Microchip Technology M1A3P1000L-FG144I

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

144-FPBGA (13x13)

终端数量

144

Unit Weight

0.014110 oz

Tradename

ProASIC3

Factory Pack QuantityFactory Pack Quantity

160

Moisture Sensitive

有

Maximum Operating Frequency

781.25 MHz

Mounting Styles

SMD/SMT

Maximum Operating Temperature

+ 85 C

Minimum Operating Temperature

- 40 C

Supply Voltage-Min

1.14 V

Number of I/Os

97 I/O

RoHS

N

Shipping Restrictions

This product may require additional documentation to export from the United States.

Maximum Operating Supply Voltage

1.26 V

Minimum Operating Supply Voltage

1.14 V

Typical Operating Supply Voltage

1.2000 V

Supply Voltage-Max

1.26 V

Package

Tray

Base Product Number

M1A3P1000

厂商

微芯片技术

Product Status

活跃

Package Description

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

Package Style

GRID ARRAY, LOW PROFILE

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA144,12X12,40

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

M1A3P1000L-FG144I

Clock Frequency-Max

350 MHz

Package Code

LBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.24

包装

Tray

系列

M1A3P1000L

操作温度

-40 to 85 °C

JESD-609代码

e0

端子表面处理

Tin/Lead/Silver (Sn/Pb/Ag)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.14V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

225

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

输出的数量

97

资历状况

不合格

工作电源电压

1.2 V

电源

1.5/3.3 V

温度等级

INDUSTRIAL

输入数量

97

组织结构

24576 CLBS, 1000000 GATES

座位高度-最大

1.55 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

147456

阀门数量

1000000

速度等级

STD

逻辑块数量

24576

逻辑单元数

24576

等效门数

1000000

宽度

13 mm

长度

13 mm

高度

1.05 mm