N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.3

267

Tray

M2GL025

活跃

Compliant

27696 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL025-1FGG484

BGA

0°C ~ 85°C (TJ)

IGLOO2

200 ppm/K

120 kOhm

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

0.125 W

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

通用型

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

5

27696

23 mm

23 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

- 40 C

160

1.425 V

SMD/SMT

微芯片技术

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

Tray

A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P1000-FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.31

1.5000 V

1.425 V

1.575 V

MSL 3 - 168 hours

有

11000 LE

97 I/O

+ 100 C

1.575 V

0.014110 oz

-40 to 85 °C

Tray

A3P1000

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

-

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

144Kbit

1000000

STD

-

24576

1000000

FPGA - Field Programmable Gate Array

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-BFCQFP with Tie Bar

256

256-CQFP (75x75)

微芯片技术

203

Tray

5962-0054301

活跃

Non-Compliant

-55°C ~ 125°C (TJ)

SX-A

125 °C

-55 °C

2.25V ~ 5.25V

217 MHz

1.5 ns

1.5 ns

4024

108000

217 MHz

6036

6036

4024

2.75 V

2.25 V

无

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

- 40 C

60

1.425 V

SMD/SMT

微芯片技术

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

Tray

A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P1000-FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.3

1.5000 V

1.425 V

1.575 V

有

11000 LE

147456 bit

300 I/O

+ 100 C

1.575 V

1.606729 oz

-40 to 85 °C

Tray

A3P1000

e1

3A001.A.7.A

100 ppm/K

1 kOhm

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

可编程逻辑集成电路

0.1 W

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

通用型

compliant

S-PBGA-B484

不合格

INDUSTRIAL

75 mA

-

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

147456

1000000

STD

-

1

24576

1000000

FPGA - Field Programmable Gate Array

2.23 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

- 40 C

60

1.425 V

SMD/SMT

微芯片技术

Microchip

Microchip Technology / Atmel

231 MHz

ProASIC3

N

Tray

A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P1000-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.47

AEC-Q200

1.5000 V

1.425 V

1.575 V

有

11000 LE

300 I/O

+ 100 C

1.575 V

0.014110 oz

-40 to 85 °C

Tray

A3P1000

e0

3A001.A.7.A

100 ppm/K

158 Ohm

Tin/Lead (Sn/Pb)

8542.39.00.01

可编程逻辑集成电路

0.125 W

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

通用型

compliant

S-PBGA-B484

不合格

INDUSTRIAL

-

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

147456

1000000

STD

-

1

24576

1000000

FPGA - Field Programmable Gate Array

2 mm

1.25 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

90

1.425 V

SMD/SMT

微芯片技术

Microchip

Microchip Technology / Atmel

231 MHz

ProASIC3

N

Tray

A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P400-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0.032768 MHz

1.5000 V

1.425 V

1.575 V

有

5000 LE

178 I/O

+ 85 C

1.575 V

0.014110 oz

0 C

-20 to 60 °C

Tray

A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

可编程逻辑集成电路

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

-0.04 ppm

S-PBGA-B256

不合格

0.0328 MHz

COMMERCIAL

6 pF

20 ppm

-

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

55296

400000

STD

-

9216

400000

FPGA - Field Programmable Gate Array

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP-100

YES

100

100-VQFP (14x14)

100

3000 LE

36864 bit

+ 85 C

1.575 V

微芯片技术

0.017637 oz

0 C

90

1.425 V

SMD/SMT

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Tray

A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P250-VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

0.73

1.5000 V

1.425 V

1.575 V

8542310000, 8542390000

2048

68

Compliant

FLASH

MSL 3 - 168 hours

有

0 to 70 °C

Tray

A3P250

e3

100 ppm/K

562 kOhm

Tin (Sn)

70 °C

0 °C

8542.39.00.01

可编程逻辑集成电路

0.0625 W

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

通用型

compliant

231 MHz

S-PQFP-G100

不合格

COMMERCIAL

4.5 kB

3 mA

4.5 kB

3 mA

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

3000

FPGA - Field Programmable Gate Array

36Kbit

250000

231 MHz

STD

-

1

6144

6144

100 °C

1.575 V

1.425 V

250000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

无

无铅

N/A

-

表面贴装

208-BFQFP

YES

4

208-PQFP (28x28)

208

活跃

有

3000 LE

+ 85 C

1.575 V

微芯片技术

1 oz

0 C

24

1.425 V

SMD/SMT

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P250-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Industrial grade

SMD

Thin-Film Directional Coupler

表面贴装

1.5000 V

1.425 V

1.575 V

151

Tray

A3P250

-40 to 85 °C

Tray

ProASIC3

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

-

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

250000

Industrial

2

-

6144

250000

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

484-BGA

2

484-FPBGA (23x23)

