对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

子类别

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

JESD-30代码

输出的数量

资历状况

电源

温度等级

内存大小

传播延迟

接通延迟时间

数据率

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

产品类别

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

筛选水平

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

电压 - 供电 (最大值)

电压 - 供电 (最小值)

等效门数

产品类别

高度

长度

宽度

辐射硬化

A42MX36-3PQ208
A42MX36-3PQ208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

30

Compliant

176

Tray

A42MX36

Obsolete

3 V

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

A42MX36-3PQ208

Obsolete

MICROSEMI CORP

QFP

PLASTIC, QFP-208

5.24

100 MHz

3.6 V

3.3 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

180 MHz

1184

3

1822

1.9 ns

2438

5.25 V

3 V

54000

3.4 mm

28 mm

28 mm

A42MX09-TQ176
A42MX09-TQ176
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

176

176

5.23

117 MHz

3

30

3 V

70 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

A42MX09-TQ176

Obsolete

MICROSEMI CORP

QFP

LFQFP, QFP176,1.0SQ,20

3.3 V

e0

锡铅

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

104

不合格

3.3,3.3/5,5 V

COMMERCIAL

104

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

2.5 ns

684

684

14000

24 mm

24 mm

AX2000-CQ256M
AX2000-CQ256M
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-BFCQFP with Tie Bar

YES

256

256-CQFP (75x75)

10.567001 g

256

微芯片技术

20

136

Tray

AX2000

活跃

Non-Compliant

1.425 V

Military grade

AX2000-CQ256M

活跃

MICROSEMI CORP

GQFF, TPAK256,3SQ,20

5.3

649 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK256,3SQ,20

SQUARE

FLATPACK, GUARD RING

1.575 V

1.5 V

-55°C ~ 125°C (TA)

Axcelerator

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

1.425V ~ 1.575V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F256

136

不合格

1.5,1.5/3.3,3.3 V

MILITARY

36 kB

990 ps

136

21504 CLBS, 2000000 GATES

3.3 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

MIL-STD-883 Class B

21504

0.99 ns

21504

32256

1.575 V

1.425 V

2000000

2.8 mm

36 mm

36 mm

A40MX02-PL68A
A40MX02-PL68A
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

68-LCC (J-Lead)

YES

68

68-PLCC (24.23x24.23)

68

微芯片技术

CHIP CARRIER

5.25 V

5 V

30

57

Tray

A40MX02

Obsolete

4.75 V

A40MX02-PL68A

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.54

116 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

-40°C ~ 125°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 3V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J68

不合格

AUTOMOTIVE

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.2 ns

295

3000

24.2316 mm

24.2316 mm

A42MX36-PQ240
A42MX36-PQ240
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

240

240

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

3 V

A42MX36-PQ240

Obsolete

MICROSEMI CORP

QFP

PLASTIC, QFP-240

5.79

73 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP240,1.3SQ,20

SQUARE

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G240

202

不合格

3.3,3.3/5,5 V

COMMERCIAL

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

2.7 ns

2438

2414

54000

32.1 mm

32.1 mm

A40MX04-3PL84
A40MX04-3PL84
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

84

微芯片技术

3.3 V

30

69

Tray

A40MX04

Obsolete

3 V

A40MX04-3PL84

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.24

109 MHz

3

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

1.7 ns

547

6000

29.3116 mm

29.3116 mm

A42MX09-PL84A
A42MX09-PL84A
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

84

微芯片技术

CHIP CARRIER

5.25 V

5 V

30

A42MX09

Obsolete

72

Tray

4.75 V

A42MX09-PL84A

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.54

174 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

-40°C ~ 125°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 3V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

不合格

AUTOMOTIVE

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

2 ns

684

14000

29.3116 mm

29.3116 mm

A54SX32-CQ208
A54SX32-CQ208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

208-BFCQFP with Tie Bar

YES

208

208-CQFP (75x75)

