对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

最大电源电压

最小电源电压

内存大小

传播延迟

接通延迟时间

数据率

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

筛选水平

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

等效门数

高度

长度

宽度

辐射硬化

eX256-PTQG100I
eX256-PTQG100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

SMD/SMT

90

微芯片技术

Actel

0.023175 oz

2.7 V

Tray

EX256

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

40

85 °C

EX256-PTQG100I

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

81 I/O

2.3 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

eX256

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

2.5 V

INDUSTRIAL

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

0.7 ns

12000

1.4 mm

14 mm

14 mm

AX250-FG484M
AX250-FG484M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

248 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

60

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

-55°C ~ 125°C (TA)

Tray

AX250

1.425V ~ 1.575V

1.5 V

55296

250000

4224

1.73 mm

23 mm

23 mm

AX1000-2FG676
AX1000-2FG676
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

870 MHz

微芯片技术

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

AX1000-2FG676

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

AX1000

e0

锡铅

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B676

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1000000

1.73 mm

27 mm

27 mm

A54SX16-TQG176I
A54SX16-TQG176I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

+ 85 C

SMD/SMT

240 MHz

微芯片技术

40

Actel

Tray

A54SX16

活跃

3.6 V

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

-40 °C

3.3 V

40

85 °C

A54SX16-TQG176I

240 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

147 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A54SX16

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3 V, 5 V

3.3,5 V

INDUSTRIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.9 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

AX1000-1FG896M
AX1000-1FG896M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

+ 125 C

SMD/SMT

763 MHz

微芯片技术

27

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.5 V

30

125 °C

AX1000-1FG896M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Military grade

This product may require additional documentation to export from the United States.

N

516 I/O

1.425 V

- 55 C

-55°C ~ 125°C (TA)

Tray

AX1000

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

20.3 kB

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

MIL-STD-883 Class B

1

12096

0.84 ns

12096

18144

1000000

1.73 mm

31 mm

31 mm

A54SX72A-CQ256B
A54SX72A-CQ256B
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

CQFP-256

YES

256-CQFP (75x75)

256

- 55 C

+ 125 C

SMD/SMT

217 MHz

微芯片技术

1

Actel

2.75 V

Tray

A54SX72

活跃

QFF,

FLATPACK

CERAMIC, METAL-SEALED COFIRED

5.18

MICROSEMI CORP

活跃

SQUARE

QFF

217 MHz

A54SX72A-CQ256B

125 °C

未说明

2.5 V

-55 °C

Military grade

This product may require additional documentation to export from the United States.

N

213 I/O

2.25 V

-55°C ~ 125°C (TJ)

A54SX72A

3A001.A.2.C

IT CAN ALSO OPERATE WITH 3.3V AND 5V

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

未说明

0.5 mm

unknown

S-CQFP-F256

不合格

2.5 V

MILITARY

4024 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

MIL-STD-883 Class B

1.4 ns

4024

108000

36 mm

36 mm

APA300-BGG456M
APA300-BGG456M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

微芯片技术

24

Actel

2.7 V

Tray

APA300

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

-55 °C

2.5 V

40

125 °C

APA300-BGG456M

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

290 I/O

-55°C ~ 125°C (TC)

Tray

APA300

3A001.A.2.C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

245

1.27 mm

compliant

S-PBGA-B456

290

不合格

2.5 V

2.5,2.5/3.3 V

MILITARY

290

300000 GATES

2.54 mm

现场可编程门阵列

73728

300000

8192

300000

1.73 mm

35 mm

35 mm

eX256-TQG100I
eX256-TQG100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

2.3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

90

Actel

0.023175 oz

2.7 V

Tray

EX256

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

40

85 °C

EX256-TQG100I

250 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

512 LE

81 I/O

-40°C ~ 85°C (TA)

Tray

eX256

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

2.5 V

INDUSTRIAL

-

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

STD

-

1 ns

12000

1.4 mm

14 mm

14 mm

APA1000-CQ208M
APA1000-CQ208M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

2.5 V

- 55 C

+ 125 C

SMD/SMT

5 MHz

微芯片技术

1

Actel

2.5 V

Tray

APA1000

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

GQFF

180 MHz

APA1000-CQ208M

125 °C

20

2.5 V

-55 °C

TPAK208,2.9SQ,20

CERAMIC, METAL-SEALED COFIRED

FLATPACK, GUARD RING

GQFF, TPAK208,2.9SQ,20

Military grade

This product may require additional documentation to export from the United States.

