品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||
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![]() | eX256-PTQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | YES | 100-TQFP (14x14) | 100 | SMD/SMT | 有 | 90 | 微芯片技术 | Actel | 0.023175 oz | 2.7 V | Tray | EX256 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 40 | 85 °C | 有 | EX256-PTQG100I | 357 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.59 | Details | 81 I/O | 2.3 V | - 40 C | + 85 C | -40°C ~ 85°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | INDUSTRIAL | 12000 GATES | 1.6 mm | 现场可编程门阵列 | 512 | 12000 | 0.7 ns | 12000 | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | AX250-FG484M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 484-FPBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 248 I/O | 1.425 V | - 55 C | + 125 C | SMD/SMT | 649 MHz | 有 | 60 | Actel | 0.014110 oz | 1.575 V | Tray | AX250 | 活跃 | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-2FG676 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 870 MHz | 微芯片技术 | 有 | 40 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.5 V | 30 | 70 °C | 无 | AX1000-2FG676 | 870 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | N | 418 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 0°C ~ 70°C (TA) | Tray | AX1000 | e0 | 锡铅 | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 870 MHz | S-PBGA-B676 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 740 ps | 740 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 870 MHz | 18144 | 12096 | 2 | 12096 | 0.74 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | 无 | ||||||||||||||
![]() | A54SX16-TQG176I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | + 85 C | SMD/SMT | 240 MHz | 有 | 微芯片技术 | 40 | Actel | Tray | A54SX16 | 活跃 | 3.6 V | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -40 °C | 3.3 V | 40 | 85 °C | 有 | A54SX16-TQG176I | 240 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 147 I/O | 3 V | - 40 C | -40°C ~ 85°C (TA) | Tray | A54SX16 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | 不合格 | 3.3 V, 5 V | 3.3,5 V | INDUSTRIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 0.9 ns | 1452 | 1452 | 16000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||
![]() | AX1000-1FG896M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | + 125 C | SMD/SMT | 763 MHz | 微芯片技术 | 有 | 27 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | -55 °C | 1.5 V | 30 | 125 °C | 无 | AX1000-1FG896M | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Military grade | This product may require additional documentation to export from the United States. | N | 516 I/O | 1.425 V | - 55 C | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | 锡铅 | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | 无 | |||||||||||||
![]() | A54SX72A-CQ256B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-256 | YES | 256-CQFP (75x75) | 256 | - 55 C | + 125 C | SMD/SMT | 217 MHz | 微芯片技术 | 有 | 1 | Actel | 2.75 V | Tray | A54SX72 | 活跃 | QFF, | FLATPACK | CERAMIC, METAL-SEALED COFIRED | 5.18 | MICROSEMI CORP | 活跃 | SQUARE | QFF | 217 MHz | A54SX72A-CQ256B | 无 | 125 °C | 未说明 | 2.5 V | -55 °C | Military grade | This product may require additional documentation to export from the United States. | N | 213 I/O | 2.25 V | -55°C ~ 125°C (TJ) | A54SX72A | 3A001.A.2.C | IT CAN ALSO OPERATE WITH 3.3V AND 5V | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 未说明 | 0.5 mm | unknown | S-CQFP-F256 | 不合格 | 2.5 V | MILITARY | 4024 CLBS, 108000 GATES | 3.3 mm | 现场可编程门阵列 | 108000 | 6036 | MIL-STD-883 Class B | 1.4 ns | 4024 | 108000 | 36 mm | 36 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | APA300-BGG456M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-456 | YES | 456-PBGA (35x35) | 456 | 2.3 V | - 55 C | + 125 C | SMD/SMT | 180 MHz | 微芯片技术 | 有 | 24 | Actel | 2.7 V | Tray | APA300 | 活跃 | BGA, BGA456,26X26,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA456,26X26,50 | -55 °C | 2.5 V | 40 | 125 °C | 有 | APA300-BGG456M | 180 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | Details | 290 I/O | -55°C ~ 125°C (TC) | Tray | APA300 | 3A001.A.2.C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B456 | 290 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 290 | 300000 GATES | 2.54 mm | 现场可编程门阵列 | 73728 | 300000 | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||
![]() | eX256-TQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | YES | 100-TQFP (14x14) | 100 | 2.3 V | - 40 C | + 85 C | SMD/SMT | 250 MHz | 微芯片技术 | 有 | 90 | Actel | 0.023175 oz | 2.7 V | Tray | EX256 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 40 | 85 °C | 有 | EX256-TQG100I | 250 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | Details | 512 LE | 81 I/O | -40°C ~ 85°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | INDUSTRIAL | - | 12000 GATES | 1.6 mm | 现场可编程门阵列 | 512 | 12000 | STD | - | 1 ns | 12000 | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
![]() | APA1000-CQ208M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-208 | YES | 208-CQFP (75x75) | 208 | 2.5 V | - 55 C | + 125 C | SMD/SMT | 5 MHz | 微芯片技术 | 有 | 1 | Actel | 2.5 V | Tray | APA1000 | 活跃 | 5.3 | MICROSEMI CORP | 活跃 | SQUARE | GQFF | 180 MHz | APA1000-CQ208M | 无 | 125 °C | 20 | 2.5 V | -55 °C | TPAK208,2.9SQ,20 | CERAMIC, METAL-SEALED COFIRED | FLATPACK, GUARD RING | GQFF, TPAK208,2.9SQ,20 | Military grade | This product may require additional documentation to export from the United States. | N | 158 I/O | -55°C ~ 125°C (TC) | APA1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 158 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 158 | 1000000 GATES | 3.3 mm | 现场可编程门阵列 | 202752 | 1000000 | MIL-STD-883 Class B | 56320 | 1000000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1CQ208M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-208 | YES | 208-CQFP (75x75) | 208 | - 55 C | + 125 C | SMD/SMT | 278 MHz | 微芯片技术 | 有 | 1 | Actel | 2.75 V | Tray | A54SX32 | 活跃 | QFF, TPAK208,2.9SQ,20 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | 5.23 | MICROSEMI CORP | 活跃 | SQUARE | QFF | 278 MHz | A54SX32A-1CQ208M | 无 | 125 °C | 20 | 2.5 V | -55 °C | TPAK208,2.9SQ,20 | This product may require additional documentation to export from the United States. | N | 174 I/O | 2.25 V | -55°C ~ 125°C (TC) | A54SX32A | e0 | 3A001.A.2.C | 锡铅 | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 174 | 不合格 | 2.5 V | 2.5,3.3/5 V | MILITARY | 174 | 2880 CLBS, 48000 GATES | 3.3 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||
![]() | eX64-TQG64A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-64 | YES | 64-TQFP (10x10) | 64 | SMD/SMT | 250 MHz | 有 | 微芯片技术 | 160 | Actel | 0.012720 oz | Tray | EX64 | 活跃 | 2.7 V | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 40 | 125 °C | 有 | EX64-TQG64A | 250 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.6 | Details | 41 I/O | 2.3 V | - 40 C | + 125 C | -40°C ~ 125°C (TA) | Tray | eX64 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G64 | 2.5 V | AUTOMOTIVE | 3000 GATES | 1.6 mm | 现场可编程门阵列 | 128 | 3000 | STD | 1 ns | 3000 | 1.4 mm | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | AX250-1FG484M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | N | 248 I/O | 1.425 V | - 55 C | + 125 C | SMD/SMT | 763 MHz | 微芯片技术 | 有 | 60 | Actel | 0.014110 oz | 1.575 V | Tray | AX250 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.5 V | 30 | 125 °C | 无 | AX250-1FG484M | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Military grade | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TA) | Tray | AX250 | e0 | 3A001.A.2.C | 锡铅 | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 248 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | 现场可编程门阵列 | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.84 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||
![]() | A54SX32-2PQG208 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | SMD/SMT | 320 MHz | 有 | 微芯片技术 | 24 | Actel | 3.6 V | Tray | A54SX32 | 活跃 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 3.3 V | 40 | 70 °C | 有 | A54SX32-2PQG208 | 320 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 174 I/O | 3 V | 0 C | + 70 C | 0°C ~ 70°C (TA) | Tray | A54SX32 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 174 | 不合格 | 3.3 V, 5 V | 3.3,5 V | COMMERCIAL | 174 | 2880 CLBS, 32000 GATES | 4.1 mm | 现场可编程门阵列 | 48000 | 2880 | 0.7 ns | 2880 | 2880 | 32000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||
![]() | A54SX72A-1CQ256M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-256 | YES | 256-CQFP (75x75) | 256 | + 125 C | SMD/SMT | 250 MHz | 微芯片技术 | 1 | Actel | 2.75 V | Tray | A54SX72 | 活跃 | QFF, TPAK256,3SQ,20 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | TPAK256,3SQ,20 | -55 °C | 2.5 V | 20 | 125 °C | 无 | A54SX72A-1CQ256M | 250 MHz | QFF | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | This product may require additional documentation to export from the United States. | N | 213 I/O | 2.25 V | - 55 C | -55°C ~ 125°C (TC) | A54SX72A | e0 | 3A001.A.2.C | 锡铅 | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F256 | 213 | 不合格 | 2.5 V | 2.5,3.3/5 V | MILITARY | 213 | 6036 CLBS, 108000 GATES | 3.3 mm | 现场可编程门阵列 | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 36 mm | 36 mm | ||||||||||||||||||||||||||||||||||||
![]() | APA600-PQG208M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | PQFP-208 | 208 | 208-PQFP (28x28) | 微芯片技术 | 2.3 V | - 55 C | + 125 C | SMD/SMT | 180 MHz | 有 | 24 | Actel | Tray | APA600 | 活跃 | 2.7 V | This product may require additional documentation to export from the United States. | Details | 158 I/O | -55°C ~ 125°C (TC) | Tray | APA600 | 125 °C | -55 °C | 2.3V ~ 2.7V | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | 21504 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA150-FG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 256-FPBGA (17x17) | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 186 I/O | 2.3 V | - 40 C | + 85 C | SMD/SMT | 180 MHz | 有 | 90 | Actel | 0.014110 oz | 2.7 V | Tray | APA150 | 活跃 | -40°C ~ 85°C (TA) | Tray | APA150 | 2.3V ~ 2.7V | 2.5 V | 36864 | 150000 | STD | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-FG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 484-FPBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 317 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 649 MHz | 有 | 60 | Actel | 0.014110 oz | Tray | AX500 | 活跃 | 1.575 V | -40°C ~ 85°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA300-FG144 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 144-FPBGA (13x13) | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 100 I/O | 2.3 V | 0 C | + 70 C | SMD/SMT | 180 MHz | 有 | 160 | Actel | 0.014110 oz | Tray | APA300 | 活跃 | 2.7 V | 0°C ~ 70°C (TA) | Tray | APA300 | 2.3V ~ 2.7V | 2.5 V | 73728 | 300000 | STD | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA450-FG256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | YES | 256-FPBGA (17x17) | 256 | - 40 C | + 85 C | SMD/SMT | 180 MHz | 有 | 微芯片技术 | 90 | Actel | 0.014110 oz | Tray | APA450 | 活跃 | 2.7 V | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 2.5 V | 30 | 85 °C | 无 | APA450-FG256I | 180 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | N | 186 I/O | 2.3 V | -40°C ~ 85°C (TA) | Tray | APA450 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 186 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 186 | 450000 GATES | 1.8 mm | 现场可编程门阵列 | 110592 | 450000 | STD | 12288 | 450000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||
![]() | A42MX36-CQ208B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | 有 | 微芯片技术 | 1 | Actel | 3.3 V | Tray | A42MX36 | 活跃 | CERAMIC, QFP-208 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | -55 °C | 3.3 V | 20 | 125 °C | 无 | A42MX36-CQ208B | 73 MHz | GQFF | SQUARE | 活跃 | MICROSEMI CORP | 5.19 | QFP | Military grade | This product may require additional documentation to export from the United States. | N | 176 I/O | 3.3 V | - 55 C | + 125 C | SMD/SMT | -55°C ~ 125°C (TJ) | A42MX36 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 208 | S-CQFP-F208 | 不合格 | 3.3 V | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | 现场可编程门阵列 | 2560 | 54000 | MIL-STD-883 | 1822 | 2.7 ns | 2438 | 2414 | 54000 | 29.21 mm | 29.21 mm | 无 | ||||||||||||||||||||||||||||
![]() | A54SX32A-CQ256B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | CQFP-256 | 256-CQFP (75x75) | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 228 I/O | 2.25 V | - 55 C | + 125 C | SMD/SMT | 238 MHz | 有 | 1 | Actel | Tray | A54SX32 | 活跃 | 2.75 V | -55°C ~ 125°C (TJ) | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | eX64-PTQG64 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-64 | YES | 64-TQFP (10x10) | 64 | 有 | 160 | 微芯片技术 | Actel | 0.012720 oz | Tray | EX64 | 活跃 | 2.7 V | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 2.5 V | 40 | 70 °C | 有 | EX64-PTQG64 | 357 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.6 | Details | 41 I/O | 2.3 V | 0 C | + 70 C | SMD/SMT | 0°C ~ 70°C (TA) | Tray | eX64 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G64 | 2.5 V | COMMERCIAL | 3000 GATES | 1.6 mm | 现场可编程门阵列 | 128 | 3000 | 0.7 ns | 3000 | 1.4 mm | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | eX256-TQG100A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | YES | 100-TQFP (14x14) | 100 | SMD/SMT | 250 MHz | 有 | 微芯片技术 | 90 | Actel | 0.023175 oz | Tray | EX256 | 活跃 | 2.7 V | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 40 | 125 °C | 有 | EX256-TQG100A | 250 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.59 | Details | 81 I/O | 2.3 V | - 40 C | + 125 C | -40°C ~ 125°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | AUTOMOTIVE | 12000 GATES | 1.6 mm | 现场可编程门阵列 | 512 | 12000 | STD | 1 ns | 12000 | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-2PQG208 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | SMD/SMT | 320 MHz | 有 | 微芯片技术 | 24 | Actel | Tray | A54SX16 | 活跃 | 3.6 V | ROHS COMPLIANT, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 3.3 V | 40 | 70 °C | 有 | A54SX16P-2PQG208 | 320 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | Details | 175 I/O | 3 V | 0 C | + 70 C | 0°C ~ 70°C (TA) | Tray | A54SX16P | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 175 | 不合格 | 3.3 V, 5 V | 3.3,3.3/5 V | COMMERCIAL | 175 | 1452 CLBS, 16000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 1452 | 0.7 ns | 1452 | 1452 | 16000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||
![]() | APA450-BG456 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-456 | 456-PBGA (35x35) | 微芯片技术 | Tray | APA450 | 活跃 | This product may require additional documentation to export from the United States. | N | 344 I/O | 2.3 V | 0 C | + 70 C | SMD/SMT | 180 MHz | 有 | 24 | Actel | 2.5000 V | 2.3 V | 2.7 V | 2.7 V | 0 to 70 °C | Tray | APA450 | 2.3V ~ 2.7V | 456 | 2.5 V | 110592 | 450000 | STD | 1.73 mm | 35 mm | 35 mm |
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