10.567001 g

208

微芯片技术

QFF, TPAK208,2.9SQ,20

5.23

205 MHz

2.97, 4.75 V

3.63, 5.25 V

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

174

Compliant

Tray

A54SX32

活跃

70 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK208,2.9SQ,20

SQUARE

FLATPACK

3.63 V

2.97 V

3.3 V

20

A54SX32-CQ208

活跃

MICROSEMI CORP

0°C ~ 70°C (TA)

SX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

48000 SYSTEM GATES AVAILABLE

8542.39.00.01

5 V

QUAD

FLAT

225

0.5 mm

unknown

205 MHz

S-CQFP-F208

246

不合格

3.3,5 V

COMMERCIAL

1 ns

1 ns

246

2880 CLBS, 32000 GATES

3.06 mm

现场可编程门阵列

2880

48000

205 MHz

2880

2880

STD

1080

1 ns

2880

2880

5.25 V

4.75 V

32000

2.8 mm

29.21 mm

29.21 mm

A40MX04-3PL68
A40MX04-3PL68
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

68-LCC (J-Lead)

YES

68

68-PLCC (24.23x24.23)

68

微芯片技术

5.24

109 MHz

57

Tray

A40MX04

Obsolete

3 V

3

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

A40MX04-3PL68

Obsolete

MICROSEMI CORP

LCC

QCCJ,

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J68

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

1.7 ns

547

6000

24.2316 mm

24.2316 mm

A40MX04-PL44M
A40MX04-PL44M
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

44-LCC (J-Lead)

YES

44

44-PLCC (16.59x16.59)

44

微芯片技术

CHIP CARRIER

3.6 V

3.3 V

30

3 V

34

Tray

A40MX04

Obsolete

A40MX04-PL44M

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.23

80 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

QCCJ

SQUARE

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J44

不合格

MILITARY

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.7 ns

547

6000

16.5862 mm

16.5862 mm

A3P600-2PQ208
A3P600-2PQ208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

Compliant

Tray

A3P600

Obsolete

1.425 V

A3P600-2PQ208

Obsolete

MICROSEMI CORP

FQFP,

5.25

350 MHz

3

85 °C

30

1.5 V

1.575 V

FLATPACK, FINE PITCH

SQUARE

FQFP

PLASTIC/EPOXY

154

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

13.5 kB

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

310 MHz

2

13824

13824

1.575 V

1.425 V

600000

3.4 mm

28 mm

28 mm

A40MX04-PL44
A40MX04-PL44
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

44-LCC (J-Lead)

YES

44

44-PLCC (16.59x16.59)

44

微芯片技术

3.3 V

未说明

34

Tray

A40MX04

Obsolete

3 V

A40MX04-PL44

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.22

80 MHz

1

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

0°C ~ 70°C (TA)

MX

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.7 ns

547

6000

16.5862 mm

16.5862 mm

A42MX09-1PQ100I
A42MX09-1PQ100I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

微芯片技术

MICROSEMI CORP

Obsolete

A42MX09-1PQ100I

83

Tray

A42MX09

Obsolete

3 V

30

3.3 V

3.6 V

FLATPACK

RECTANGULAR

QFP

PLASTIC/EPOXY

-40 °C

85 °C

3

135 MHz

5.23

PLASTIC, QFP-100

QFP

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.1 ns

684

14000

20 mm

14 mm

A40MX04-1PQ100M
A40MX04-1PQ100M
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

微芯片技术

QFP

QFP,

5.23

48 MHz

69

Tray

A40MX04

Obsolete

3 V

A40MX04-1PQ100M

3

125 °C

-55 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

3.6 V

3.3 V

30

Obsolete

MICROSEMI CORP

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

MILITARY

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

2.3 ns

547

6000

20 mm

14 mm

A42MX16-PQ100M
A42MX16-PQ100M
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

微芯片技术

Obsolete

MICROSEMI CORP

QFP

PLASTIC, QFP-100

83

Tray

A42MX16

Obsolete

3 V

5.22

94 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

3.6 V

3.3 V

30

A42MX16-PQ100M

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

MILITARY

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

20 mm

14 mm

APA1000-PQ208M
APA1000-PQ208M
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

