101 In Stock

-

表面贴装

YES

132

132

85 °C

有

A3P250-QNG132

350 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

7.59

87

Compliant

HVBCC,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

1.5 V

30

1.425 V

70 °C

0 °C

8542.39.00.01

CMOS

BOTTOM

BUTT

260

0.5 mm

compliant

231 MHz

S-XBCC-B132

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

250000

6144

6144

250000

8 mm

8 mm

无

无铅

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

160-BQFP

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

3.3 V

30

3 V

85 °C

无

A42MX16-3PQ160I

129 MHz

QFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

125

Compliant

Tray

A42MX16

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

160

S-PQFP-G160

不合格

5 V

INDUSTRIAL

5.5 V

3 V

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

24000

3.4 mm

28 mm

28 mm

无

N/A

-

PQFP-208

This product may require additional documentation to export from the United States.

N

151 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

24

ProASIC3

0.198628 oz

1.575 V

Tray

A3P250

1.5 V

250000

3.4 mm

28 mm

28 mm

46 In Stock

• 1: ¥177.955610
• 10: ¥167.882652
• 100: ¥158.379860
• 500: ¥149.414960
查看所有的价格

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AGL125V5-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

N

1500 LE

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

160

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

0 to 70 °C

Tray

AGL125V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

1.5 V

OTHER

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1.05 mm

13 mm

13 mm

2371 In Stock

• 1: ¥2,253.809443
• 10: ¥2,126.235326
• 100: ¥2,005.882384
• 500: ¥1,892.341869
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AFS1500-2FG256

LBGA

0°C ~ 85°C (TJ)

Tray

AFS1500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

OTHER

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

2

38400

1500000

1.2 mm

17 mm

17 mm

937 In Stock

• 1: ¥6,300.678407
• 10: ¥5,944.036233
• 100: ¥5,607.581351
• 500: ¥5,290.171085
查看所有的价格

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

微芯片技术

有

AX1000-1FGG676

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

0°C ~ 70°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

165888

1000000

18144

0.84 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

2956 In Stock

• 1: ¥1,824.061259
• 10: ¥1,720.812507
• 100: ¥1,623.408025
• 500: ¥1,531.517008
查看所有的价格

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

Tray

AFS600

活跃

This product may require additional documentation to export from the United States.

Details

7000 LE

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

0°C ~ 85°C (TJ)

Tray

AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.73 mm

23 mm

23 mm

2438 In Stock

• 1: ¥1,220.157038
• 10: ¥1,151.091545
• 100: ¥1,085.935418
• 500: ¥1,024.467377
查看所有的价格

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

QFP

RECTANGULAR

活跃

FPGA - Field Programmable Gate Array MX

MICROSEMI CORP

1.55

3 V

0 C

+ 70 C

SMD/SMT

有

66

Actel

0.062040 oz

Details

336 LE

83 I/O

5.25 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-PQG100

117 MHz

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

-

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

STD

-

2.5 ns

684

14000

2.7 mm

20 mm

14 mm

2581 In Stock

• 1: ¥1,273.728893
• 10: ¥1,201.631029
• 100: ¥1,133.614176
• 500: ¥1,069.447339
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

AGL1000V5-FGG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

90

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL1000

活跃

-40 to 85 °C

Tray

AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

YES

208

Military grade

5962-9956903QYC

Obsolete

MICROSEMI CORP

GQFF,

5.81

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

FLATPACK, GUARD RING

3.63 V

3.3 V

2.97 V

e4

3A001.A.2.C

GOLD

ALSO REQUIRES 5V SUPPLY

8542.39.00.01

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F208

Qualified

MILITARY

1452 CLBS, 16000 GATES

3.16 mm

现场可编程门阵列

MIL-PRF-38535 Class Q

1452

16000

29.21 mm

29.21 mm

N/A

-

YES

208

Military grade

5962-9956904QYC

Obsolete

MICROSEMI CORP

GQFF,

5.26

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

FLATPACK, GUARD RING

3.63 V

3.3 V

2.97 V

e4

3A001.A.2.C

GOLD

ALSO REQUIRES 5V SUPPLY

8542.39.00.01

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F208

Qualified

MILITARY

1452 CLBS, 16000 GATES

3.16 mm

现场可编程门阵列

MIL-PRF-38535 Class Q

1452

16000

29.21 mm

29.21 mm

6 In Stock

-

表面贴装

208-BFCQFP with Tie Bar

YES

208-CQFP (75x75)

208

微芯片技术

Tray

5962-0151802

活跃

2.25 V

Military grade

5962-0151802QYC

活跃

MICROSEMI CORP

GQFF,

5.22

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

FLATPACK, GUARD RING

2.75 V

2.5 V

174

-55°C ~ 125°C (TJ)

SX-A

e4

3A001.A.2.C

GOLD

2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION

8542.39.00.01

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F208

Qualified

MILITARY

32000 GATES

3.22 mm

现场可编程门阵列

48000

2880

MIL-PRF-38535 Class Q

32000

29.21 mm

29.21 mm

2395 In Stock

• 1: ¥3,695.916001
• 10: ¥3,486.713208
• 100: ¥3,289.352085
• 500: ¥3,103.162340
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

