对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

最大电源电压

最小电源电压

内存大小

传播延迟

接通延迟时间

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

筛选水平

逻辑块数(LABs)

速度等级

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

等效门数

高度

长度

宽度

辐射硬化

AFS250-2FGG256
AFS250-2FGG256
Microchip Technology 数据表

2534 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

AFS250-2FGG256

活跃

MICROSEMI CORP

This product may require additional documentation to export from the United States.

Details

3000 LE

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

90

Fusion

0.014110 oz

Tray

AFS250

活跃

1.575 V

LBGA,

0°C ~ 85°C (TJ)

Tray

AFS250

70 °C

0 °C

8542.39.00.01

1.425V ~ 1.575V

compliant

1.5 V

1.575 V

1.425 V

4.5 kB

36864

250000

1.47059 GHz

2

6144

1.2 mm

17 mm

17 mm

AFS1500-1FG484I
AFS1500-1FG484I
Microchip Technology 数据表

2673 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

1.575 V

Tray

AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

AFS1500-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

60

Fusion

0.014110 oz

-40°C ~ 100°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

A3P125-1PQG208I
A3P125-1PQG208I
Microchip Technology 数据表

24 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

-

133 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

24

ProASIC3

微芯片技术

PQFP

1.5000 V

125000

133

125000

表面贴装

1.575 V

Tray

A3P125

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

A3P125-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Industrial grade

Details

-40 to 85 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

208

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

Industrial

1

3072

3072

125000

3.4 mm

28 mm

28 mm

A54SX32A-1BG329M
A54SX32A-1BG329M
Microchip Technology 数据表

746 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

278 MHz

27

Actel

微芯片技术

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-55 °C

2.5 V

30

125 °C

A54SX32A-1BG329M

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

249 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TC)

Tray

A54SX32A

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5 V

2.5,3.3/5 V

MILITARY

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

M7A3P1000-1FGG256I
M7A3P1000-1FGG256I
Microchip Technology 数据表

2261 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

177 I/O

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

272 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

272 MHz

1

24576

1.2 mm

17 mm

17 mm

A54SX32-1PQG208
A54SX32-1PQG208
Microchip Technology 数据表

2045 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Actel

3.6 V

微芯片技术

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

70 °C

A54SX32-1PQG208

280 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

174 I/O

3 V

0 C

+ 70 C

SMD/SMT

280 MHz

24

0°C ~ 70°C (TA)

Tray

A54SX32

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

A54SX32A-1FGG256M
A54SX32A-1FGG256M
Microchip Technology 数据表

801 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

SMD/SMT

278 MHz

90

Actel

微芯片技术

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-55 °C

2.5 V

40

125 °C

A54SX32A-1FGG256M

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

203 I/O

2.25 V

- 55 C

+ 125 C

-55°C ~ 125°C (TC)

Tray

A54SX32A

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

MILITARY

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

APA1000-BGG456
APA1000-BGG456
Microchip Technology 数据表

666 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

+ 70 C

SMD/SMT

180 MHz

24

Actel

微芯片技术

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA1000

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

2.5 V

40

70 °C

APA1000-BGG456

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

356 I/O

2.3 V

0 C

0 to 70 °C

Tray

APA1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

245

1.27 mm

compliant

456

S-PBGA-B456

356

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

356

1000000 GATES

2.54 mm

现场可编程门阵列

202752

1000000

STD

56320

1000000

1.73 mm

35 mm

35 mm

APA600-FGG676
APA600-FGG676
Microchip Technology 数据表

597 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

180 MHz

40

Actel

0.014110 oz

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

Details

454 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

APA600

70 °C

0 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.73 mm

27 mm

27 mm

A54SX72A-1FGG484I
A54SX72A-1FGG484I
Microchip Technology 数据表

2580 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

40

Actel

0.014110 oz

微芯片技术

Tray

A54SX72

活跃

2.75 V

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-40 °C

2.5 V

40

85 °C

A54SX72A-1FGG484I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

360 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

-40°C ~ 85°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

360

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

A54SX72A-1FGG484M
A54SX72A-1FGG484M
Microchip Technology 数据表

578 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

SMD/SMT

250 MHz

40

Actel

微芯片技术

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

-55 °C

2.5 V

30

125 °C

A54SX72A-1FGG484M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

360 I/O

2.25 V

- 55 C

+ 125 C

-55°C ~ 125°C (TC)

Tray

A54SX72A

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

360

不合格

2.5 V

2.5,3.3/5 V

MILITARY

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

A54SX32-BG329I
A54SX32-BG329I
Microchip Technology 数据表

527 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

BGA-329

YES

329

329-PBGA (31x31)

329

微芯片技术

3.6 V

BGA, BGA329,23X23,50

网格排列

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

85 °C

A54SX32-BG329I

230 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.84

N

249 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

240 MHz

27

Actel

Tray

A54SX32

活跃

-40°C ~ 85°C (TA)

Tray

A54SX32

85 °C

-40 °C

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

1.27 mm

unknown

240 MHz

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

INDUSTRIAL

5.5 V

4.5 V

900 ps

900 ps

249

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

2880

1.8 mm

31 mm

31 mm

AFS600-1FGG256I
AFS600-1FGG256I
Microchip Technology 数据表

2931 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

This product may require additional documentation to export from the United States.

