品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 内存大小 | 内存大小 | 数据率 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 逻辑单元数 | 长度 | 宽度 | 无铅 | |||||||||||||||||||||||||||||||||
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![]() | M2GL005-VFG400 | Microchip Technology | 数据表 | 122 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | VFBGA-400 | YES | 400 | 400-VFBGA (17x17) | 400 | + 85 C | 微芯片技术 | 0 C | 1.14 V | 171 I/O | 6060 LE | Details | 1.26 V | Tray | M2GL005 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 85 °C | 有 | M2GL005-VFG400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | IGLOO2 | 90 | 有 | SMD/SMT | 0°C ~ 85°C (TJ) | Tray | M2GL005 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | not_compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | 1.2 V | OTHER | 128 kB | 87.9 kB | 667 Mb/s | 171 | 1.51 mm | 现场可编程门阵列 | 6060 | 719872 | 400 MHz | 11 | STD | 6060 | 17 mm | 17 mm | |||||||||||||
![]() | M2GL150T-1FCG1152 | Microchip Technology | 数据表 | 2559 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | 574 | Tray | M2GL150 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | 4 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 85 °C | 有 | M2GL150T-1FCG1152 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | Details | 有 | 24 | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL150T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | 1 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||
![]() | M2GL060T-FGG676I | Microchip Technology | 数据表 | 2973 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-676 | 676-FBGA (27x27) | 微芯片技术 | 活跃 | IGLOO2 | 40 | 有 | SMD/SMT | + 100 C | - 40 C | 1.2 V | 387 I/O | 56520 LE | Details | This product may require additional documentation to export from the United States. | 1.2 V | Tray | M2GL060 | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 1.14V ~ 2.625V | 1.2 V | 667 Mb/s | 56520 | 1869824 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090T-1FG676 | Microchip Technology | 数据表 | 2230 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | 86184 LE | 425 I/O | 1.2 V | 微芯片技术 | 0 C | + 85 C | SMD/SMT | 有 | 40 | IGLOO2 | 1.2 V | Tray | M2GL090 | 活跃 | 27 X 27 MM, 1 MM PITCH, FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 20 | 85 °C | 无 | M2GL090T-1FG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | 0°C ~ 85°C (TJ) | Tray | M2GL090T | 85 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | 1.2 V | OTHER | 323.3 kB | 425 | 2.44 mm | 现场可编程门阵列 | 86316 | 2648064 | 4 Transceiver | 86316 | 27 mm | 27 mm | ||||||||||||||||
![]() | M2GL150-FCVG484I | Microchip Technology | 数据表 | 2561 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-484 | YES | 484-BGA | 484 | - 40 C | 微芯片技术 | + 100 C | SMD/SMT | 有 | 84 | IGLOO2 | 1.26 V | Tray | M2GL150 | 活跃 | 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484 | GRID ARRAY, FINE PITCH | 4 | PLASTIC/EPOXY | 1.2 V | 30 | 有 | M2GL150-FCVG484I | FBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | Details | 146124 LE | 248 I/O | 1.14 V | -40°C ~ 100°C (TJ) | Tray | M2GL150 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B484 | 1.2 V | 667 Mb/s | 3.15 mm | 现场可编程门阵列 | 146124 | 5120000 | 4 Transceiver | 19 mm | 19 mm | |||||||||||||||||||||||||||||
![]() | M2GL010T-1FG484M | Microchip Technology | 数据表 | 2515 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | This product may require additional documentation to export from the United States. | N | 12084 LE | 233 I/O | 1.14 V | 微芯片技术 | - 55 C | + 125 C | SMD/SMT | 有 | 60 | IGLOO2 | 0.761080 oz | 1.26 V | Tray | M2GL010 | 活跃 | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 20 | 125 °C | 无 | M2GL010T-1FG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | -55°C ~ 125°C (TJ) | Tray | M2GL010T | 3A001.A.2.C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | MILITARY | 667 Mb/s | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||
![]() | M2GL060T-1FGG676I | Microchip Technology | 数据表 | 2215 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | 1.2 V | 微芯片技术 | - 40 C | + 100 C | SMD/SMT | 有 | 40 | IGLOO2 | 1.2 V | Tray | M2GL060 | 活跃 | 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | 1.2 V | 有 | M2GL060T-1FGG676I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | This product may require additional documentation to export from the United States. | Details | 56520 LE | 387 I/O | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B676 | 1.2 V | 2.44 mm | 现场可编程门阵列 | 56520 | 1869824 | 4 Transceiver | 27 mm | 27 mm | |||||||||||||||||||||||||||||
