对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

最大电源电压

最小电源电压

内存大小

工作电源电流

内存大小

传播延迟

接通延迟时间

数据率

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

等效门数

高度

长度

宽度

辐射硬化

无铅

M7A3P1000-1PQG208I
M7A3P1000-1PQG208I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

M7A3P1000-1PQG208I

350 MHz

FQFP

SQUARE

不推荐

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

24

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

85 °C

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

compliant

272 MHz

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1000000

3.4 mm

28 mm

28 mm

A54SX16A-TQG144I
A54SX16A-TQG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

0.25um

2.75(V)

2.5(V)

2.25(V)

-40C

924

990

表面贴装

2.75 V

Tray

A54SX16

活跃

Details

113 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

227 MHz

60

Actel

0.046530 oz

SX-A

85C

Industrial

TQFP

24000

-40C to 85C

113

16000

1452

-40°C ~ 85°C (TA)

Tray

A54SX16A

2.25V ~ 5.25V

227(MHz)

144

2.5 V

24000

1452

STD

1.4 mm

20 mm

20 mm

A54SX32A-FPQG208
A54SX32A-FPQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.24

Details

174 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

172 MHz

24

Actel

2.75 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

A54SX32A-FPQG208

172 MHz

FQFP

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

1.7 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

AFS1500-2FG256I
AFS1500-2FG256I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

SQUARE

活跃

MICROSEMI CORP

1.74

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

90

Fusion

0.014110 oz

8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

1.575 V

Tray

AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

AFS1500-2FG256I

LBGA

-40°C ~ 100°C (TJ)

Tray

AFS1500

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

1500000

1.2 mm

17 mm

17 mm

AFS600-1FGG256
AFS600-1FGG256
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

This product may require additional documentation to export from the United States.

Details

7000 LE

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.2 mm

17 mm

17 mm

A42MX36-1PQG208
A42MX36-1PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

151 MHz

24

Actel

5.25 V

Tray

A42MX36

活跃

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX36-1PQG208

83 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

54000

3.4 mm

28 mm

28 mm

APA600-FGG676I
APA600-FGG676I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

-40 °C

2.5 V

40

85 °C

APA600-FGG676I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

454 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

40

Actel

0.014110 oz

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA600

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 to 85 °C

Tray

APA600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

250

1 mm

compliant

180 MHz

S-PBGA-B676

454

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

2.7 V

2.3 V

15.8 kB

454

600000 GATES

2.44 mm

现场可编程门阵列

129024

600000

180 MHz

STD

21504

21504

600000

1.73 mm

27 mm

27 mm

A54SX16A-1TQG100
A54SX16A-1TQG100
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

263 MHz

90

Actel

0.023175 oz

2.75 V

Tray

A54SX16

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

A54SX16A-1TQG100

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

172

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

172

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

14 mm

14 mm

A40MX04-VQG80I
A40MX04-VQG80I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

80-VQFP (14x14)

80

139 MHz

90

Actel

0.233116 oz

40MX

85C

微芯片技术

INDUSTRIALC

VQFP

6000

-40C to 85C

69

6000

547

0.45UM

5.5(V)

3.3/5(V)

3(V)

-40C

547

273

表面贴装

5.5 V

Tray

A40MX04

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

未说明

85 °C

A40MX04-VQG80I

80 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.27

Details

69 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

A40MX04

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

未说明

0.65 mm

compliant

83/139(MHz)

80

S-PQFP-G80

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2.7 ns

547

6000

1 mm

14 mm

14 mm

APA300-BGG456I
APA300-BGG456I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

微芯片技术

PLASTIC/EPOXY

BGA456,26X26,50

-40 °C

2.5 V

40

85 °C

APA300-BGG456I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

290 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA300

活跃

BGA, BGA456,26X26,50

网格排列

3

-40 to 85 °C

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

245

1.27 mm

compliant

456

S-PBGA-B456

290

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

290

300000 GATES

2.54 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.73 mm

35 mm

35 mm

A54SX32A-BGG329I
A54SX32A-BGG329I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-329

329-PBGA (31x31)

微芯片技术

Details

249 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

238 MHz

27

Actel

2.75 V

Tray

A54SX32

活跃

-40°C ~ 85°C (TA)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

1.8 mm

31 mm

31 mm

A54SX32A-1TQG100M
A54SX32A-1TQG100M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

40

125 °C

A54SX32A-1TQG100M

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

81 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

90

Actel

0.023175 oz

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-55 °C

2.5 V

-55°C ~ 125°C (TC)

Tray

A54SX32A

e3

3A001.A.2.C

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5 V

2.5,2.5/5 V

MILITARY

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.4 mm

14 mm

14 mm

AX1000-FGG676I
AX1000-FGG676I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

418 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

649 MHz

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

40

85 °C

AX1000-FGG676I

-40°C ~ 85°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

M7A3P1000-1FGG144I
M7A3P1000-1FGG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

M7A3P1000-1FGG144I

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

160

ProASIC3

0.014110 oz

1.5000 V

Tray

M7A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

-40 to 85 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

272 MHz

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

A54SX16A-1TQG144I
A54SX16A-1TQG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

A54SX16A-1TQG144I

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

113 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

263 MHz

60

Actel

0.046530 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

2.5 V

40

85 °C

-40°C ~ 85°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

A3P1000-1FGG144I
A3P1000-1FGG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

A3P1000-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

-40 to 85 °C

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

13 mm

13 mm

A54SX32A-FBGG329
A54SX32A-FBGG329
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-329

329-PBGA (31x31)

微芯片技术

Details

249 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

172 MHz

27

Actel

2.75 V

Tray

A54SX32

活跃

0°C ~ 70°C (TA)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

1.8 mm

31 mm

31 mm

A54SX72A-FGG484A
A54SX72A-FGG484A
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (27X27)

400.011771 mg

微芯片技术

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

Details

360 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

217 MHz

40

-40°C ~ 125°C (TA)

Tray

A54SX72A

125 °C

-40 °C

2.25V ~ 5.25V

2.5 V

2.75 V

2.25 V

1.5 ns

108000

217 MHz

6036

6036

STD

4024

1.73 mm

23 mm

23 mm

A42MX16-2VQG100I
A42MX16-2VQG100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

40

85 °C

A42MX16-2VQG100I

117 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

215 MHz

90

Actel

3.3, 5 V

3 V

5.5 V

5.5 V

Tray

A42MX16

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

-40 to 85 °C

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2

2.1 ns

1232

24000

1 mm

14 mm

14 mm

A42MX16-1PQG208
A42MX16-1PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

MICROSEMI CORP

5.29

Details

140 I/O

3 V

0 C

+ 70 C

SMD/SMT

198 MHz

24

Actel

5.25 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX16-1PQG208

108 MHz

FQFP

SQUARE

活跃

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

3.4 mm

28 mm

28 mm

A3P250-PQG208I
A3P250-PQG208I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

A3P250-PQG208I

350 MHz

FQFP

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

1.35

Details

3000 LE

151 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

24

36864 bit

ProASIC3

0.669609 oz

1.425 V

1.575 V

MSL 3 - 168 hours

1.575 V

Tray

A3P250

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

-40°C ~ 100°C (TJ)

Tray

A3P250

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

231 MHz

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

4.5 kB

30 mA

4.5 kB

-

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

3000

36Kbit

250000

231 MHz

STD

-

6144

6144

250000

3.4 mm

28 mm

28 mm

无铅

A3PE1500-FG484
A3PE1500-FG484
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

70 °C

A3PE1500-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE1500

活跃

1.575 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

0 to 70 °C

Tray

A3PE1500

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

231 MHz

STD

38400

38400

38400

1500000

1.73 mm

23 mm

23 mm

A42MX09-PLG84A
A42MX09-PLG84A
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

174 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.6

Details

72 I/O

4.75 V

- 40 C

+ 125 C

SMD/SMT

192 MHz

16

Actel

0.239083 oz

5.25 V

Tray

A42MX09

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

A42MX09-PLG84A

-40°C ~ 125°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

5 V

AUTOMOTIVE

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

STD

2 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

A42MX24-1PQG160
A42MX24-1PQG160
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

Details

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

250 MHz

24

Actel

0.196363 oz

Tray

A42MX24

活跃

5.25 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX24-1PQG160

96.6 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

1

1410

2.1 ns

1890

36000

3.4 mm

28 mm

28 mm

A42MX36-3PQG208
A42MX36-3PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

180 MHz

24

Actel

5.25 V

Tray

A42MX36

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX36-3PQG208

100 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.3

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

180 MHz

1184

3

1822

1.9 ns

2438

54000

3.4 mm

28 mm

28 mm