2661 In Stock

• 1: ¥2,277.583788
• 10: ¥2,148.663954
• 100: ¥2,027.041465
• 500: ¥1,912.303272
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

24

ProASIC3

Tray

M1A3PE1500

活跃

1.575 V

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-2PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

This product may require additional documentation to export from the United States.

Details

147 I/O

-40°C ~ 100°C (TJ)

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

3.4 mm

28 mm

28 mm

2960 In Stock

• 1: ¥2,127.766204
• 10: ¥2,007.326611
• 100: ¥1,893.704347
• 500: ¥1,786.513539
查看所有的价格

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS1500-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

2079 In Stock

• 1: ¥3,701.591398
• 10: ¥3,492.067359
• 100: ¥3,294.403168
• 500: ¥3,107.927517
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

Tray

U1AFS1500

活跃

0°C ~ 85°C (TJ)

Tray

U1AFS1500

1.425V ~ 1.575V

276480

1500000

STD

19 In Stock

• 1: ¥113.570519
• 10: ¥107.142004
• 100: ¥101.077360
• 500: ¥95.356003
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN125-1VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

-20°C ~ 85°C (TJ)

Tray

A3PN125

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

736 In Stock

• 1: ¥9,294.525706
• 10: ¥8,988.903001
• 25: ¥8,926.418075
• 50: ¥8,864.367505
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.26 V

8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/85

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

30

85 °C

无

A3PE3000L-1FG484I

250 MHz

BGA

SQUARE

活跃

FPGA ProASICu00ae3EL Family 3M Gates 892.86MHz 130nm Technology 1.2V 484-Pin FBGA Tray

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

-40°C ~ 100°C (TJ)

Tray

A3PE3000L

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

2306 In Stock

• 1: ¥2,168.569238
• 10: ¥2,045.820033
• 100: ¥1,930.018899
• 500: ¥1,820.772551
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.26 V

Tray

M1A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

M1A3P1000L-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P1000L

e0

锡铅银

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

2625 In Stock

• 1: ¥3,170.718473
• 10: ¥2,991.243845
• 100: ¥2,821.928155
• 500: ¥2,662.196375
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

90

Fusion

114

Tray

U1AFS600

活跃

-40°C ~ 100°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

19 In Stock

• 1: ¥128.220028
• 10: ¥120.962293
• 100: ¥114.115369
• 500: ¥107.656004
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN125

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

70 °C

无

A3PN125-1VQ100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

-20°C ~ 85°C (TJ)

Tray

A3PN125

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

2053 In Stock

• 1: ¥3,381.100459
• 10: ¥3,189.717414
• 100: ¥3,009.167373
• 500: ¥2,838.837146
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

1098.9 MHz

有

微芯片技术

0.014110 oz

Fusion

60

Tray

M1AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

223 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

1.73 mm

23 mm

23 mm

2359 In Stock

• 1: ¥4,134.446912
• 10: ¥3,900.421616
• 100: ¥3,679.643030
• 500: ¥3,471.361348
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

60

ProASIC3

0.014110 oz

SMD/SMT

+ 70 C

微芯片技术

0 C

1.425 V

341 I/O

Details

Tray

M1A3PE3000

活跃

1.575 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

M1A3PE3000-FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

231 MHz

有

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

3000 In Stock

• 1: ¥1,714.913199
• 10: ¥1,617.842640
• 100: ¥1,526.266645
• 500: ¥1,439.874187
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

微芯片技术

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

1.14 V

100 °C

无

M1AGL1000V2-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

90

IGLOOe

177

Tray

-40°C ~ 85°C (TA)

Tray

M1AGL1000V2

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

17 mm

17 mm

2050 In Stock

• 1: ¥1,700.222080
• 10: ¥1,603.983095
• 100: ¥1,513.191595
• 500: ¥1,427.539240
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

172

Tray

P1AFS600

活跃

-40°C ~ 100°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

2321 In Stock

• 1: ¥1,884.565366
• 10: ¥1,777.891852
• 100: ¥1,677.256465
• 500: ¥1,582.317421
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

0.014110 oz

ProASIC3

160

有

781.25 MHz

SMD/SMT

+ 85 C

- 40 C

微芯片技术

1.14 V

97 I/O

N

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

M1A3P1000L-FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

957 In Stock

• 1: ¥13,784.186866
• 10: ¥13,330.935075
• 25: ¥13,238.267206
• 50: ¥13,146.243500
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.14 V

- 55 C

+ 125 C

SMD/SMT

有

微芯片技术

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

125 °C

有

M1A3PE3000L-FGG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

23 mm

23 mm

49 In Stock

• 1: ¥763.539312
• 10: ¥720.320103
• 100: ¥679.547270
• 500: ¥641.082325
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

N

235 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P600-2FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.73 mm

23 mm

23 mm

2322 In Stock

• 1: ¥2,448.821927
• 10: ¥2,310.209365
• 100: ¥2,179.442797
• 500: ¥2,056.078111
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

90

Fusion

119

Tray

P1AFS600

活跃

-40°C ~ 100°C (TJ)

Tray

P1AFS600

1.425V ~ 1.575V

110592

600000

2

2061 In Stock

• 1: ¥1,203.781911
• 10: ¥1,135.643311
• 100: ¥1,071.361616
• 500: ¥1,010.718507
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.2 V

20

100 °C

无

M1AGL600V2-CS281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

1.2 V

有

184

IGLOOe

215

1.5 V

Tray

M1AGL600

活跃

TFBGA,

-40°C ~ 85°C (TA)

Tray

M1AGL600V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

1.2 V to 1.5 V

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

2773 In Stock

• 1: ¥1,970.402692
• 10: ¥1,858.870464
• 100: ¥1,753.651381
• 500: ¥1,654.388092
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

235 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

M1A3P600L-1FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

M1A3P600L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

235

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

5 mA

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.73 mm

23 mm

23 mm

36 In Stock

• 1: ¥93.398137
• 10: ¥88.111450
• 100: ¥83.124008
• 500: ¥78.418874
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

350 MHz

有

微芯片技术

90

ProASIC3 nano

Tray

A3PN060

活跃

1.575 V

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

40

70 °C

有

A3PN060-1VQG100

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

71 I/O

1.425 V

- 20 C

+ 70 C

SMD/SMT

-20°C ~ 85°C (TJ)

Tray

A3PN060

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

OTHER

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

2367 In Stock

• 1: ¥1,151.351496
• 10: ¥1,086.180659
• 100: ¥1,024.698734
• 500: ¥966.696916
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.26 V

Tray

M1A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

M1A3P1000L-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

0°C ~ 85°C (TJ)

Tray

M1A3P1000L

e0

锡铅银

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

920 In Stock

• 1: ¥15,562.213504
• 10: ¥15,050.496622
• 25: ¥14,945.875488
• 50: ¥14,841.981620
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

341 I/O

1.14 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

无

M1A3PE3000L-FG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

25 mA

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

23 mm

23 mm

2652 In Stock

• 1: ¥964.891038
• 10: ¥910.274560
• 100: ¥858.749592
• 500: ¥810.141120
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

781.25 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

Tray

A3P600

活跃

1.26 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

70 °C

无

A3P600L-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

235 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

A3P600L

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

235

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

1.26 V

1.14 V

5 mA

13.5 kB

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

781.25 MHz

STD

13824

13824

13824

600000

1.73 mm

23 mm

23 mm

无

49 In Stock

• 1: ¥761.420051
• 10: ¥718.320807
• 100: ¥677.661139
• 500: ¥639.302960
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

40

70 °C

有

M1A3P600L-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

M1A3P600L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.05 mm

13 mm

13 mm

2187 In Stock

• 1: ¥1,357.580997
• 10: ¥1,280.736787
• 100: ¥1,208.242255
• 500: ¥1,139.851182
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

微芯片技术

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

40

1.14 V

85 °C

有

M1AGL1000V2-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

SMD/SMT

有

160

IGLOOe

97

Tray

M1AGL1000

0°C ~ 70°C (TA)

Tray

M1AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

13 mm

13 mm

2418 In Stock

• 1: ¥2,679.066356
• 10: ¥2,527.421089
• 100: ¥2,384.359515
• 500: ¥2,249.395769
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.14 V

- 55 C

+ 125 C

SMD/SMT

有

微芯片技术

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE600

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

125 °C

有

A3PE600L-FGG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

270 I/O

-55°C ~ 125°C (TJ)

Tray

A3PE600L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

270

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

270

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

13824

13824

600000

23 mm

23 mm