![]() | M2GL010T-VFG400 | Microchip Technology | 数据表 | 112 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | VFBGA-400 | YES | 400 | 400-VFBGA (17x17) | 400 | 12084 LE | 195 I/O | 1.14 V | 微芯片技术 | 0 C | + 85 C | SMD/SMT | 有 | 90 | IGLOO2 | 3 oz | 1.26 V | Tray | M2GL010 | 活跃 | 5.29 | MICROSEMI CORP | 活跃 | SQUARE | LFBGA | M2GL010T-VFG400 | 有 | 85 °C | 30 | 1.2 V | BGA400,20X20,32 | PLASTIC/EPOXY | 3 | GRID ARRAY, LOW PROFILE, FINE PITCH | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | This product may require additional documentation to export from the United States. | Details | 0°C ~ 85°C (TJ) | Tray | M2GL010T | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 1.2 V | OTHER | 114 kB | 667 Mb/s | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 17 mm | 17 mm | ||||||||||||||
![]() | M2GL010T-1FG484I | Microchip Technology | 数据表 | 41 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | 12084 LE | 233 I/O | 1.2 V | 微芯片技术 | - 40 C | + 100 C | SMD/SMT | 有 | 60 | IGLOO2 | Tray | M2GL010 | 活跃 | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | 1.2 V | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 无 | M2GL010T-1FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | N | -40°C ~ 100°C (TJ) | Tray | M2GL010T | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | 114 kB | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | 1 | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||
![]() | M2GL025TS-FCSG325I | Microchip Technology | 数据表 | 2339 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | 27696 LE | 180 I/O | 1.2 V | 微芯片技术 | - 40 C | + 100 C | SMD/SMT | 有 | 176 | IGLOO2 | 1.2 V | Tray | M2GL025 | 活跃 | BGA, BGA325,21X21,20 | 网格排列 | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 有 | M2GL025TS-FCSG325I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.2 | This product may require additional documentation to export from the United States. | Details | -40°C ~ 100°C (TJ) | Tray | M2GL025TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 1.2 V | 180 | 现场可编程门阵列 | 27696 | 1130496 | 2 Transceiver | 27696 | ||||||||||||||||||||||||||
![]() | M2GL010-FG484I | Microchip Technology | 数据表 | 41 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | 12084 LE | 233 I/O | 1.2 V | 微芯片技术 | - 40 C | + 100 C | SMD/SMT | 有 | 60 | IGLOO2 | Tray | M2GL010 | 活跃 | 1.2 V | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 无 | M2GL010-FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | -40°C ~ 100°C (TJ) | Tray | M2GL010 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | STD | 12084 | 23 mm | 23 mm | ||||||||||||||||||||||
![]() | M2GL050TS-1FCSG325 | Microchip Technology | 数据表 | 2835 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | Tray | M2GL050 | 活跃 | 11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325 | 网格排列 | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 1.14 V | 85 °C | 有 | M2GL050TS-1FCSG325 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | Details | 有 | 176 | IGLOO2 | 200 | 0°C ~ 85°C (TJ) | Tray | M2GL050TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | 30 | S-PBGA-B325 | 200 | 不合格 | 1.2 V | OTHER | 200 | 现场可编程门阵列 | 56340 | 1869824 | 56340 | ||||||||||||||||||||||||||||||
![]() | M2GL050-1VF400I | Microchip Technology | 数据表 | 2686 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 1.14 V | 无 | M2GL050-1VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | N | 有 | 90 | IGLOO2 | 207 | Tray | M2GL050 | 活跃 | -40°C ~ 100°C (TJ) | Tray | M2GL050 | e0 | 锡铅 | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 228.3 kB | 207 | 1.51 mm | 现场可编程门阵列 | 56340 | 1869824 | 1 | 56340 | 17 mm | 17 mm | 含铅 | |||||||||||||||||||||
![]() | M2GL050TS-FCS325I | Microchip Technology | 数据表 | 2063 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | M2GL050 | 活跃 | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | 网格排列 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 20 | 1.14 V | 无 | M2GL050TS-FCS325I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | N | 有 | 176 | IGLOO2 | 200 | Tray | -40°C ~ 100°C (TJ) | Tray | M2GL050TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | 200 | 现场可编程门阵列 | 56340 | 1869824 | 56340 | |||||||||||||||||||||||||||||||||
![]() | M2GL025-FCS325 | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | 27696 LE | 180 I/O | 1.2 V | 微芯片技术 | 0 C | + 85 C | SMD/SMT | 有 | 176 | IGLOO2 | 1.2 V | Tray | M2GL025 | 活跃 | BGA, BGA325,21X21,20 | 网格排列 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 20 | 85 °C | 无 | M2GL025-FCS325 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | 0°C ~ 85°C (TJ) | Tray | M2GL025 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 1.2 V | OTHER | 180 | 现场可编程门阵列 | 27696 | 1130496 | STD | 27696 | |||||||||||||||||||||||||