5376

FBGA

表面贴装

Axcelerator

1.5(V)

286000

317

0C to 70C

无

70C

1.575(V)

0C

1.425(V)

5376

0.99(ns)

5376

有

0.15um

500000

Commercial

1.5000 V

1.425 V

1.575 V

317

Tray

AX500

活跃

0 to 70 °C

Tray

Axcelerator

1.425V ~ 1.575V

649(MHz)

484

73728

500000

8064

STD

N/A

-

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

42MX

微芯片技术

336

0.45UM

14000

有

INDUSTRIALC

72

Tube

A42MX09

Obsolete

PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC84,1.2SQ

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX09-PL84I

117 MHz

QCCJ

SQUARE

Actel Corporation

Transferred

ACTEL CORP

3.6 V

5.81

2.5/1.8(ns)

PLCC

336

516

14000

72

表面贴装

5.5(V)

3.3/5(V)

3(V)

-40C to 85C

无

85C

-40C

-40°C ~ 85°C (TA)

Box

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATE AT 5.0V SUPPLY

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

129/215(MHz)

84

S-PQCC-J84

104

不合格

3.3,3.3/5,5 V

INDUSTRIAL

104

336 CLBS, 14000 GATES

4.57 mm

现场可编程门阵列

14000

2.5 ns

336

684

14000

29.3116 mm

29.3116 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

48000

有

0.35um

113

Tray

A54SX32

Obsolete

1.40 MM HEIGHT, MO-136, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

A54SX32-TQ144M

240 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

1080

0.9(ns)

TQFP

32000

113

表面贴装

SX

3.3/5(V)

-55C to 125C

无

125C

3.63/5.5(V)

2.97/4.5(V)

1800

2880

-55C

-55°C ~ 125°C (TC)

SX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

240(MHz)

144

S-PQFP-G144

不合格

MILITARY

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

32000

20 mm

20 mm

N/A

-

通孔

484-BFCPGA

484-CCGA (23x23)

微芯片技术

1.03 V/1.08 V

284

Tray

活跃

This product may require additional documentation to export from the United States.

300000 LE

970 mV/1.02 V

1

-55°C ~ 125°C (TJ)

Tray

MPF300TS

0.97V ~ 1.08V

1.05 V

300000

21600666

2526 In Stock

• 1: ¥3,576.358230
• 10: ¥3,373.922857
• 100: ¥3,182.946094
• 500: ¥3,002.779333
查看所有的价格

-

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

无

M2GL150-FCV484I

FBGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

84

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

STD

19 mm

19 mm

2815 In Stock

• 1: ¥2,864.670042
• 10: ¥2,702.518905
• 100: ¥2,549.546137
• 500: ¥2,405.232201
查看所有的价格

-

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

无

M2GL150-1FCV484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

2223 In Stock

• 1: ¥1,354.352819
• 10: ¥1,277.691343
• 100: ¥1,205.369190
• 500: ¥1,137.140740
查看所有的价格

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL060-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

-40°C ~ 100°C (TJ)

Tray

M2GL060

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

STD

17 mm

17 mm

36 In Stock

• 1: ¥258.412270
• 10: ¥243.785163
• 100: ¥229.985998
• 500: ¥216.967926
查看所有的价格

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

1.14 V

有

90

IGLOO2

1.26 V

169

Tray

M2GL005

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005-VFG400I

LFBGA

SQUARE

活跃

IC FPGA 169 I/O 400VFBGA

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

6060

719872

STD

17 mm

17 mm

2699 In Stock

• 1: ¥1,590.985564
• 10: ¥1,500.929778
• 100: ¥1,415.971485
• 500: ¥1,335.822155
查看所有的价格

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

IGLOO2

90

有

SMD/SMT

+ 85 C

0 C

1.2 V

207 I/O

56520 LE

N

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.2 V

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

2321 In Stock

• 1: ¥1,354.352819
• 10: ¥1,277.691343
• 100: ¥1,205.369190
• 500: ¥1,137.140740
查看所有的价格

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060

1.14V ~ 2.625V

1.2 V

56520

1869824

2733 In Stock

• 1: ¥3,139.970809
• 10: ¥2,962.236612
• 100: ¥2,794.562845
• 500: ¥2,636.380042
查看所有的价格

-

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

IGLOO2

活跃

M2GL150

Tray

293

16 X 16 MM, 0.50 MM PITCH, FBGA-536

网格排列

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150T-1FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

1

49 In Stock

• 1: ¥410.772259
• 10: ¥387.520999
• 100: ¥365.585846
• 500: ¥344.892308
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-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

IGLOO2

90

有

SMD/SMT

+ 100 C

- 40 C

1.2 V

195 I/O

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

有

M2GL010TS-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

195

不合格

1.2 V

1.2 V

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

2051 In Stock

• 1: ¥1,542.260280
• 10: ¥1,454.962526
• 100: ¥1,372.606159
• 500: ¥1,294.911471
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-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver