N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE600

活跃

1.575 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE600-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

270 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

A3PE600

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

+ 125 C

SMD/SMT

649 MHz

微芯片技术

有

27

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

MICROSEMI CORP

5.3

活跃

SQUARE

BGA

649 MHz

AX1000-FGG896M

有

125 °C

40

1.5 V

-55 °C

BGA896,30X30,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA896,30X30,40

Military grade

This product may require additional documentation to export from the United States.

Details

516 I/O

1.425 V

- 55 C

-55°C ~ 125°C (TA)

Tray

AX1000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B896

516

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

MIL-STD-883 Class B

12096

12096

0.99 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

SMD/SMT

310 MHz

微芯片技术

有

84

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

85 °C

无

A3PE3000-2FG324I

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

N

221 I/O

1.425 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

A3PE3000

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B324

不合格

INDUSTRIAL

63 kB

25 mA

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

1.575 V

1.425 V

3000000

1.25 mm

19 mm

19 mm

无

含铅

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

0°C ~ 70°C (TA)

Tray

M7AFS600

1.5 V

110592

600000

2

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FBGA

YES

324

400.011771 mg

324

有

84

ProASIC3

0.014110 oz

1.575 V

BGA, BGA324,18X18,40

网格排列

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

未说明

70 °C

5.3

MICROSEMI CORP

活跃

SQUARE

BGA

350 MHz

A3PE3000-FG324

无

This product may require additional documentation to export from the United States.

N

221 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

1 mm

compliant

231 MHz

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

63 kB

25 mA

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

3000000

231 MHz

75264

75264

75264

1.575 V

1.425 V

3000000

1.25 mm

19 mm

19 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P400-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

178 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

A3P400

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

6.8 kB

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

1.575 V

1.425 V

400000

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

SMD/SMT

870 MHz

微芯片技术

有

40

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

40

85 °C

有

AX1000-2FGG676I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

418 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

272 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

11000 LE

0°C ~ 85°C (TJ)

Tray

A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

Details

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

Tray

M7AFS600

活跃

1.575 V

0°C ~ 70°C (TA)

Tray

M7AFS600

1.5 V

110592

600000

2

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

8542310000, 8542390000

Tray

A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

A3PE3000-FG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.77

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

231 MHz

S-PBGA-B896

620

不合格

1.5/3.3 V

INDUSTRIAL

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

N

157 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0.014110 oz

微芯片技术

ProASIC3

90

有

231 MHz

1.5000 V

1.425 V

1.575 V

Tray

A3P250

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P250-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

A3P250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

24

ProASIC3

Tray

M1A3P1000

活跃

1.575 V

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P1000-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

无

A3P030-1VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

N

77 I/O

-40 to 85 °C

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

1

768

30000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

5.5 V

Tray

A42MX24

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-3PLG84I

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

16

Actel

0.239083 oz

-40°C ~ 85°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

5.5 V

3 V

36000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P060-2VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

71 I/O

1.425 V

0 to 70 °C

Tray

A3P060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

Details

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

0°C ~ 70°C (TA)

Tray

M7AFS600

1.5 V

110592

600000

1

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

Details

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-FGG256I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS600-FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

0°C ~ 85°C (TJ)

Tray

M1AFS600

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

1.0989 GHz

S-PBGA-B256

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 70 C

SMD/SMT

1098.9 MHz

微芯片技术

有

60

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS600-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

172 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

OTHER

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

160

IGLOOe

0.014110 oz

1.575 V

Tray

AGL600

活跃

0°C ~ 70°C (TA)

Tray

AGL600V5

1.5 V

13824

110592

600000

STD

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P030

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P030-2VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

77 I/O

-40 to 85 °C

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

2

768

30000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS250-2FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

114 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

Tray

M1A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

M1A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

A3PE1500

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

40

85 °C

有

A3PE1500-FGG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

444 I/O

-40 to 85 °C

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

444

不合格

1.5/3.3 V

INDUSTRIAL

33.8 kB

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

231 MHz

STD

38400

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

70 °C

无

A3P600L-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

235 I/O

1.14 V

0 to 70 °C

Tray

A3P600L

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

235

不合格

1.5/3.3 V

COMMERCIAL

13.5 kB

5 mA

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

892.86 MHz

1

13824

13824

13824

1.26 V

1.14 V

600000

1.73 mm

23 mm

23 mm

无