2.7 V

2.5 V

30

158

Tray

APA1000

Obsolete

Compliant

2.3 V

APA1000-PQ208M

Obsolete

MICROSEMI CORP

0.50 MM PITCH, PLASTIC, QFP-208

5.28

180 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

-55°C ~ 125°C (TC)

ProASICPLUS

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

MILITARY

24.8 kB

158

1000000 GATES

4.1 mm

现场可编程门阵列

202752

1000000

180 MHz

56320

56320

2.7 V

2.3 V

1000000

3.4 mm

28 mm

28 mm

A42MX16-1PQ208
A42MX16-1PQ208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

3.3 V

30

140

Tray

A42MX16

Obsolete

3 V

A42MX16-1PQ208

Obsolete

MICROSEMI CORP

QFP

FQFP,

5.23

108 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

28 mm

28 mm

A42MX09-1PQ160
A42MX09-1PQ160
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

160-BQFP

YES

160

160-PQFP (28x28)

160

微芯片技术

3.3 V

30

101

Tray

A42MX09

Obsolete

3 V

A42MX09-1PQ160

Obsolete

MICROSEMI CORP

QFP

QFP,

5.23

135 MHz

3

70 °C

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

3.6 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.1 ns

684

14000

28 mm

28 mm

A42MX16-PQ208
A42MX16-PQ208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

3 V

3.3 V

30

140

Tray

A42MX16

Obsolete

A42MX16-PQ208

Obsolete

MICROSEMI CORP

QFP

FQFP,

5.22

94 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

28 mm

28 mm

A40MX02-1PL44
A40MX02-1PL44
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

44-LCC (J-Lead)

YES

44

44-PLCC (16.59x16.59)

44

微芯片技术

3.3 V

30

34

Tray

A40MX02

Obsolete

3 V

A40MX02-1PL44

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.23

92 MHz

3

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

16.5862 mm

16.5862 mm

AFS250-1PQ208
AFS250-1PQ208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

YES

208

208

93

1.425 V

AFS250-1PQ208

Obsolete

MICROSEMI CORP

QFP-208

5.88

3

85 °C

PLASTIC/EPOXY

QFF

RECTANGULAR

FLATPACK

1.575 V

1.5 V

30

Compliant

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

1.5 V

QUAD

FLAT

225

0.5 mm

unknown

R-PQFP-F208

不合格

OTHER

4.5 kB

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

250000

1.28205 GHz

1

6144

6144

1.575 V

1.425 V

250000

3.4 mm

30.6 mm

28 mm

A40MX02-3PL44
A40MX02-3PL44
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

44-LCC (J-Lead)

YES

44

44-PLCC (16.59x16.59)

44

微芯片技术

3.3 V

30

34

Tray

A40MX02

Obsolete

3 V

A40MX02-3PL44

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.25

109 MHz

3

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

1.7 ns

295

3000

16.5862 mm

16.5862 mm

A42MX24-PL84
A42MX24-PL84
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

72

Compliant

Tray

A42MX24

Obsolete

3 V

A42MX24-PL84

Obsolete

MICROSEMI CORP

LCC

PLASTIC, LCC-84

5.22

3

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

5 V

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

1410

2.5 ns

1890

1866

5.25 V

3 V

36000

3.68 mm

29.3116 mm

29.3116 mm

A3P125-VQ100
A3P125-VQ100
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

活跃

MICROSEMI CORP

TFQFP,

1.5

350 MHz

3

85 °C

微芯片技术

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

30

1.5000 V

1.425 V

1.575 V

N

ProASIC3

350 MHz

Microchip Technology / Atmel

SMD/SMT

90

0 C

+ 85 C

71 I/O

1500 LE

Tray

A3P125

活跃

1.425 V

A3P125-VQ100

0 to 70 °C

Tray

A3P125

e0

锡铅

8542.39.00.01

可编程逻辑集成电路

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

-

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

125000

STD

-

3072

125000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

AGL125V5-FG144
AGL125V5-FG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

160

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

AGL125V5-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

N

1500 LE

0 to 70 °C

Tray

AGL125V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

OTHER

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1.05 mm

13 mm

13 mm