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品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 附加功能 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | JESD-30代码 | 温度等级 | 数据率 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 收发器数量 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A42MX09-PG132B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PGA-132 | 132-CPGA | 微芯片技术 | This product may require additional documentation to export from the United States. | 95 I/O | 4.5 V | SMD/SMT | 250 MHz | 21 | 5.5 V | Tray | A42MX09 | 活跃 | -55°C ~ 125°C (TJ) | Tray | A42MX09 | 3.3 V, 5 V | 14000 | |||||||||||||||||||||||||||||||||||||||||||||
| A42MX09-PG132M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | PGA-132 | 微芯片技术 | This product may require additional documentation to export from the United States. | 95 I/O | 4.5 V | - 55 C | + 125 C | SMD/SMT | 5.5 V | Tray | A42MX09 | 活跃 | 250 MHz | 21 | -55°C ~ 125°C (TC) | Tray | A42MX09 | 3.3 V, 5 V | 14000 | |||||||||||||||||||||||||||||||||||||||||||||
| MPF200T-1FCG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (23x23) | 微芯片技术 | 970 mV/1.02 V | SMD/SMT | 有 | 1 | PolarFire | 1.03 V/1.08 V | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 192000 LE | 244 I/O | -40°C ~ 100°C (TJ) | Tray | MPF200T | 1.05 V | 192000 | 13619200 | |||||||||||||||||||||||||||||||||||||||||
| MPF200TL-FCVG484E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FPBGA (19x19) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 284 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | 0°C ~ 100°C (TJ) | Tray | MPF200TL | 1.05 V | 192000 | 13619200 | ||||||||||||||||||||||||||||||||||||||||||
| MPF200TS-1FCG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (23x23) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 244 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | -40°C ~ 100°C (TJ) | Tray | MPF200TS | 1.05 V | 192000 | 13619200 | ||||||||||||||||||||||||||||||||||||||||||
| MPF200TL-FCG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FPBGA (19x19) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 244 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | -40°C ~ 100°C (TJ) | Tray | MPF200TL | 1.05 V | 192000 | 13619200 | ||||||||||||||||||||||||||||||||||||||||||
| MPF200T-1FCSG325E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-325 | 325-FCBGA (11x14.5) | 微芯片技术 | 970 mV/1.02 V | SMD/SMT | 有 | 1 | PolarFire | 1.03 V/1.08 V | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 192000 LE | 170 I/O | 0°C ~ 100°C (TJ) | Tray | MPF200T | 1.05 V | 192000 | 13619200 | |||||||||||||||||||||||||||||||||||||||||
| MPF300T-1FCVG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (19x19) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 284 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | Tray | MPF300 | 活跃 | 1.03 V/1.08 V | -40°C ~ 100°C (TJ) | Tray | MPF300T | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | |||||||||||||||||||||||||||||||||||||
| MPF200T-1FCG784E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-784 | 784-FCBGA (29x29) | 微芯片技术 | SMD/SMT | 有 | 1 | PolarFire | 1.03 V/1.08 V | 364 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 192000 LE | 970 mV/1.02 V | 0°C ~ 100°C (TJ) | Tray | MPF200T | 1.05 V | 192000 | 13619200 | |||||||||||||||||||||||||||||||||||||||||
| MPF200TS-1FCG784I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-784 | 784-FCBGA (29x29) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 192000 LE | 364 I/O | 0.97 V | - 40 C | + 100 C | SMD/SMT | 有 | 1 | PolarFire | 1.08 V | Tray | MPF200 | 活跃 | -40°C ~ 100°C (TJ) | Tray | MPF200TS | 1.05 V | 12.5 Gb/s | 192000 | 13619200 | 16 Transceiver | |||||||||||||||||||||||||||||||||||||
| MPF300TS-FCG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | YES | 484-FCBGA (23x23) | 484 | 244 I/O | 0.97 V | - 40 C | 微芯片技术 | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.08 V | Tray | MPF300 | 活跃 | BGA, | 网格排列 | 4 | PLASTIC/EPOXY | -40 °C | 1.05 V | 未说明 | 100 °C | 有 | MPF300TS-FCG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.81 | This product may require additional documentation to export from the United States. | Details | 300000 LE | -40°C ~ 100°C (TJ) | Tray | MPF300TS | CMOS | 1 V, 1.05 V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | INDUSTRIAL | 12.5 Gb/s | 2.87 mm | 现场可编程门阵列 | 300000 | 21094400 | 8 Transceiver | 23 mm | 23 mm | |||||||
| MPF300T-FCG484E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 244 I/O | 0.97 V | 0 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | Tray | MPF300 | 活跃 | 1.08 V | 0°C ~ 100°C (TJ) | Tray | MPF300T | 1 V, 1.05 V | 12.5 Gb/s | 300000 | 21094400 | 8 Transceiver | ||||||||||||||||||||||||||||||||||||
| MPF300TL-FCVG484E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (19x19) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 284 I/O | 970 mV/1.02 V | 0 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.03 V/1.08 V | Tray | MPF300 | 活跃 | 0°C ~ 100°C (TJ) | Tray | MPF300TL | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | |||||||||||||||||||||||||||||||||||||
| MPF300T-FCG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | YES | 484-FCBGA (23x23) | 484 | - 40 C | + 100 C | 微芯片技术 | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 0.892167 oz | 1.08 V | Tray | MPF300 | 活跃 | BGA-484 | 网格排列 | PLASTIC/EPOXY | -40 °C | 1 V | 100 °C | 有 | MPF300T-FCG484I | BGA | SQUARE | 2.36 | MICROSEMI CORP | FPGA PolarFire Family 300000 Cells 28nm Technology 484-Pin FBGA Tray | 活跃 | Details | 300000 LE | 244 I/O | 0.97 V | -40°C ~ 100°C (TJ) | Tray | MPF300T | IT ALSO OPERATES AT 1.05 V NOM SUPPLY | CMOS | 1 V, 1.05 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | INDUSTRIAL | 12.5 Gb/s | 2.87 mm | 现场可编程门阵列 | 300000 | 21094.4Kbit | 8 Transceiver | 23 mm | 23 mm | ||||||||
