2830 In Stock

• 1: ¥3,576.577201
• 10: ¥3,374.129437
• 100: ¥3,183.140978
• 500: ¥3,002.963186
查看所有的价格

-

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

1.14 V

85 °C

有

M2GL150-1FCVG484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

2070 In Stock

• 1: ¥2,792.744084
• 10: ¥2,634.664229
• 100: ¥2,485.532290
• 500: ¥2,344.841785
查看所有的价格

-

表面贴装

FBGA-256

256-FBGA (17x17)

微芯片技术

90

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000

2987 In Stock

• 1: ¥3,887.628817
• 10: ¥3,667.574353
• 100: ¥3,459.975806
• 500: ¥3,264.128117
查看所有的价格

-

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

248

Tray

M2GL150

活跃

1.26 V

1.71

MICROSEMI CORP

活跃

SQUARE

FBGA

M2GL150T-FCV484I

无

1.14 V

20

1.2 V

PLASTIC/EPOXY

GRID ARRAY, FINE PITCH

FBGA,

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

2510 In Stock

• 1: ¥999.906573
• 10: ¥943.308091
• 100: ¥889.913293
• 500: ¥839.540837
查看所有的价格

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL025T-1VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

2237 In Stock

• 1: ¥928.135296
• 10: ¥875.599339
• 100: ¥826.037115
• 500: ¥779.280298
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

无

M2GL050T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL050T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

2818 In Stock

• 1: ¥1,356.664118
• 10: ¥1,279.871806
• 100: ¥1,207.426235
• 500: ¥1,139.081355
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

Details

SMD/SMT

有

90

ProASIC3

8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

68

Tray

A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

1.5 V

1.425 V

125 °C

有

A3P250-VQG100M

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.18

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

A3P250

125 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

MILITARY

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

6144

250000

14 mm

14 mm

2780 In Stock

• 1: ¥1,093.602639
• 10: ¥1,031.700600
• 100: ¥973.302456
• 500: ¥918.209867
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL025-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

-40°C ~ 100°C (TJ)

Tray

M2GL025

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

2165 In Stock

• 1: ¥1,495.632191
• 10: ¥1,410.973764
• 100: ¥1,331.107326
• 500: ¥1,255.761626
查看所有的价格

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060

1.14V ~ 2.625V

1.2 V

56520

1869824

41 In Stock

• 1: ¥531.093186
• 10: ¥501.031310
• 100: ¥472.671049
• 500: ¥445.916083
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

0°C ~ 85°C (TJ)

Tray

M2GL010

85 °C

0 °C

1.14V ~ 2.625V

1.2 V

114 kB

12084

933888

STD

N/A

-

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

14000

有

INDUSTRIALC

微芯片技术

72

Tube

A42MX09

Obsolete

PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC84,1.2SQ

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX09-PL84I

117 MHz

QCCJ

SQUARE

Actel Corporation

Transferred

ACTEL CORP

3.6 V

5.81

PLCC

2.5/1.8(ns)

336

516

14000

72

表面贴装

5.5(V)

3.3/5(V)

3(V)

-40C to 85C

无

85C

-40C

42MX

336

0.45UM

-40°C ~ 85°C (TA)

Box

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATE AT 5.0V SUPPLY

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

129/215(MHz)

84

S-PQCC-J84

104

不合格

3.3,3.3/5,5 V

INDUSTRIAL

104

336 CLBS, 14000 GATES

4.57 mm

现场可编程门阵列

14000

2.5 ns

336

684

14000

29.3116 mm

29.3116 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

113

微芯片技术

Tray

A54SX32

Obsolete

1.40 MM HEIGHT, MO-136, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

A54SX32-TQ144M

240 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

1080

TQFP

32000

0.9(ns)

113

表面贴装

SX

3.3/5(V)

-55C to 125C

无

125C

3.63/5.5(V)

2.97/4.5(V)

1800

2880

-55C

48000

有

0.35um

-55°C ~ 125°C (TC)

SX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

240(MHz)

144

S-PQFP-G144

不合格

MILITARY

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

32000

20 mm

20 mm

5000 In Stock

• 1: ¥96.878430
• 10: ¥91.394744
• 100: ¥86.221457
• 500: ¥81.341000
查看所有的价格

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

MICROSEMI CORP

LFQFP,

5.54

3

85 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.26 V

1.14 V

1.2 V

30

84

Tray

M2GL005

活跃

6060 LE

+ 85 C

0 C

SMD/SMT

M2GL005-TQG144

有

活跃

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

1.2 V

OTHER

-

1.6 mm

现场可编程门阵列

6060

719872

STD

-

20 mm

20 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

5.24

350 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

154

Tray

M1A3P1000

Obsolete

1.425 V

M1A3P1000-PQ208M

无

Obsolete

MICROSEMI CORP

0.50 MM PITCH, PLASTIC, QFP-208

-55°C ~ 125°C (TJ)

ProASIC3

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5,1.5/3.3 V

MILITARY

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

147

Tray

M1A3PE1500

Obsolete

1.425 V

M1A3PE1500-PQ208

无

Obsolete

MICROSEMI CORP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

5.6

350 MHz

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

38400

38400

1500000

28 mm

28 mm

N/A

-

YES

208

QFF

RECTANGULAR

FLATPACK

1.575 V

1.5 V

30

1.425 V

M1AFS600-1PQ208I

无

Obsolete

MICROSEMI CORP

QFF,

5.88

3

85 °C

-40 °C

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

R-PQFP-F208

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

600000

30.6 mm

28 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

1.2 V

20

84

Tray

Obsolete

1.14 V

M2GL005S-TQ144

无

Obsolete

MICROSEMI CORP

20 X 20 MM, 0.50 MM PITCH, TQFP-144

5.57

3

85 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.26 V

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

M1A3PE1500-1PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.6

147

Tray

M1A3PE1500

Obsolete

FQFP, QFP208,1.2SQ,20

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

38400

38400

1500000

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

729-BBGA

729

729-PBGA (35x35)

微芯片技术

516

Tray

AX1000

活跃

Compliant

-55°C ~ 125°C (TA)

Axcelerator

125 °C

-55 °C

1.425V ~ 1.575V

763 MHz

1.5 V

1.575 V

1.425 V

20.3 kB

850 ps

850 ps

12096

165888

1000000

763 MHz

18144

12096

1

12096

1.73 mm

35 mm

35 mm

无

N/A

-

YES

144

125 °C

-55 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

40

3 V

A54SX16P-1TQG144M

有

Obsolete

MICROSEMI CORP

LFQFP,

5.81

280 MHz

3

e3

3A001.A.2.C

哑光锡

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

MILITARY

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

0.8 ns

1452

16000

20 mm

20 mm

100 In Stock

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

68

Tray

AGLN250

活跃

1.425 V

AGLN250V5-VQG100I

有

活跃

MICROSEMI CORP

TFQFP,

5.6

3

85 °C

-40 °C

-40°C ~ 100°C (TJ)

IGLOO nano

e3

Tin (Sn)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

14 mm

14 mm

2906 In Stock

• 1: ¥2,726.883217
• 10: ¥2,572.531337
• 100: ¥2,426.916353
• 500: ¥2,289.543732
查看所有的价格

-

Gold

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

Automotive grade

Straight

Solder

10-7

镍铁

电缆安装

1.5000 V

1.425 V

1.575 V

300

Tray

A3P1000

活跃

1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

1.425 V

125 °C

有

A3P1000-FGG484T

350 MHz

BGA

SQUARE

-55 to 125 °C

Automotive, AEC-Q100, ProASIC3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

PL

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

Socket

1.5/3.3 V

AUTOMOTIVE

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

AEC-Q100

STD

24576

24576

1000000

无

24.79 mm

23 mm

23 mm

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

Aluminum

Square, Fins

Assorted (BGA, LGA, CPU, ASIC...)

蓝色阳极氧化

484

微芯片技术

30

1.14 V

125 °C

无

A3PE600L-1FG484M

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

270

Tray

A3PE600

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

-55°C ~ 125°C (TJ)

pushPIN™

e0

活跃

3A001.A.2.C

顶部安装

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

270

不合格

1.2/1.5,1.2/3.3 V

MILITARY

推销

0.590 (15.00mm)

16.48°C/W @ 100 LFM

270

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

13824

13824

600000

--

--

--

1.575 (40.00mm)

1.575 (40.00mm)

N/A

-

Tape & Reel (TR)

*

活跃

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

微芯片技术

FLATPACK

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A42MX16-PQ100

94 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

83

Tray

A42MX16

Obsolete

QFP,

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

20 mm

14 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P400-1PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

151

Tray

M1A3P400

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm