N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

Tray

161

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005S-VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

有

119

IGLOO2

1.26 V

活跃

M2GL005

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

Details

341 I/O

1.14 V

- 55 C

+ 125 C

SMD/SMT

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

BGA

250 MHz

A3PE3000L-1FGG484M

有

125 °C

40

1.2 V

-55 °C

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

1 MM PITCH, GREEN, FBGA-484

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

1.575 V

1.14 V

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

75264

3000000

23 mm

23 mm

无

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

N

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

Tray

M2GL025

活跃

1.2 V

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL025T-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.47

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

有

24

ProASIC3

151

Tray

M1A3P400

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-1PQG208I

FQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

微芯片技术

SMD/SMT

有

184

IGLOOe

1000000

1000000

215

Tray

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.2 V

20

1.14 V

100 °C

无

M1AGL1000V2-CS281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

-40°C ~ 85°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

24576

1000000

10 mm

10 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

Details

6060 LE

171 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

0.287305 oz

Tray

M2GL005

活跃

1.26 V

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

有

M2GL005-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

1

6060

17 mm

17 mm

无铅

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-55 °C

1.5 V

1.425 V

100 °C

有

M1AFS1500-1FGG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

Details

有

90

Fusion

119

Tray

M1AFS1500

活跃

LBGA,

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B256

不合格

OTHER

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1500000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

BGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

85 °C

无

M2GL005-FG484

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

6060 LE

209 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

703 kbit

64 kB

400 MHz

有

11 LAB

60

128 kB

IGLOO2

Tray

M2GL005

活跃

1.26 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

1.2 V

OTHER

1.26 V

1.14 V

128 kB

87.9 kB

-

209

2.44 mm

现场可编程门阵列

6060

719872

400 MHz

11

STD

-

6060

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090-FCSG325

活跃

MICROSEMI CORP

5.81

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

0°C ~ 85°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

活跃

M2GL090

Tray

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL090-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

1

86316

23 mm

23 mm

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

Details

86184 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

0.630643 oz

1.2 V

Tray

M2GL090

活跃

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL090-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

667 Mb/s

267

2.44 mm

现场可编程门阵列

86184

2648064

STD

4 Transceiver

86316

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

5.25

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

763 MHz

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

30

85 °C

无

AX1000-1FG676I

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

-40°C ~ 85°C (TA)

Tray

AX1000

e0

锡铅

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

763 MHz

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

微芯片技术

3.3 V

- 55 C

+ 125 C

SMD/SMT

有

1

Actel

3.3 V

Tray

A42MX36

活跃

CERAMIC, QFP-208

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

无

A42MX36-1CQ208M

83 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

This product may require additional documentation to export from the United States.

N

176 I/O

-55°C ~ 125°C (TC)

A42MX36

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

FLAT

225

0.5 mm

compliant

208

S-CQFP-F208

不合格

3.3 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1

1822

2.3 ns

2438

2414

54000

29.21 mm

29.21 mm

无

N/A

-

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

微芯片技术

APA300-BG456

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

290 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA300

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

2.5 V

30

70 °C

无

0 to 70 °C

Tray

APA300

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1.27 mm

unknown

456

S-PBGA-B456

290

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

290

300000 GATES

2.54 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.73 mm

35 mm

35 mm

N/A

-

表面贴装

CQFP-84

YES

84-CQFP (42x42)

84

微芯片技术

This product may require additional documentation to export from the United States.

N

62 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

9

Actel

2.75 V

Tray

A54SX32

活跃

QFF,

FLATPACK

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

20

125 °C

无

A54SX32A-1CQ84M

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.24

-55°C ~ 125°C (TC)

A54SX32A

e0

3A001.A.2.C

锡铅

IT CAN ALSO OPERATE WITH 3.3V AND 5V

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

225

0.635 mm

compliant

S-CQFP-F84

不合格

2.5 V

MILITARY

1800 CLBS, 48000 GATES

2.4 mm

现场可编程门阵列

48000

2880

1.2 ns

1800

48000

16.51 mm

16.51 mm

N/A

-

表面贴装

CQFP-208

208-CQFP (75x75)

微芯片技术

This product may require additional documentation to export from the United States.

N

158 I/O

2.5 V

- 55 C

+ 125 C

SMD/SMT

5 MHz

有

1

Actel

7.713328 oz

2.5 V

Tray

APA300

活跃

-55°C ~ 125°C (TC)

APA300

2.3V ~ 2.7V

2.5 V

73728

300000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

微芯片技术

3.3 V

- 55 C

+ 125 C

SMD/SMT

有

1

Actel

Tray

A42MX36

活跃

3.3 V

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

无

A42MX36-CQ208M

73 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

This product may require additional documentation to export from the United States.

N

176 I/O

-55°C ~ 125°C (TC)

A42MX36

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

FLAT

225

0.5 mm

compliant

208

S-CQFP-F208

不合格

3.3 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1822

2.7 ns

2438

2414

54000

29.21 mm

29.21 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA-896

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

N

21504 LE

586 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

有

32256 LAB

27

Actel

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

30

70 °C

无

AX2000-FG896

649 MHz

0 to 70 °C

Tray

AX2000

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

896

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

36 kB

990 ps

990 ps

-

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

649 MHz

32256

21504

STD

-

21504

0.99 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

有

60

Actel

0.014110 oz

Tray

AX500

活跃

1.575 V

0°C ~ 70°C (TA)

Tray

AX500

1.425V ~ 1.575V

1.5 V

73728

500000

8064

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

138 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

有

90

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

30

70 °C

无

AX250-2FG256

870 MHz

LBGA

SQUARE

0°C ~ 70°C (TA)

Tray

AX250

e0

TIN LEAD/TIN LEAD SILVER

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

248

2816 CLBS, 250000 GATES

1.7 mm

现场可编程门阵列

55296

250000

4224

0.74 ns

2816

4224

250000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

有

60

Actel

0.014110 oz

8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

N

370 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

-40°C ~ 85°C (TA)

Tray

APA600

85 °C

-40 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.73 mm

23 mm

23 mm

无

含铅

N/A

-

表面贴装

TQFP-64

YES

64-TQFP (10x10)

64

微芯片技术

Details

46 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

有

160

Actel

0.012720 oz

2.7 V

Tray

EX128

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

70 °C

有

EX128-PTQG64

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

0°C ~ 70°C (TA)

Tray

eX128

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

2.5 V

COMMERCIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

0.7 ns

6000

1.4 mm

10 mm

10 mm

N/A

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

微芯片技术

MICROSEMI CORP

5.23

Military grade

This product may require additional documentation to export from the United States.

N

174 I/O

2.25 V

2.75 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

1

Actel

Tray

A54SX32

活跃

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55 °C

2.5 V

20

125 °C

无

A54SX32A-1CQ208B

278 MHz

QFF

SQUARE

活跃

-55°C ~ 125°C (TJ)

A54SX32A

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

174

不合格

2.5 V

2.5,3.3/5 V

MILITARY

174

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

48000

2880

MIL-STD-883 Class B

1.1 ns

2880

2880

48000

29.21 mm

29.21 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

0.023175 oz

eX

70C

Commercial

TQFP

微芯片技术

12000

0C to 70C

81

8000

512

0.22UM

2.7(V)

2.5(V)

无

2.3(V)

0C

有

512

512

表面贴装

2.7 V

Tray

EX256

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

70 °C

有

EX256-FTQG100

178 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

2.02

Details

512 LE

81 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

有

-

90

Actel

0°C ~ 70°C (TA)

Tray

eX256

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

100

S-PQFP-G100

2.5 V

COMMERCIAL

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

1.4 ns

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

344 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

2.625 V

Tray

APA450

活跃

-40°C ~ 125°C (TJ)

Tray

APA450

2.375V ~ 2.625V

2.5 V

110592

450000

STD

1.73 mm

23 mm

23 mm