N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

34 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

160 MHz

微芯片技术

有

27

Actel

0.084185 oz

5.5 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX02-1PLG44M

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tube

A40MX02

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

MILITARY

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

N

270 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

Tray

A3PE600

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

A3PE600-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

A3PE600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

270

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

270

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

Tray

AGLE3000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

70 °C

无

AGLE3000V2-FG484

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

0°C ~ 70°C (TA)

Tray

AGLE3000V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B484

341

不合格

1.2 V to 1.5 V

1.2/1.5 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

0°C ~ 85°C (TJ)

Tray

M1A3P1000

1.425V ~ 1.575V

1.5 V

147456

1000000

1

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

3 V

- 55 C

+ 125 C

SMD/SMT

172 MHz

微芯片技术

有

24

Actel

5.5 V

Tray

A42MX16

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX16-PQG208M

94 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

140 I/O

-55°C ~ 125°C (TC)

Tray

A42MX16

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

MILITARY

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

83 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

215 MHz

微芯片技术

有

66

Actel

0.062040 oz

5.5 V

Tray

A42MX09

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-PQG100M

117 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

MILITARY

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.5 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

296 MHz

有

微芯片技术

90

Actel

Tray

A42MX09

活跃

5.25 V

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-3VQG100

161 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

1.6 ns

684

14000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-1FG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

0 C

0 to 70 °C

Tray

A3PE3000

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

186 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.625 V

Tray

APA300

活跃

-40°C ~ 125°C (TJ)

Tray

APA300

2.375V ~ 2.625V

2.5 V

73728

300000

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

- 40 C

+ 85 C

SMD/SMT

188 MHz

有

微芯片技术

16

Actel

0.239083 oz

Tray

A40MX04

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-3PLG84I

109 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

69 I/O

3 V

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

1.7 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

Tray

A3P250

活跃

1.575 V

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P250-1VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

68 I/O

-40°C ~ 100°C (TJ)

Tray

A3P250

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

1

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

Details

11000 LE

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

310 MHz

有

160

ProASIC3

0.014110 oz

Tray

A3P1000

活跃

1.575 V

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P1000-2FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

+ 70 C

SMD/SMT

250 MHz

有

微芯片技术

16

Actel

0.239083 oz

5.25 V

Tray

A42MX24

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-1PLG84

96.6 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

72 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

36000

2.1 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

Details

7000 LE

270 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE600-2FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

-40 to 85 °C

Tray

A3PE600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.425 V to 1.575 V

INDUSTRIAL

-

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

-

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

1.425 V

1.575 V

Tray

AGLE3000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

AGLE3000V5-FG484

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0°C ~ 70°C (TA)

Tray

AGLE3000V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B484

341

不合格

1.5 V

1.5 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0 C

+ 70 C

SMD/SMT

278 MHz

有

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

有

A54SX32A-1FGG256

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

0 C

+ 70 C

SMD/SMT

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-PQG100

94 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

1.52

Details

608 LE

83 I/O

3 V

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

-

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

STD

-

2.8 ns

1232

24000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

N

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

0°C ~ 70°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

Tin

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

129 MHz

微芯片技术

有

-

16

Actel

0.239083 oz

5.25 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-FPLG84

70 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.26

Details

336 LE

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

336

14000

129 MHz

336

516

3.5 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85

Tray

A42MX24

活跃

5.25 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-3PQG208

FQFP

SQUARE

活跃

MICROSEMI CORP

1.6

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

24

Actel

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

- 55 C

+ 125 C

SMD/SMT

有

微芯片技术

16

Actel

0.239083 oz

Tray

A42MX24

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX24-1PLG84M

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

72 I/O

3 V

-55°C ~ 125°C (TC)

Tube

A42MX24

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

MILITARY

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

36000

2.1 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

- 40 C

+ 85 C

SMD/SMT

296 MHz

有

微芯片技术

16

Actel

0.239083 oz

5.5 V

Tray

A42MX09

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-3PLG84I

161 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

72 I/O

3 V

-40°C ~ 85°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

1.6 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS600-2FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

119 I/O

-40°C ~ 100°C (TJ)

Tray

M1AFS600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

2

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P125

活跃

1.575 V

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-2FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

A3P125

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

2

3072

125000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-100

YES

100

100-PQFP (20x14)

1.758804 g

100

SMD/SMT

237 MHz

有

微芯片技术

66

Actel

0.062040 oz

3.3, 5 V

3 V

5.25 V

Tray

A42MX16

活跃

5.25 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-3PQG100

129 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

0 C

+ 70 C

0 to 70 °C

Tray

A42MX16

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

24000

2.7 mm

20 mm

14 mm

无