N

158 I/O

-55°C ~ 125°C (TC)

APA1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

158

不合格

2.5 V

2.5,2.5/3.3 V

MILITARY

158

1000000 GATES

3.3 mm

现场可编程门阵列

202752

1000000

MIL-STD-883 Class B

56320

1000000

29.21 mm

29.21 mm

A54SX32A-1CQ208M
A54SX32A-1CQ208M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

- 55 C

+ 125 C

SMD/SMT

278 MHz

微芯片技术

1

Actel

2.75 V

Tray

A54SX32

活跃

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

5.23

MICROSEMI CORP

活跃

SQUARE

QFF

278 MHz

A54SX32A-1CQ208M

125 °C

20

2.5 V

-55 °C

TPAK208,2.9SQ,20

This product may require additional documentation to export from the United States.

N

174 I/O

2.25 V

-55°C ~ 125°C (TC)

A54SX32A

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

174

不合格

2.5 V

2.5,3.3/5 V

MILITARY

174

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

29.21 mm

29.21 mm

eX64-TQG64A
eX64-TQG64A
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-64

YES

64-TQFP (10x10)

64

SMD/SMT

250 MHz

微芯片技术

160

Actel

0.012720 oz

Tray

EX64

活跃

2.7 V

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

40

125 °C

EX64-TQG64A

250 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.6

Details

41 I/O

2.3 V

- 40 C

+ 125 C

-40°C ~ 125°C (TA)

Tray

eX64

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

2.5 V

AUTOMOTIVE

3000 GATES

1.6 mm

现场可编程门阵列

128

3000

STD

1 ns

3000

1.4 mm

10 mm

10 mm

AX250-1FG484M
AX250-1FG484M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

N

248 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

763 MHz

微芯片技术

60

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.5 V

30

125 °C

AX250-1FG484M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TA)

Tray

AX250

e0

3A001.A.2.C

锡铅

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

248

2816 CLBS, 250000 GATES

2.44 mm

现场可编程门阵列

55296

250000

4224

MIL-STD-883 Class B

0.84 ns

2816

4224

250000

1.73 mm

23 mm

23 mm

A54SX32-2PQG208
A54SX32-2PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

SMD/SMT

320 MHz

微芯片技术

24

Actel

3.6 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

70 °C

A54SX32-2PQG208

320 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

174 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX32

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

A54SX72A-1CQ256M
A54SX72A-1CQ256M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

CQFP-256

YES

256-CQFP (75x75)

256

+ 125 C

SMD/SMT

250 MHz

微芯片技术

1

Actel

2.75 V

Tray

A54SX72

活跃

QFF, TPAK256,3SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK256,3SQ,20

-55 °C

2.5 V

20

125 °C

A54SX72A-1CQ256M

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

213 I/O

2.25 V

- 55 C

-55°C ~ 125°C (TC)

A54SX72A

e0

3A001.A.2.C

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F256

213

不合格

2.5 V

2.5,3.3/5 V

MILITARY

213

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

36 mm

36 mm

APA600-PQG208M
APA600-PQG208M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

24

Actel

Tray

APA600

活跃

2.7 V

This product may require additional documentation to export from the United States.

Details

158 I/O

-55°C ~ 125°C (TC)

Tray

APA600

125 °C

-55 °C

2.3V ~ 2.7V

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

21504

3.4 mm

28 mm

28 mm

APA150-FG256I
APA150-FG256I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

186 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

90

Actel

0.014110 oz

2.7 V

Tray

APA150

活跃

-40°C ~ 85°C (TA)

Tray

APA150

2.3V ~ 2.7V

2.5 V

36864

150000

STD

1.2 mm

17 mm

17 mm

AX500-FG484I
AX500-FG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

649 MHz

60

Actel

0.014110 oz

Tray

AX500

活跃

1.575 V

-40°C ~ 85°C (TA)

Tray

AX500

1.425V ~ 1.575V

1.5 V

73728

500000

8064

1.73 mm

23 mm

23 mm

APA300-FG144
APA300-FG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

This product may require additional documentation to export from the United States.

N

100 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

160

Actel

0.014110 oz

Tray

APA300

活跃

2.7 V

0°C ~ 70°C (TA)

Tray

APA300

2.3V ~ 2.7V

2.5 V

73728

300000

STD

1.05 mm

13 mm

13 mm

APA450-FG256I
APA450-FG256I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

180 MHz

微芯片技术

90

Actel

0.014110 oz

Tray

APA450

活跃

2.7 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

30

85 °C

APA450-FG256I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

N

186 I/O

2.3 V

-40°C ~ 85°C (TA)

Tray

APA450

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

186

不合格

2.5 V

2.5,2.5/3.3 V

INDUSTRIAL

186

450000 GATES

1.8 mm

现场可编程门阵列

110592

450000

STD

12288

450000

1.2 mm

17 mm

17 mm

A42MX36-CQ208B
A42MX36-CQ208B
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

微芯片技术

1

Actel

3.3 V

Tray

A42MX36

活跃

CERAMIC, QFP-208

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

125 °C

A42MX36-CQ208B

73 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

Military grade

This product may require additional documentation to export from the United States.

N

176 I/O

3.3 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TJ)

A42MX36

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

FLAT

225

0.5 mm

compliant

208

S-CQFP-F208

不合格

3.3 V

MILITARY

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

2560

54000

MIL-STD-883

1822

2.7 ns

2438

2414

54000

29.21 mm

29.21 mm

A54SX32A-CQ256B
A54SX32A-CQ256B
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

CQFP-256

256-CQFP (75x75)

微芯片技术

This product may require additional documentation to export from the United States.

N

228 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

1

Actel

Tray

A54SX32

活跃

2.75 V

-55°C ~ 125°C (TJ)

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

eX64-PTQG64
eX64-PTQG64
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-64

YES

64-TQFP (10x10)

64

160

微芯片技术

Actel

0.012720 oz

Tray

EX64

活跃

2.7 V

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

70 °C

EX64-PTQG64

357 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.6

Details

41 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

eX64

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

2.5 V

COMMERCIAL

3000 GATES

1.6 mm

现场可编程门阵列

128

3000

0.7 ns

3000

1.4 mm

10 mm

10 mm

eX256-TQG100A
eX256-TQG100A
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

SMD/SMT

250 MHz

微芯片技术

90

Actel

0.023175 oz

Tray

EX256

活跃

2.7 V

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

40

125 °C

EX256-TQG100A

250 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

81 I/O

2.3 V

- 40 C

+ 125 C

-40°C ~ 125°C (TA)

Tray

eX256

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

2.5 V

AUTOMOTIVE

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

STD

1 ns

12000

1.4 mm

14 mm

14 mm

A54SX16P-2PQG208
A54SX16P-2PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

SMD/SMT

320 MHz

微芯片技术

24

Actel

Tray

A54SX16

活跃

3.6 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

70 °C

A54SX16P-2PQG208

320 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

175 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3 V, 5 V

3.3,3.3/5 V

COMMERCIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

1452

16000

3.4 mm

28 mm

28 mm

APA450-BG456
APA450-BG456
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-456

456-PBGA (35x35)

微芯片技术

Tray

APA450

活跃

This product may require additional documentation to export from the United States.

N

344 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

0 to 70 °C

Tray

APA450

2.3V ~ 2.7V

456

2.5 V

110592

450000

STD

1.73 mm

35 mm

35 mm