N/A

-

YES

484

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P1000L-FGG484I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

INDUSTRIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

YES

484

40

1.14 V

70 °C

有

M1A3P1000L-1FGG484

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

COMMERCIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

YES

256

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P600L-1FGG256I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.26

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

13824

600000

17 mm

17 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

20

1.14 V

85 °C

无

M2GL005-1TQ144

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.57

84

Tray

Obsolete

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

YES

1152

网格排列

PLASTIC

BGA1152,34X34,40

1.2 V

无

M2GL100-FC1152

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.88

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

N/A

-

表面贴装

68-LCC (J-Lead)

YES

68-PLCC (24.23x24.23)

68

MICROSEMI CORP

3.6 V

5.23

微芯片技术

LCC

Obsolete

Microsemi Corporation

SQUARE

QCCJ

80 MHz

A40MX02-PL68M

无

125 °C

3 V

30

3.3 V

-55 °C

PLASTIC/EPOXY

3

CHIP CARRIER

QCCJ,

57

Tray

A40MX02

Obsolete

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

68

S-PQCC-J68

不合格

MILITARY

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.7 ns

295

3000

24.2316 mm

24.2316 mm

N/A

-

表面贴装

84

69

Non-Compliant

125 °C

-55 °C

48 MHz

5 V

5.5 V

4.5 V

4.5 ns

547

2000

547

273

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

256

400.011771 mg

256

1.2 V

40

1.14 V

70 °C

有

A3P600L-1FGG256

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.28

177

Compliant

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

e1

锡银铜

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

1.26 V

1.14 V

5 mA

13.5 kB

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

600000

892.86 MHz

1

13824

13824

13824

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

YES

208

208

40

1.425 V

85 °C

有

AFS600-1PQG208

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.8

95

Compliant

QFF,

FLATPACK

3

PLASTIC/EPOXY

1.5 V

e3

哑光锡

70 °C

0 °C

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

1.5 V

OTHER

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

600000

1.28205 GHz

1

13824

13824

600000

3.4 mm

28 mm

28 mm

无

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

484

400.011771 mg

484

1.5 V

40

1.425 V

100 °C

有

A3P400-1FGG484I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

194

Compliant

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

6.8 kB

9216 CLBS, 400000 GATES

2.44 mm

现场可编程门阵列

400000

272 MHz

1

9216

9216

400000

1.73 mm

23 mm

23 mm

无

N/A

-

通孔

84

69

Non-Compliant

125 °C

-55 °C

48 MHz

5 V

5.5 V

4.5 V

4.5 ns

547

2000

547

273

无

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

3

100

微芯片技术

100 °C

-40 °C

Tray

PLASTIC/EPOXY

LFQFP

LFQFP,

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

Obsolete

30

5.25

无

1.575 V

1.425 V

1.5 V

A3P125

350 MHz

MICROSEMI CORP

Microsemi Corporation

A3P125-2TQ144I

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.6 mm

现场可编程门阵列

36864

125000

3072

125000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

微芯片技术

PLASTIC/EPOXY

-40 °C

5 V

30

4.75 V

125 °C

无

A42MX16-VQ100A

139 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.53

QFP

83

Tray

A42MX16

Obsolete

-40°C ~ 125°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 3V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.5 mm

compliant

100

S-PQFP-G100

不合格

AUTOMOTIVE

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2.2 ns

1232

24000

14 mm

14 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

FLATPACK

3

微芯片技术

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A40MX04-3PQ100

109 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

69

Tray

A40MX04

Obsolete

QFP,

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

COMMERCIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

1.7 ns

547

6000

20 mm

14 mm

520 In Stock

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

3

微芯片技术

UNSPECIFIED

-40 °C

1.5 V

30

1.425 V

100 °C

有

A3P030-QNG68I

HVQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.22

49

Tray

A3P030

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

-40°C ~ 100°C (TJ)

ProASIC3

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

STD

768

30000

8 mm

8 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

TQFP100,.63SQ

-55 °C

125 °C

有

A54SX16P-1VQG100M

241 MHz

QFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.82

81

Tray

A54SX16

活跃

QFP, TQFP100,.63SQ

FLATPACK

3

PLASTIC/EPOXY

-55°C ~ 125°C (TC)

SX

3A001.A.2.C

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

MILITARY

81

现场可编程门阵列

24000

1452

1452

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

微芯片技术

A54SX32A

Obsolete

81

Tray

0°C ~ 70°C (TA)

SX-A

2.25V ~ 5.25V

48000

2880

N/A

-

表面贴装

896-BGA

896-FBGA (31x31)

微芯片技术

47 to 63 Hz

3750 Vac

底座安装

2.5000 V

2.3 V

2.7 V

562

Tray

APA750

活跃

-40 to 90 °C

ProASICPLUS

Wire Leaded

2.3V ~ 2.7V

896

1

95 %

85 to 171 V

恒定电流

1400 to 2800 mA

479 W

147456

750000

STD

127 to 431/90 to 305 Vdc/Vac

N/A

-

表面贴装

80-TQFP

YES

80-VQFP (14x14)

80

FLATPACK, THIN PROFILE

3

微芯片技术

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A40MX02-1VQ80

92 MHz

TQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

QFP

57

Tray

A40MX02

Obsolete

TQFP,

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

80

S-PQFP-G80

不合格

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.3 ns

295

3000

14 mm

14 mm

855 In Stock

• 1: ¥12,952.041703
• 10: ¥12,526.152518
• 25: ¥12,439.078967
• 50: ¥12,352.610693
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

YES

324

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

30

1.425 V

85 °C

无

AX1000-2FG676I

870 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.79

418

Compliant

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

-40°C ~ 85°C (TA)

Axcelerator

e0

100.0000 ppm/°C

10 Ohm

锡铅

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

0.5 W

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

High Reliability, MIL-PRF-39017

unknown

870 MHz

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1e+06

870 MHz

18144

12096

2

1

12096

0.74 ns

12096

18144

1000000

11.43

1.73 mm

27 mm

27 mm

无

含铅

2189 In Stock

• 1: ¥3,247.586218
• 10: ¥3,063.760581
• 100: ¥2,890.340171
• 500: ¥2,726.736013
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

1.5000 V

248

Tray

AX250

活跃

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

55296

250000

4224

STD