| MPF300TS-1FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-536 | 536-CSPBGA (16x16) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 300 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.03 V/1.08 V | Tray | MPF300 | 活跃 | -40°C ~ 100°C (TJ) | Tray | MPF300TS | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | |||||||||||||||||||||||||||||||||||||
| MPF200TS-1FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-536 | 536-CSPBGA (16x16) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 300 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | -40°C ~ 100°C (TJ) | Tray | MPF200TS | 1.05 V | 192000 | 13619200 | ||||||||||||||||||||||||||||||||||||||||||
| MPF500TS-1FCG1152I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-1152 | 1152-FCBGA (35x35) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 584 | Tray | MPF500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | -40°C ~ 100°C (TJ) | Tray | MPF500TS | 1.05 V | 481000 | 33792000 | ||||||||||||||||||||||||||||||||||||||||||
| MPF200TLS-FCG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FPBGA (19x19) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 244 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | -40°C ~ 100°C (TJ) | Tray | MPF200TLS | 1.05 V | 192000 | 13619200 | ||||||||||||||||||||||||||||||||||||||||||
| MPF200TL-FCG484E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FPBGA (19x19) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 244 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | 0°C ~ 100°C (TJ) | Tray | MPF200TL | 1.05 V | 192000 | 13619200 | ||||||||||||||||||||||||||||||||||||||||||
| MPF500T-1FCG784E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-784 | 784-FCBGA (29x29) | 微芯片技术 | PolarFire | 388 | Tray | MPF500 | 活跃 | 1.03 V/1.08 V | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | 0°C ~ 100°C (TJ) | Tray | MPF500T | 1.05 V | 481000 | 33792000 | ||||||||||||||||||||||||||||||||||||||||||
| MPF500TL-FCG1152E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-1152 | 1152-FCBGA (35x35) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 584 | Tray | MPF500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | 0°C ~ 100°C (TJ) | Tray | MPF500TL | 1.05 V | 481000 | 33792000 | ||||||||||||||||||||||||||||||||||||||||||
| MPF500TS-1FCG784I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-784 | 784-FCBGA (29x29) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 388 | Tray | MPF500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | -40°C ~ 100°C (TJ) | Tray | MPF500TS | 1.05 V | 481000 | 33792000 | ||||||||||||||||||||||||||||||||||||||||||
| MPF200TS-FCVG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FPBGA (19x19) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 活跃 | MPF200 | Tray | 284 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | -40°C ~ 100°C (TJ) | Tray | MPF200TS | 1.05 V | 192000 | 13619200 | ||||||||||||||||||||||||||||||||||||||||||
| MPF300T-1FCG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 244 I/O | 0.97 V | - 40 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.08 V | Tray | MPF300 | 活跃 | -40°C ~ 100°C (TJ) | Tray | MPF300T | 1 V, 1.05 V | 12.5 Gb/s | 300000 | 21094.4Kbit | 8 Transceiver | ||||||||||||||||||||||||||||||||||||
| MPF200TS-FCG784I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-784 | 784-FCBGA (29x29) | 微芯片技术 | PolarFire | 1.03 V/1.08 V | 364 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 有 | 1 | -40°C ~ 100°C (TJ) | Tray | MPF200TS | 1.05 V | 192000 | 13619200 |
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A42MX09-PG132B
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX09-PG132M
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-1FCG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TL-FCVG484E
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TS-1FCG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TL-FCG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-1FCSG325E
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-1FCVG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-1FCG784E
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TS-1FCG784I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300TS-FCG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCG484E
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300TL-FCVG484E
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300TS-1FCSG536I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TS-1FCSG536I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF500TS-1FCG1152I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TLS-FCG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TL-FCG484E
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF500T-1FCG784E
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF500TL-FCG1152E
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF500TS-1FCG784I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TS-FCVG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-1FCG484I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TS-FCG784I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)