微芯片技术

表面贴装

SMD

267

Tray

M2GL090

活跃

86184 LE

+ 125 C

1.2 V

- 55 C

1.2 V

SMD/SMT

-55 to 155 °C

IGLOO2

1.14V ~ 2.625V

温度传感器

Analog

86184

2648064

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

活跃

MICROSEMI CORP

5.27

425

Tray

M2GL090

活跃

Non-Compliant

86316 LE

+ 100 C

1.26 V

- 40 C

1.14 V

SMD/SMT

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

无

M2GL090T-1FG676I

BGA

SQUARE

Microsemi Corporation

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

323.3 kB

667 Mb/s

425

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

Microchip Technology / Atmel

微芯片技术

231 MHz

ProASIC3

Details

Tray

A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P400-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.31

AEC-Q200

有

5000 LE

55296 bit

178 I/O

+ 85 C

1.575 V

0 C

90

1.425 V

SMD/SMT

-

Microchip

0°C ~ 85°C (TJ)

Tray

A3P400

e1

25 ppm/°C

1.62 kOhm

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

可编程逻辑集成电路

0.15 W

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

Sulfur Resistant, Precision

compliant

S-PBGA-B256

不合格

COMMERCIAL

3 mA

-

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

55296

400000

STD

-

0.1

9216

400000

FPGA - Field Programmable Gate Array

1.62 mm

0.81 mm

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

有

2000 LE

36864 bit

158 I/O

+ 85 C

2.7 V

1.384339 oz

- 40 C

24

2.3 V

SMD/SMT

-

Microchip

Microchip Technology / Atmel

180 MHz

ProASICPLUS

Details

Tray

APA150

活跃

-40°C ~ 85°C (TA)

Tray

APA150

可编程逻辑集成电路

2.5 V

5 mA

-

FPGA - Field Programmable Gate Array

36864

150000

STD

-

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

267

Tray

M2GL060

活跃

56520 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-FG484I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.26

-40°C ~ 100°C (TJ)

IGLOO2

e0

Tin/Lead (Sn63Pb37)

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

M2GL060

活跃

56520 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

387

Tray

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

56520

1869824

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

425

Tray

M2GL090

活跃

86184 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

有

M2GL090T-FGG676I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.26

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

425

不合格

1.2 V

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

MICROSEMI CORP

5.26

387

Tray

M2GL060

活跃

56520 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060T-FG676

BGA

SQUARE

Microsemi Corporation

活跃

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

Tray

200

56520 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

活跃

M2GL060

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

56520

1869824

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

M2GL060

活跃

56520 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

267

Tray

-40°C ~ 100°C (TJ)

IGLOO2

1.14V ~ 2.625V

56520

1869824

4 Transceiver

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

387

Tray

M2GL060

活跃

56520 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-1FG676I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.26

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

A3P600-2FGG484

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.24

235

Compliant

Tray

A3P600

活跃

0°C ~ 85°C (TJ)

ProASIC3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

310 MHz

2

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

729-BBGA

729

729-PBGA (35x35)

微芯片技术

AX1000

活跃

516

Tray

Compliant

-55°C ~ 125°C (TA)

Axcelerator

125 °C

-55 °C

1.425V ~ 1.575V

763 MHz

20.3 kB

850 ps

850 ps

12096

165888

1000000

763 MHz

18144

12096

1

12096

1.575 V

1.425 V

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

微芯片技术

83

Tray

A42MX16

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX16-PQ100

94 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

20 mm

14 mm

N/A

-

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

微芯片技术

83

Tray

A42MX09

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

A42MX09-PQ100M

117 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

MILITARY

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.5 ns

684

14000

20 mm

14 mm

N/A

-

表面贴装

4-SMD, Flat Lead Exposed Pad

YES

160

5630

160

33°C/W

微芯片技术

--

4000K

125

Tray

A42MX16

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX16-PQ160

94 MHz

QFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

0°C ~ 70°C (TA)

Tape & Reel (TR)

DURIS® E 5

0.209 L x 0.118 W (5.30mm x 3.00mm)

e0

最后一次购买

--

Tin/Lead (Sn/Pb)

White, Neutral

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

3.15V

120°

120mA

143 lm/W

70

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

180mA

24000

54 lm (47 lm ~ 61 lm)

--

2.8 ns

1232

24000

0.034 (0.87mm)

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

MICROSEMI CORP

ROHS COMPLIANT, PLASTIC, QFP-208

1.59

129 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

40

8542390000/8542390000/8542390000/8542390000/8542390000

140

Compliant

Tray

A42MX16

活跃

3 V

A42MX16-3PQG208

有

活跃

0°C ~ 70°C (TA)

MX

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

5.25 V

3 V

24000

3.4 mm

28 mm

28 mm

无