N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

1.26 V

161

Tray

M2GL005

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL005S-VF256I

LFBGA

SQUARE

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

M2GL050-1FG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

27

IGLOO2

377

Tray

M2GL050

活跃

31 X 31 MM, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

85 °C

无

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

84

IGLOO2

248

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150TS-FCVG484I

FBGA

SQUARE

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

STD

19 mm

19 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

60

IGLOO2

267

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

-55°C ~ 125°C (TJ)

Tray

M2GL050T

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

24

IGLOO2

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

有

M2GL150TS-FCG1152I

BGA

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

90

IGLOO2

293

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

Details

有

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

85 °C

无

M2GL050T-VF400

LFBGA

SQUARE

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

M2GL005S-1TQG144

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

1.26 V

84

Tray

M2GL005

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

0°C ~ 85°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.28

1.2, 1.5 V

1.14 V

1.575 V

215

Tray

AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

1.14 V

100 °C

有

AGL1000V2-CSG281I

108 MHz

-40 to 85 °C

IGLOO

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B281

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

10 mm

10 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

144-LBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

2.5000 V

100

Compliant

Tray

APA075

活跃

0 to 70 °C

ProASICPLUS

70 °C

0 °C

2.5 V

180 MHz

3.4 kB

27648

75000

180 MHz

STD

3072

2.7 V

2.3 V

1.05 mm

13 mm

13 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

324-BGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

1.2000 V

1.14 V

1.26 V

221

Compliant

Tray

A3PE3000

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.2 V

40

1.14 V

85 °C

有

A3PE3000L-1FGG324I

BGA

-40 to 85 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.2/1.5,1.2/3.3 V

INDUSTRIAL

63 kB

25 mA

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3e+06

892.86 MHz

1

75264

75264

75264

1.26 V

1.14 V

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.24

1.2000 V

1.14 V

1.26 V

235

Compliant

Tray

A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

30

1.14 V

85 °C

无

A3P600L-1FG484I

-40 to 85 °C

ProASIC3L

e0

锡铅

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

235

不合格

1.5/3.3 V

INDUSTRIAL

13.5 kB

5 mA

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

892.86 MHz

1

13824

13824

13824

1.26 V

1.14 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.32

1.2, 1.5 V

1.14 V

1.575 V

215

Tray

AGL600

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

未说明

1.14 V

85 °C

有

AGL600V2-CSG281

108 MHz

TFBGA

SQUARE

0 to 70 °C

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

10 mm

10 mm

N/A

-

表面贴装

484-BGA

YES

484

484-FPBGA (27X27)

484

微芯片技术

SQUARE

Microsemi FPGA & SoC

活跃

MICROSEMI SOC PRODUCTS GROUP

2.75 V

5.2

BGA

2.75 V

2.25 V

2.5000 V

360

Tray

A54SX72

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

2.5 V

30

2.25 V

85 °C

无

A54SX72A-FG484I

BGA

-40 to 85 °C

SX-A

e0

无

锡铅

72000 TYPICAL GATES AVAILABLE

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

STD

1.5 ns

6036

108000

27 mm

27 mm

N/A

-

表面贴装

FBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

SMD/SMT

Microchip

Microchip Technology / Atmel

IGLOO2

Details

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

有

M2GL060-FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

1.2000 V

1.14 V

1.26 V

有

This product may require additional documentation to export from the United States.

56520 LE

387 I/O

+ 100 C

1.26 V

- 40 C

40

1.14 V

-40 to 100 °C

Tray

M2GL060

8542.39.00.01

可编程逻辑集成电路

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

667 Mb/s

2.44 mm

现场可编程门阵列

56520

FPGA - Field Programmable Gate Array

1869824

STD

4 Transceiver

FPGA - Field Programmable Gate Array

27 mm

27 mm

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

3.6 V

5.25

QFP

176

Compliant

Tray

A42MX24

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX24-2PQ208I

114.75 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

活跃

有

330 LE

+ 85 C

1.575 V

0.017637 oz

微芯片技术

0 C

90

1.425 V

SMD/SMT

-

Microchip

Microchip Technology / Atmel

231 MHz

ProASIC3

Details

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P030-VQG100

350 MHz

TFQFP

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

1.32

1.5000 V

1.425 V

1.575 V

77

Tray

A3P030

0 to 70 °C

Tray

ProASIC3

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

2 mA

-

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

30000

STD

-

768

30000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

2.7 V

5.26

2.5000 V

562

Compliant

Tray

APA750

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

2.5 V

40

2.3 V

70 °C

有

APA750-FGG896

180 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

0 to 70 °C

ProASICPLUS

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

2.5 V

BOTTOM

BALL

250

1 mm

compliant

180 MHz

S-PBGA-B896

562

不合格

2.5,2.5/3.3 V

COMMERCIAL

18 kB

562

750000 GATES

2.44 mm

现场可编程门阵列

147456

750000

180 MHz

STD

32768

32768

2.7 V

2.3 V

750000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

YES

176

176

MICROSEMI CORP

3.6 V

5.54

QFP

150

OHB65J6T

2.56

ABB

Compliant

1.40 MM HEIGHT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

3.3 V

30

3 V

70 °C

无

84 MHz

LFQFP

SQUARE

Obsolete

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

Black

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G176

150

不合格

3.3,3.3/5,5 V

COMMERCIAL

150

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

1410

2.5 ns

1890

1866

5.25 V

3 V

36000

Pistol Handle

IP65

1.4 mm

24 mm

24 mm

无

N/A

-

通孔

NO

132

132

SQUARE

Transferred

ACTEL CORP

5.5 V

5.82

Military grade

FAZ-B1/1-NA-L-SP

CCC, CSA, UL, VDE

Cutler Hammer, Div of Eaton Co

有

DIN Rail

104

CERAMIC, PGA-132

网格排列

CERAMIC, METAL-SEALED COFIRED

PGA133M,13X13

-55 °C

5 V

30

4.5 V

125 °C

无

54 MHz

PGA

e0

Tin/Lead (Sn/Pb)

125 °C

-55 °C

MAX 104 I/OS

现场可编程门阵列

CMOS

5 V

PERPENDICULAR

PIN/PEG

225

2.54 mm

compliant

1 A

S-CPGA-P132

104

不合格

5 V

MILITARY

5 ns

Branch Circuit

104

684 CLBS, 4000 GATES

4.318 mm

现场可编程门阵列

Screw

4000

MIL-STD-883

684

568

5 ns

684

684

4000

34.544 mm

34.544 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-BFCQFP with Tie Bar

256

256-CQFP (75x75)

10.567001 g

微芯片技术

136

Non-Compliant

Tray

AX2000

活跃

9-36 VDC

H345322642

cUL, UL

Simpson Electric

32-122 °F

Axcelerator

125 °C

-55 °C

1.5 V

763 MHz

36 kB

850 ps

850 ps

21504

294912

2e+06

LED

763 MHz

32256

21504

1

21504

1.575 V

1.425 V

4.5

2.8 mm

36 mm

36 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

LFBGA

Compliant

1.2 V

1.2 V

1.2 V

30

有

5.3

OHB80J6BEH

3.15

ABB

195

Tray

M2GL010

活跃

12084 LE

+ 100 C

- 40 C

SMD/SMT

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

MICROSEMI CORP

活跃

SQUARE

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

Black

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

1

12084

Pistol Handle

17 mm

17 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

676

400.011771 mg

GB1090BP24

Cutler Hammer, Div of Eaton Co

8542390000/8542390000/8542390000/8542390000/8542390000

454

Compliant

70 °C

0 °C

2.5 V

180 MHz

18 kB

750000

180 MHz

32768

2.7 V

2.3 V

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

活跃

MICROSEMI CORP

1.575 V

5.3

Hubbell

VP10487

UL;CSA

620

Compliant

Tray

A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.2 V

40

1.14 V

125 °C

有

250 MHz

BGA

SQUARE

-55°C ~ 125°C (TJ)

ProASIC3L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

100 Amps

50 to 400 Hertz

S-PBGA-B896

620

不合格

1.2/1.5,1.2/3.3 V

MILITARY

600

63 kB

4

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3e+06

75264

75264

75264

1.575 V

1.14 V

3000000

Plug

31 mm

31 mm

无