Details

7000 LE

119 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

AFS600

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.2 mm

17 mm

17 mm

A54SX72A-FGG484I
A54SX72A-FGG484I
Microchip Technology 数据表

939 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (27X27)

400.011771 mg

微芯片技术

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

Details

360 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

217 MHz

40

-40°C ~ 85°C (TA)

Tray

A54SX72A

85 °C

-40 °C

2.25V ~ 5.25V

217 MHz

2.5 V

2.75 V

2.25 V

1.5 ns

1.5 ns

6036

108000

217 MHz

6036

6036

4024

1.73 mm

23 mm

23 mm

A54SX16A-2TQG144
A54SX16A-2TQG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

60

Actel

0.046530 oz

微芯片技术

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

A54SX16A-2TQG144

294 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

294 MHz

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

A54SX32A-1PQG208
A54SX32A-1PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Actel

2.75 V

微芯片技术

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

A54SX32A-1PQG208

278 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

174 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

278 MHz

24

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

A54SX32-2BG329I
A54SX32-2BG329I
Microchip Technology 数据表

963 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

27

Actel

3.6 V

微芯片技术

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

3.3 V

30

85 °C

A54SX32-2BG329I

320 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

249 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

320 MHz

-40°C ~ 85°C (TA)

Tray

A54SX32

e0

锡铅

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

A54SX32A-2TQG100
A54SX32A-2TQG100
Microchip Technology 数据表

2829 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

90

Actel

0.023175 oz

微芯片技术

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

A54SX32A-2TQG100

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.4 mm

14 mm

14 mm

APA750-BGG456
APA750-BGG456
Microchip Technology 数据表

775 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

Details

356 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

24

Actel

2.7 V

2.3 V

2.5000 V

2.7 V

Tray

APA750

活跃

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

APA750

70 °C

0 °C

2.3V ~ 2.7V

456

2.5 V

2.7 V

2.3 V

18 kB

147456

750000

180 MHz

STD

32768

1.73 mm

35 mm

35 mm

A54SX32-BG329
A54SX32-BG329
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

BGA-329

YES

329

329-PBGA (31x31)

329

微芯片技术

BGA, BGA329,23X23,50

网格排列

PLASTIC/EPOXY

BGA329,23X23,50

70 °C

A54SX32-BG329

240 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.84

N

249 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

27

Actel

Tray

A54SX32

活跃

3.6 V

0°C ~ 70°C (TA)

Tray

A54SX32

70 °C

0 °C

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

1.27 mm

unknown

240 MHz

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

5.25 V

4.75 V

900 ps

900 ps

249

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

2880

1.8 mm

31 mm

31 mm

A54SX32A-TQG100A
A54SX32A-TQG100A
Microchip Technology 数据表

2327 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-100

100

100-TQFP (14x14)

657.000198 mg

微芯片技术

Actel

0.023175 oz

Tray

A54SX32

活跃

2.75 V

Details

81 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

238 MHz

90

-40°C ~ 125°C (TA)

Tray

A54SX32A

125 °C

-40 °C

2.25V ~ 5.25V

2.5 V

2.75 V

2.25 V

1.2 ns

48000

238 MHz

2880

2880

STD

1980

1.4 mm

14 mm

14 mm

A54SX16A-1PQG208
A54SX16A-1PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Actel

Tray

微芯片技术

A54SX16

活跃

2.75 V

FQFP, QFP208,1.2SQ

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ

2.5 V

40

70 °C

A54SX16A-1PQG208

263 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

175 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

263 MHz

24

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

175

1452 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

3.4 mm

28 mm

28 mm

A54SX72A-2PQG208I
A54SX72A-2PQG208I
Microchip Technology 数据表

600 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

SMD/SMT

294 MHz

24

Actel

2.5000 V

微芯片技术

2.25 V

2.75 V

2.75 V

Tray

A54SX72

活跃

5.26

MICROSEMI CORP

活跃

SQUARE

FQFP

294 MHz

A54SX72A-2PQG208I

85 °C

40

2.5 V

-40 °C

QFP208,1.2SQ,20

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

FQFP, QFP208,1.2SQ,20

Details

171 I/O

2.25 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

A54SX72A

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

171

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

108000

6036

2

1.1 ns

6036

6036

108000

3.4 mm

28 mm

28 mm

A54SX32A-FBG329
A54SX32A-FBG329
Microchip Technology 数据表

2422 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

Actel

2.75 V

微芯片技术

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

2.5 V

30

70 °C

A54SX32A-FBG329

172 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

N

249 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

172 MHz

27

0°C ~ 70°C (TA)

Tray

A54SX32A

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

1.7 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

A54SX32A-2FG256
A54SX32A-2FG256
Microchip Technology 数据表

2325 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

90

Actel

0.014110 oz

微芯片技术

Tray

A54SX32

活跃

2.75 V

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

A54SX32A-2FG256

70 °C

30

2.5 V

BGA256,16X16,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA256,16X16,40

N

203 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

0°C ~ 70°C (TA)

Tray

A54SX32A

e0

TIN LEAD/TIN LEAD SILVER

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.2 mm

17 mm

17 mm