![]() | M2GL060TS-FG484 | Microchip Technology | 数据表 | 2765 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | 活跃 | This product may require additional documentation to export from the United States. | N | 56520 LE | 267 I/O | 1.2 V | 0 C | + 85 C | SMD/SMT | 有 | 60 | IGLOO2 | 1.2 V | Tray | M2GL060 | 0°C ~ 85°C (TJ) | Tray | M2GL060TS | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050T-VF400I | Microchip Technology | 数据表 | 2091 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | M2GL050 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 1.14 V | 无 | M2GL050T-VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | N | 有 | 90 | IGLOO2 | 207 | Tray | -40°C ~ 100°C (TJ) | Tray | M2GL050T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 207 | 1.51 mm | 现场可编程门阵列 | 56340 | 1869824 | STD | 56340 | 17 mm | 17 mm | ||||||||||||||||||||||||||||
![]() | M2GL010-FGG484I | Microchip Technology | 数据表 | 172 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | Details | 12084 LE | 233 I/O | 1.14 V | 微芯片技术 | - 40 C | + 100 C | SMD/SMT | 有 | 60 | IGLOO2 | 0.336343 oz | 1.26 V | Tray | M2GL010 | 活跃 | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 有 | M2GL010-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.56 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | M2GL010 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | 667 Mb/s | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | STD | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||||
![]() | M2GL060T-VF400I | Microchip Technology | 数据表 | 2726 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-400 | 400-VFBGA (17x17) | 微芯片技术 | 活跃 | This product may require additional documentation to export from the United States. | N | 56520 LE | 207 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | 90 | IGLOO2 | 1.2 V | Tray | M2GL060 | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010TS-FGG484 | Microchip Technology | 数据表 | 41 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | 1.2 V | This product may require additional documentation to export from the United States. | Details | 12084 LE | 233 I/O | 1.2 V | 0 C | + 85 C | SMD/SMT | 有 | 60 | IGLOO2 | Tray | M2GL010 | 活跃 | 0°C ~ 85°C (TJ) | Tray | M2GL010TS | 1.14V ~ 2.625V | 1.2 V | 12084 | 933888 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-VF400 | Microchip Technology | 数据表 | 41 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | 1.26 V | 169 | Tray | M2GL005 | 活跃 | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 85 °C | 无 | M2GL005S-VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.28 | This product may require additional documentation to export from the United States. | N | 1.14 V | 有 | 90 | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL005S | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | OTHER | 171 | 1.51 mm | 现场可编程门阵列 | 6060 | 719872 | 6060 | 17 mm | 17 mm | |||||||||||||||||||||||||||
![]() | M2GL010TS-VF400I | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-400 | 400-VFBGA (17x17) | 微芯片技术 | 1.2 V | This product may require additional documentation to export from the United States. | N | 12084 LE | 195 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | 90 | IGLOO2 | Tray | M2GL010 | 活跃 | -40°C ~ 100°C (TJ) | Tray | M2GL010TS | 1.14V ~ 2.625V | 1.2 V | 12084 | 933888 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150T-1FC1152I | Microchip Technology | 数据表 | 2878 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | 574 | Tray | M2GL150 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 1.2 V | 20 | 1.14 V | 100 °C | 无 | M2GL150T-1FC1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | N | 有 | 24 | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL150T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | INDUSTRIAL | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | 1 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||
![]() | M2GL025-1FG484I | Microchip Technology | 数据表 | 2145 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | 1.2 V | 微芯片技术 | - 40 C | + 100 C | SMD/SMT | 有 | 60 | IGLOO2 | 1.2 V | Tray | M2GL025 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 无 | M2GL025-1FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.73 | This product may require additional documentation to export from the United States. | N | 27696 LE | 267 I/O | -40°C ~ 100°C (TJ) | Tray | M2GL025 | e0 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 1.2 V | 267 | 2.44 mm | 现场可编程门阵列 | 27696 | 1130496 | 1 | 4 Transceiver | 27696 | 23 mm | 23 mm | 含铅 | |||||||||||||||
![]() | M2GL050T-1VF400 | Microchip Technology | 数据表 | 2706 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | 1.14 V | 85 °C | 无 | M2GL050T-1VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | N | 有 | 90 | IGLOO2 | 207 | Tray | M2GL050 | 0°C ~ 85°C (TJ) | Tray | M2GL050T | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | OTHER | 228.3 kB | 207 | 1.51 mm | 现场可编程门阵列 | 56340 | 1869824 | 56340 | 17 mm | 17 mm |
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