 mW | 100 mW | 1 V, 1.05 V | MIL-PRF-55182 | 12.5 Gb/s | 109000 | FPGA - Field Programmable Gate Array | 7600Kbit | 4 Transceiver | Military, Moisture Resistant, Weldable | FPGA - Field Programmable Gate Array | 1.78 mm | 3.81 mm | 1.78 mm | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200T-FCSG325E | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-325 | 325-FCBGA (11x14.5) | 微芯片技术 | MPF200 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 192000 LE | 170 I/O | + 100 C | 1.08 V | 0 C | 1 | 0.97 V | SMD/SMT | Microchip | Microchip Technology / Atmel | PolarFire | Details | Tray | 0°C ~ 100°C (TJ) | Tray | MPF200T | 可编程逻辑集成电路 | 1 V, 1.05 V | 12.5 Gb/s | 192000 | FPGA - Field Programmable Gate Array | 13619200 | 4 Transceiver | FPGA - Field Programmable Gate Array | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090-1FGG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 10 months ago) | Gold, Lead, Tin | 通孔 | 表面贴装 | 484-BGA | YES | 15 | Round | 484-FPBGA (23x23) | Aluminium | 484 | Vertical | Without | Without | 微芯片技术 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 85 °C | 有 | M2GL090-1FGG484 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.3 | 2.29 mm | Non-Compliant | Brass | 267 | Tray | M2GL090 | 活跃 | 86184 LE | + 85 C | 1.2 V | 0 C | 1.2 V | SMD/SMT | BGA, BGA484,22X22,40 | 0°C ~ 85°C (TJ) | Bulk | IGLOO2 | Solder | Male Pin, Pin, Plug | 15 | 200 °C | -200 °C | 1 | 8542.39.00.01 | 现场可编程门阵列 | 635 µm | 1.2 V | BOTTOM | Vertical | BALL | 260 | 1 mm | 7.11 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 15 | Natural | 1.2 V | Pin | OTHER | Non-Compliant | 323.3 kB | 267 | With | 2.44 mm | 现场可编程门阵列 | 86316 | 2648064 | 有 | 86316 | 1.26 V | 1.14 V | 7.5184 mm | 14.1859 mm | 23 mm | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA1000-FG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 1152-BGA | YES | 1152 | 1152-FPBGA (35x35) | 400.011771 mg | 1152 | 微芯片技术 | 2.3 V | 85 °C | 无 | APA1000-FG1152I | 180 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.26 | 712 | Compliant | Tray | APA1000 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 2.5 V | 20 | -40°C ~ 85°C (TA) | ProASICPLUS | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.5 V | BOTTOM | BALL | 225 | 1 mm | unknown | 180 MHz | S-PBGA-B1152 | 712 | 不合格 | 2.5,2.5/3.3 V | INDUSTRIAL | 24.8 kB | 712 | 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 202752 | 1e+06 | 180 MHz | 56320 | 56320 | 2.7 V | 2.3 V | 1000000 | 1.73 mm | 35 mm | 35 mm | 无 |
AFS600-1FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF200TS-1FCSG325I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF300TS-FCVG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF200T-FCVG484E
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF300TLS-FCG1152I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF300TS-FCG1152I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF500T-FCG784I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF500TS-FCG1152I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF200T-FCSG325E
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL090-1FGG484
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA1000-FG1152I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
