N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

350 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-55 °C

1.5 V

40

125 °C

有

A3P1000-1FGG144M

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

-55°C ~ 125°C (TJ)

Tray

A3P1000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

CSP

YES

196-CSP (8x8)

196

143 I/O

N

微芯片技术

This product may require additional documentation to export from the United States.

348

IGLOOe

1.575 V

Tray

AGL400

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

未说明

85 °C

无

AGL400V5-CS196

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

有

250 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

0°C ~ 70°C (TA)

Tray

AGL400V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

1.5 V

OTHER

27 uA

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

N

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3 nano

1.575 V

1.425 V

1.5000 V

Tray

A3PN250

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN250-2VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

A3PN250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

3 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

223

Tray

P1AFS1500

-40°C ~ 100°C (TJ)

Tray

P1AFS1500

1.425V ~ 1.575V

276480

1500000

2

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

1.425 V

100 °C

有

M1AGL600V5-CSG281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

184

IGLOOe

215

Tray

M1AGL600

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

-40°C ~ 85°C (TA)

Tray

M1AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

30

S-PBGA-B281

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOOe

0.014110 oz

1.575 V

Tray

AGL400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

AGL400V2-FGG256

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

178 I/O

1.14 V

0°C ~ 70°C (TA)

Tray

AGL400V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

OTHER

27 uA

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

1.5000 V

微芯片技术

1.475 V

1.575 V

215

Tray

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

20

1.425 V

85 °C

无

M1AGL1000V5-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

184

IGLOOe

0 to 70 °C

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

STD

24576

1000000

10 mm

10 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

无

M1AFS1500-FG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.84

N

有

60

Fusion

223

Tray

M1AFS1500

活跃

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

20

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

223

不合格

1.5,3.3 V

223

现场可编程门阵列

276480

1500000

38400

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

SMD/SMT

+ 70 C

0 C

微芯片技术

1.425 V

119 I/O

Details

Tray

M1AFS1500

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS1500-FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

Fusion

90

有

1098.9 MHz

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

Tray

微芯片技术

M1A3P400

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P400-2FG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

90

ProASIC3

178

-40°C ~ 100°C (TJ)

Tray

M1A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

CSP-81

YES

81-CSP (5x5)

81

- 20 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

640

IGLOO nano

1.575 V

Tray

AGLN250

活跃

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

未说明

70 °C

有

AGLN250V5-CSG81

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.59

Details

3000 LE

60 I/O

1.425 V

-20°C ~ 85°C (TJ)

Tray

AGLN250V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

1.5 V

OTHER

-

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

0.66 mm

5 mm

5 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

M1A3PE3000

微芯片技术

活跃

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

40

1.425 V

70 °C

有

M1A3PE3000-2FGG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

84

ProASIC3

221

Tray

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

SMD/SMT

+ 85 C

- 40 C

1.425 V

微芯片技术

119 I/O

N

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-1FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

Fusion

90

有

1282.05 MHz

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1

1500000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

M1A3P1000L-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

ProASIC3

90

有

781.25 MHz

SMD/SMT

+ 85 C

- 40 C

1.14 V

微芯片技术

177 I/O

Details

This product may require additional documentation to export from the United States.

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

M1A3P1000

活跃

1.26 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

40

85 °C

有

M1A3P1000L-FGG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

FBGA

YES

484

有

60

Fusion

0.014110 oz

Details

1.575 V

FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS1500-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

1500000

STD

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

微芯片技术

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

有

M1AGL1000V2-CSG281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

SMD/SMT

有

184

IGLOOe

215

Tray

0°C ~ 70°C (TA)

Tray

M1AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

10 mm

10 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.14 V

- 20 C

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

90

IGLOO nano

Tray

AGLN060

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.2 V

30

70 °C

无

AGLN060V2-VQ100

TFQFP

SQUARE

活跃

FPGA - Field Programmable Gate Array AGLN060V2-VQ100

MICROSEMI CORP

5.59

N

700 LE

71 I/O

-20°C ~ 85°C (TJ)

Tray

AGLN060V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.2 V to 1.5 V

OTHER

10 uA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

1.575 V

Tray

A3PN060

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PN060-VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

N

71 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

A3PN060

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

2 mA

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

STD

1536

60000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.8

Details

有

60

Fusion

223

Tray

M1AFS1500

活跃

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

有

M1AFS1500-1FGG484K

350 MHz

BGA

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B484

223

不合格

1.5,3.3 V

33.8 kB

223

现场可编程门阵列

276480

1.5e+06

38400

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

IGLOOe

1.5000 V

微芯片技术

1.475 V

1.575 V

215

Tray

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

20

1.425 V

100 °C

无

M1AGL1000V5-CS281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

184

-40 to 85 °C

Tray

M1AGL1000V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1e+06

STD

24576

1000000

10 mm

10 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE3000-1FGG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

Tray

微芯片技术

M1A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P400-FG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

160

ProASIC3

97

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

CSP-81

YES

81-CSP (5x5)

81

1.14 V

- 20 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

640

IGLOO nano

0.001058 oz

Tray

AGLN250

活跃

1.575 V

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.2 V

未说明

70 °C

有

AGLN250V2-CSG81

VFBGA

SQUARE

活跃

MICROSEMI CORP

2.06

Details

3000 LE

60 I/O

-20°C ~ 85°C (TJ)

Tray

AGLN250V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

1.2 V to 1.5 V

OTHER

-

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

0.66 mm

5 mm

5 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

60

Fusion

0.014110 oz

Tray

M1AFS1500

活跃

1.575 V

FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-2FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

无