品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 引脚数 | 外壳材料 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 电阻 | 定位的数量 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 功率(瓦特) | 附加功能 | HTS代码 | 紧固类型 | 子类别 | 额定电流 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 端子间距 | Reach合规守则 | 频率 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 失败率 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 外壳尺寸,MIL | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 特征 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 触点表面处理厚度 - 配套 | 辐射硬化 | 评级结果 | ||||||||||||||||||||||||||||||||||||||||||||
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![]() | A54SX72A-FPQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.25 | 171 | Compliant | Tray | A54SX72A | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 2.5 V | 30 | 2.25 V | 70 °C | 无 | A54SX72A-FPQ208 | 156 MHz | 0°C ~ 70°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 156 MHz | S-PQFP-G208 | 171 | 不合格 | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 2.75 V | 2.25 V | 2 ns | 2 ns | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | 现场可编程门阵列 | 6036 | 108000 | 156 MHz | 6036 | 6036 | 4024 | 2 ns | 6036 | 6036 | 108000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-3PQG240 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 240 | 240 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.81 | 202 | Compliant | FQFP, QFP240,1.3SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP240,1.3SQ,20 | 3.3 V | 40 | 3 V | 70 °C | 有 | A42MX36-3PQG240 | 100 MHz | FQFP | e3 | 哑光锡 | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G240 | 202 | 不合格 | 5 V | 3.3,3.3/5,5 V | COMMERCIAL | 5.25 V | 3 V | 320 B | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 2438 | 54000 | 3.4 mm | 32 mm | 32 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-1VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | Obsolete | MICROSEMI CORP | 3.6 V | 5.31 | 81 | Compliant | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A54SX08-1VQG100 | 280 MHz | TFQFP | SQUARE | Microsemi Corporation | e3 | 哑光锡 | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 280 MHz | S-PQFP-G100 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 800 ps | 800 ps | 768 CLBS, 8000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 12000 | 280 MHz | 768 | 1 | 256 | 0.8 ns | 768 | 8000 | 1 mm | 14 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (27X27) | 微芯片技术 | 2.5000 V | 2.25 V | 2.75 V | 249 | Tray | A54SX32 | 活跃 | 0 to 70 °C | SX-A | 2.25V ~ 5.25V | 48000 | 2880 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN060-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | + 85 C | 1.575 V | Details | ProASIC3 nano | 350 MHz | Microchip Technology / Atmel | Microchip | 微芯片技术 | SMD/SMT | 1.425 V | 90 | - 20 C | 0.419608 oz | Tray | A3PN060 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20 °C | 1.5 V | 40 | 70 °C | 有 | A3PN060-VQG100 | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 0.84 | 有 | 700 LE | 18432 bit | 71 I/O | -20°C ~ 85°C (TJ) | Tray | A3PN060 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 1.425 V to 1.575 V | OTHER | - | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 18432 | 60000 | STD | - | 1536 | 60000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-FG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.16 | 11000 LE | + 125 C | - 55 C | SMD/SMT | 300 | Tray | A3P1000 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 20 | 1.425 V | 无 | A3P1000-FG484M | BGA | -55°C ~ 125°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | - | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 1000000 | - | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-2VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 3.6 V | 5.26 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A54SX16-2VQ100 | 320 MHz | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | e0 | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 1452 CLBS, 16000 GATES | 1.2 mm | 现场可编程门阵列 | 0.7 ns | 1452 | 16000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P060-1VQ100T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | Automotive grade | 71 | Tray | A3P060 | Obsolete | 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | TQFP100,.63SQ | -40 °C | 1.5 V | 1.425 V | 125 °C | 无 | A3P060-1VQ100T | 350 MHz | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G100 | 71 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 71 | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 18432 | 60000 | AEC-Q100 | 1536 | 1536 | 60000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-BG329 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 329-BBGA | 329-PBGA (31x31) | 微芯片技术 | 2.5000 V | 2.25 V | 2.75 V | 249 | Tray | A54SX32 | 活跃 | 0 to 70 °C | SX-A | 2.25V ~ 5.25V | 48000 | 2880 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX250-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.81 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AX250-2PQG208I | 870 MHz | FQFP | e3 | 哑光锡 | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 248 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 248 | 2816 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 0.74 ns | 2816 | 4224 | 250000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-3PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | 微芯片技术 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | LCC | 72 | Compliant | Tray | A42MX24 | Obsolete | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX24-3PL84I | QCCJ | SQUARE | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 84 | S-PQCC-J84 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 3 V | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 3 | 1410 | 2 ns | 1890 | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-PQ160I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | A42MX09-PQ160I | 117 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | 101 | Tray | A42MX09 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 不合格 | INDUSTRIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | 2.5 ns | 684 | 14000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-1TQ176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 176 | 176 | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | 150 | Compliant | LFQFP, QFP176,1.0SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX24-1TQ176 | 96.6 MHz | e0 | 锡铅 | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 176 | S-PQFP-G176 | 150 | 不合格 | 5 V | 3.3,3.3/5,5 V | COMMERCIAL | 5.25 V | 3 V | 150 | 1890 CLBS, 36000 GATES | 1.6 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1 | 1410 | 2.1 ns | 1890 | 1866 | 36000 | 1.4 mm | 24 mm | 24 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P015-2QNG68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | 有 | 100 °C | 1.425 V | 30 | 1.5 V | -40 °C | UNSPECIFIED | 3 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | HVQCCN, | 5.25 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | HVQCCN | A3P015-2QNG68I | 8542.39.00.01 | CMOS | QUAD | 无铅 | 260 | 0.4 mm | compliant | S-XQCC-N68 | 不合格 | INDUSTRIAL | 384 CLBS, 15000 GATES | 1 mm | 现场可编程门阵列 | 384 | 15000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-BG729 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 729-BBGA | YES | 729 | 729-PBGA (35x35) | 729 | 微芯片技术 | 30 | 1.425 V | 70 °C | 无 | AX1000-BG729 | 649 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.25 | 1.5000 V | 1.425 V | 1.575 V | 516 | Tray | AX1000 | 活跃 | Compliant | BGA, BGA729,27X27,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA729,27X27,50 | 1.5 V | 0 to 70 °C | Axcelerator | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 649 MHz | 729 | S-PBGA-B729 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.54 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | STD | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 35 mm | 35 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1225A-PLG84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 84 | 67.6 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.8 | 72 | Compliant | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC84,1.2SQ | -40 °C | 5 V | 40 | 4.5 V | 85 °C | 有 | A1225A-PLG84I | e3 | Matte Tin (Sn) | 85 °C | -40 °C | MAX 72 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | 110 MHz | S-PQCC-J84 | 83 | 不合格 | 5 V | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 5 ns | 83 | 451 CLBS, 2500 GATES | 4.57 mm | 现场可编程门阵列 | 451 | 2500 | 451 | 5 ns | 451 | 451 | 2500 | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-VFG784I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 748-FBGA | 748-FBGA (23x23) | 微芯片技术 | Tray | 活跃 | 56500 LE | + 100 C | - 40 C | -40°C ~ 100°C (TJ) | IGLOO2 | 1.14V ~ 1.26V | 56520 | 1869824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-2FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | PEI-Genesis | Bulk | 活跃 | 1.5000 V | 1.425 V | 1.575 V | 317 | AX500 | -40 to 85 °C | * | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | 484-BGA | YES | Flange | 铝合金 | 484-FPBGA (23x23) | 484 | ITT Cannon, LLC | 1.425 V | 100 °C | 有 | A3P600-1FGG484I | 350 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | - | Bulk | Metal | KJ0F1 | 活跃 | Gold | 235 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | -65°C ~ 175°C | KJ | e1 | Crimp | Receptacle, Male Pins | 22 | Tin/Silver/Copper (Sn/Ag/Cu) | 橄榄色 | 8542.39.00.01 | 卡口锁 | - | CMOS | 1.425V ~ 1.575V | BOTTOM | N (Normal) | BALL | - | 250 | 抗环境干扰 | 1 mm | compliant | 橄榄色镉 | 12-35 | S-PBGA-B484 | 不合格 | INDUSTRIAL | - | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | 1 | 13824 | 600000 | Strain Relief | 23 mm | 23 mm | 50.0µin (1.27µm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA1000-FG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 0603 (1608 Metric) | YES | 1152 | 0603 | 400.011771 mg | 1152 | KOA Speer Electronics, Inc. | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.26 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73R1J | 活跃 | 712 | Compliant | BGA, BGA1152,34X34,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA1152,34X34,40 | 2.5 V | 20 | 2.3 V | 70 °C | 无 | APA1000-FG1152 | 180 MHz | BGA | -55°C ~ 155°C | RN73R | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.25% | 2 | ±50ppm/°C | 94.2 kOhms | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | 180 MHz | S-PBGA-B1152 | 712 | 不合格 | 2.5 V | - | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 24.8 kB | 712 | 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 202752 | 1e+06 | 180 MHz | 56320 | 56320 | 1000000 | Automotive AEC-Q200, Moisture Resistant | 1.73 mm | 0.022 (0.55mm) | 35 mm | 35 mm | 无 | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLE600V5-FG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | 250 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 165 | Tray | AGLE600 | 活跃 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.5 V | 30 | 1.425 V | 70 °C | 无 | AGLE600V5-FG256 | 0°C ~ 70°C (TA) | IGLOOe | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | 165 | 不合格 | 1.5 V | COMMERCIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 13824 | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-BG313I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 313 | 313 | V7-BT | Fuji | 249 | Compliant | 网格排列 | PLASTIC/EPOXY | BGA313,25X25,50 | -40 °C | 85 °C | 无 | 230 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.84 | 85 °C | -40 °C | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B313 | 249 | 不合格 | 3.3,5 V | INDUSTRIAL | 900 ps | 249 | 现场可编程门阵列 | 48000 | 2880 | 1080 | 2880 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 320 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | 174 | Tray | A54SX32 | Obsolete | PLASTIC, MO-143, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A54SX32-2PQ208I | -40°C ~ 85°C (TA) | SX | e0 | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G208 | 不合格 | INDUSTRIAL | 2880 CLBS, 32000 GATES | 4.1 mm | 现场可编程门阵列 | 48000 | 2880 | 0.7 ns | 2880 | 32000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX72A-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 250 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.25 | 171 | Tray | A54SX72A | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 2.5 V | 30 | 2.25 V | 70 °C | 无 | A54SX72A-1PQ208 | 0°C ~ 70°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G208 | 171 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | 现场可编程门阵列 | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF100T-1FCVG484T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BFBGA | 484-FBGA (19x19) | 微芯片技术 | ABB | 284 | Tray | 活跃 | -40°C ~ 125°C (TJ) | PolarFire™ | 0.97V ~ 1.08V | 109000 | 7969178 |
A54SX72A-FPQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-3PQG240
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08-1VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-FG484
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PN060-VQG100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-FG484M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16-2VQ100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P060-1VQ100T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-BG329
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX250-2PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-3PL84I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-PQ160I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-1TQ176
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P015-2QNG68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX1000-BG729
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1225A-PLG84I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060T-VFG784I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-2FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600-1FGG484I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA1000-FG1152
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLE600V5-FG256
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-BG313I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-2PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX72A-1PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF100T-1FCVG484T2
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
