对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

内存大小

内存大小

数据率

输入数量

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

最高频率

逻辑块数(LABs)

速度等级

收发器数量

逻辑单元数

长度

宽度

无铅

M2GL005-VFG400
M2GL005-VFG400
Microchip Technology 数据表

122 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

+ 85 C

微芯片技术

0 C

1.14 V

171 I/O

6060 LE

Details

1.26 V

Tray

M2GL005

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

M2GL005-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

IGLOO2

90

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

not_compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

OTHER

128 kB

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

400 MHz

11

STD

6060

17 mm

17 mm

M2GL150T-1FCG1152
M2GL150T-1FCG1152
Microchip Technology 数据表

2559 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

85 °C

M2GL150T-1FCG1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

24

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

M2GL060T-FGG676I
M2GL060T-FGG676I
Microchip Technology 数据表

2973 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-676

676-FBGA (27x27)

微芯片技术

活跃

IGLOO2

40

SMD/SMT

+ 100 C

- 40 C

1.2 V

387 I/O

56520 LE

Details

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL060

-40°C ~ 100°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

667 Mb/s

56520

1869824

4 Transceiver

M2GL090T-1FG676
M2GL090T-1FG676
Microchip Technology 数据表

2230 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

86184 LE

425 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

M2GL090T-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

27 mm

27 mm

M2GL150-FCVG484I
M2GL150-FCVG484I
Microchip Technology 数据表

2561 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-484

YES

484-BGA

484

- 40 C

微芯片技术

+ 100 C

SMD/SMT

84

IGLOO2

1.26 V

Tray

M2GL150

活跃

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

M2GL150-FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

5.27

Details

146124 LE

248 I/O

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

1.2 V

667 Mb/s

3.15 mm

现场可编程门阵列

146124

5120000

4 Transceiver

19 mm

19 mm

M2GL010T-1FG484M
M2GL010T-1FG484M
Microchip Technology 数据表

2515 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.14 V

微芯片技术

- 55 C

+ 125 C

SMD/SMT

60

IGLOO2

0.761080 oz

1.26 V

Tray

M2GL010

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

20

125 °C

M2GL010T-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

-55°C ~ 125°C (TJ)

Tray

M2GL010T

3A001.A.2.C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

MILITARY

667 Mb/s

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

M2GL060T-1FGG676I
M2GL060T-1FGG676I
Microchip Technology 数据表

2215 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676

网格排列

3

PLASTIC/EPOXY

1.2 V

M2GL060T-1FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

1.2 V

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

M2GL010T-VFG400
M2GL010T-VFG400
Microchip Technology 数据表

112 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

12084 LE

195 I/O

1.14 V

微芯片技术

0 C

+ 85 C

SMD/SMT

90

IGLOO2

3 oz

1.26 V

Tray

M2GL010

活跃

5.29

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL010T-VFG400

85 °C

30

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE, FINE PITCH

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

114 kB

667 Mb/s

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

M2GL010T-1FG484I
M2GL010T-1FG484I
Microchip Technology 数据表

41 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

12084 LE

233 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

60

IGLOO2

Tray

M2GL010

活跃

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

1.2 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

M2GL010T-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M2GL010T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

23 mm

23 mm

M2GL025TS-FCSG325I
M2GL025TS-FCSG325I
Microchip Technology 数据表

2339 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

27696 LE

180 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

M2GL025TS-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

M2GL010-FG484I
M2GL010-FG484I
Microchip Technology 数据表

41 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

12084 LE

233 I/O

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

M2GL010-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

233

2.44 mm

现场可编程门阵列

12084

933888

STD

12084

23 mm

23 mm

M2GL050TS-1FCSG325
M2GL050TS-1FCSG325
Microchip Technology 数据表

2835 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

85 °C

M2GL050TS-1FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

176

IGLOO2

200

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

M2GL050-1VF400I
M2GL050-1VF400I
Microchip Technology 数据表

2686 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

M2GL050-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

90

IGLOO2

207

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050

e0

锡铅

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

1

56340

17 mm

17 mm

含铅

M2GL050TS-FCS325I
M2GL050TS-FCS325I
Microchip Technology 数据表

2063 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

M2GL050TS-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

176

IGLOO2

200

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

M2GL025-FCS325
M2GL025-FCS325
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

27696 LE

180 I/O

1.2 V

微芯片技术

0 C

+ 85 C

SMD/SMT

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

85 °C

M2GL025-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

M2GL025

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

STD

27696

M2GL060TS-FG484
M2GL060TS-FG484
Microchip Technology 数据表

2765 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

56520 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL060

0°C ~ 85°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

M2GL050T-VF400I
M2GL050T-VF400I
Microchip Technology 数据表

2091 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

M2GL050T-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

90

IGLOO2

207

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

207

1.51 mm

现场可编程门阵列

56340

1869824

STD

56340

17 mm

17 mm

M2GL010-FGG484I
M2GL010-FGG484I
Microchip Technology 数据表

172 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

Details

12084 LE

233 I/O

1.14 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

60

IGLOO2

0.336343 oz

1.26 V

Tray

M2GL010

活跃

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

M2GL010-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

667 Mb/s

233

2.44 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

23 mm

23 mm

M2GL060T-VF400I
M2GL060T-VF400I
Microchip Technology 数据表

2726 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

90

IGLOO2

1.2 V

Tray

M2GL060

-40°C ~ 100°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

M2GL010TS-FGG484
M2GL010TS-FGG484
Microchip Technology 数据表

41 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

1.2 V

This product may require additional documentation to export from the United States.

Details

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

60

IGLOO2

Tray

M2GL010

活跃

0°C ~ 85°C (TJ)

Tray

M2GL010TS

1.14V ~ 2.625V

1.2 V

12084

933888

4 Transceiver

M2GL005S-VF400
M2GL005S-VF400
Microchip Technology 数据表

41 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

1.26 V

169

Tray

M2GL005

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

M2GL005S-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

90

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

M2GL010TS-VF400I
M2GL010TS-VF400I
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

1.2 V

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

90

IGLOO2

Tray

M2GL010

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

1.14V ~ 2.625V

1.2 V

12084

933888

4 Transceiver

M2GL150T-1FC1152I
M2GL150T-1FC1152I
Microchip Technology 数据表

2878 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.2 V

20

1.14 V

100 °C

M2GL150T-1FC1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

24

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

INDUSTRIAL

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

M2GL025-1FG484I
M2GL025-1FG484I
Microchip Technology 数据表

2145 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

1.2 V

微芯片技术

- 40 C

+ 100 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

M2GL025-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.73

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL025

e0

Tin/Lead (Sn/Pb)

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

含铅

M2GL050T-1VF400
M2GL050T-1VF400
Microchip Technology 数据表

2706 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

85 °C

M2GL050T-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

90

IGLOO2

207

Tray

M2GL050

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm