N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.26 V

Tray

M1A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

M1A3P1000L-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M1A3P1000L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

896

896-FBGA (31x31)

400.011771 mg

微芯片技术

N

586 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

有

27

Actel

0.014110 oz

1.575 V

Tray

AX2000

活跃

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TA)

Tray

AX2000

125 °C

-55 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

36 kB

850 ps

21504

294912

2000000

763 MHz

32256

1

21504

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

VTQFP

YES

128-VTQFP (14x14)

128

有

892.86 MHz

SMD/SMT

+ 85 C

- 40 C

1.14 V

微芯片技术

101 I/O

Details

Tray

AGLP030

活跃

1.575 V

TFQFP, TQFP128,.63SQ,16

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP128,.63SQ,16

-40 °C

1.5 V

未说明

85 °C

有

AGLP030V2-VQG128I

160 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

90

IGLOO PLUS

-40°C ~ 100°C (TJ)

Tray

AGLP030V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.4 mm

compliant

S-PQFP-G128

101

不合格

1.2 V to 1.5 V

1.2/1.5 V

INDUSTRIAL

16 uA

101

792 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

792

30000

STD

792

792

30000

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P600-2FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 20 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOO nano

1.575 V

Tray

AGLN060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

AGLN060V5-VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

N

700 LE

71 I/O

-20°C ~ 85°C (TJ)

Tray

AGLN060V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.5 V

OTHER

10 uA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-289

YES

289-CSP (14x14)

289

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

119

IGLOO PLUS

1.575 V

Tray

AGLP125

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA289,17X17,32

1.5 V

未说明

70 °C

无

AGLP125V2-CS289

160 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

N

212 I/O

1.14 V

0 C

0°C ~ 85°C (TJ)

Tray

AGLP125V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

212

不合格

1.2 V to 1.5 V

1.2/1.5 V

COMMERCIAL

212

3120 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

0.81 mm

14 mm

14 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

60

ProASIC3

0.046530 oz

1.575 V

Tray

A3P060

活跃

20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, GREEN, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P060-2TQG144I

350 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

91 I/O

-40°C ~ 100°C (TJ)

Tray

A3P060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

18432

60000

2

1536

60000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

0 C

1.2 V

200 I/O

微芯片技术

56520 LE

N

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

IGLOO2

176

有

SMD/SMT

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

1.2 V

0 C

+ 85 C

SMD/SMT

微芯片技术

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060TS-1FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

200 I/O

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

+ 85 C

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PN125-2VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

71 I/O

1.425 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

A3PN125

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

2

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-289

YES

289-CSP (14x14)

289

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

119

IGLOO PLUS

1.575 V

Tray

AGLP060

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA289,17X17,32

1.5 V

未说明

70 °C

无

AGLP060V2-CS289

160 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

N

157 I/O

1.14 V

0 C

0°C ~ 85°C (TJ)

Tray

AGLP060V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

157

不合格

1.2 V to 1.5 V

1.2/1.5 V

COMMERCIAL

157

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

0.81 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

N

203 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

217 MHz

有

90

Actel

0.014110 oz

Tray

A54SX72

活跃

2.75 V

-40°C ~ 125°C (TA)

Tray

A54SX72A

2.25V ~ 5.25V

2.5 V

108000

6036

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

175 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

263 MHz

微芯片技术

有

24

Actel

Tray

A54SX16

活跃

2.75 V

FQFP, QFP208,1.2SQ

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ

-55 °C

2.5 V

40

125 °C

有

A54SX16A-1PQG208M

263 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TC)

Tray

A54SX16A

e3

3A001.A.2.C

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

2.5 V

2.5,3.3/5 V

MILITARY

175

1452 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

0.014110 oz

IGLOOe

160

有

526.32 MHz, 892.86 MHz

SMD/SMT

+ 70 C

0 C

微芯片技术

1.14 V

97 I/O

Details

This product may require additional documentation to export from the United States.

1.2, 1.5 V

1.14 V

1.575 V

Tray

AGL600

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

AGL600V2-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.42

0 to 70 °C

Tray

AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.2 V to 1.5 V

OTHER

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

+ 100 C

SMD/SMT

微芯片技术

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

PLASTIC/EPOXY

1.2 V

有

M2GL060TS-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

200 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

1.2 V

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

0 C

+ 70 C

SMD/SMT

278 MHz

有

微芯片技术

27

Actel

Tray

A54SX32

活跃

2.75 V

5.24

MICROSEMI CORP

活跃

SQUARE

BGA

278 MHz

A54SX32A-1BG329

无

70 °C

30

2.5 V

BGA329,23X23,50

PLASTIC/EPOXY

3

网格排列

BGA, BGA329,23X23,50

N

249 I/O

2.25 V

0°C ~ 70°C (TA)

Tray

A54SX32A

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

CSP-201

YES

201-CSP (8x8)

201

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

348

IGLOO PLUS

1.575 V

Tray

AGLP060

活跃

VFBGA, BGA201,15X15,20

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA201,15X15,20

1.5 V

未说明

70 °C

有

AGLP060V5-CSG201

250 MHz

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

157 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

AGLP060V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B201

157

不合格

1.5 V

1.5 V

COMMERCIAL

157

1584 CLBS, 60000 GATES

0.99 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

0.66 mm

8 mm

8 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

0 C

+ 70 C

SMD/SMT

175 MHz

有

微芯片技术

66

Actel

0.062040 oz

Tray

A40MX02

活跃

5.25 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-2PQG100

101 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

2 ns

295

3000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

+ 70 C

SMD/SMT

188 MHz

有

微芯片技术

90

Actel

5.25 V

Tray

A40MX02

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-3VQG80

109 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

1.7 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

178 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P400

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P400-2FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

2

9216

400000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

0 C

+ 70 C

SMD/SMT

188 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-3PQG100

109 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

1.7 ns

295

3000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

0 C

+ 70 C

SMD/SMT

269 MHz

有

微芯片技术

66

Actel

0.062040 oz

Tray

A42MX09

活跃

5.25 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-2PQG100

146 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

1.8 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

2.25 V

0 C

+ 70 C

SMD/SMT

172 MHz

有

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

有

A54SX32A-FFGG256

172 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.7 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

+ 125 C

SMD/SMT

153 MHz

有

66

微芯片技术

Actel

0.062040 oz

5.25 V

83

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-PQG100A

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.53

Details

4.75 V

- 40 C

-40°C ~ 125°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

5 V

AUTOMOTIVE

24000 GATES

3.4 mm

现场可编程门阵列

24000

STD

2.4 ns

24000

2.7 mm

20 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

有

微芯片技术

24

Actel

0.196363 oz

5.25 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-3PQG160

129 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

237 MHz

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

24000

3.4 mm

28 mm

28 mm

无