N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

Tray

M2GL050

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

1.14V ~ 2.625V

1.2 V

1.26 V

1.14 V

228.3 kB

56340

1869824

1

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

1.26 V

209

微芯片技术

Tray

M2GL005

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL005S-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

60

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

OTHER

209

2.44 mm

现场可编程门阵列

6060

719872

6060

23 mm

23 mm

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

M2GL005

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL005S-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

1.26 V

161

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

M2GL050

微芯片技术

活跃

31 X 31 MM, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

85 °C

无

M2GL050-1FG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

27

IGLOO2

377

Tray

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

IGLOO2

248

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

有

84

0°C ~ 85°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

0 C

+ 85 C

SMD/SMT

微芯片技术

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

85 °C

有

M2GL010T-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

FBGA,

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150TS-FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

STD

19 mm

19 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

IGLOO2

267

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

60

-55°C ~ 125°C (TJ)

Tray

M2GL050T

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

活跃

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

有

M2GL150TS-FCG1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

24

IGLOO2

574

Tray

M2GL150

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

+ 100 C

SMD/SMT

微芯片技术

有

90

IGLOO2

Tray

M2GL025

活跃

1.2 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

有

M2GL025-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL025

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

207

不合格

1.2 V

1.2 V

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

1

27696

17 mm

17 mm

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

IGLOO2

293

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

Details

有

90

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

Details

86184 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

有

60

IGLOO2

Tray

M2GL090

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

125 °C

有

M2GL090TS-1FGG484M

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

M2GL090TS

3A001.A.2.C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

1.2 V

MILITARY

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

1.14 V

0 C

+ 85 C

SMD/SMT

有

微芯片技术

119

IGLOO2

0.707552 oz

1.26 V

Tray

M2GL010

活跃

5.26

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL010-VFG256

有

85 °C

30

1.2 V

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE, FINE PITCH

14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256

Details

12084 LE

138 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

667 Mb/s

1.56 mm

现场可编程门阵列

12084

933888

STD

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

85 °C

无

M2GL050T-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

0°C ~ 85°C (TJ)

Tray

M2GL010TS

1.14V ~ 2.625V

1.2 V

12084

933888

4 Transceiver

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

微芯片技术

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

1.2 V

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

84

微芯片技术

Tray

M2GL005

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL005S-1TQG144

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

1.26 V

0°C ~ 85°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

1.2 V

0 C

+ 85 C

SMD/SMT

微芯片技术

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL025TS-VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

N/A

-

面板安装

484-BGA

YES

Flange

铝合金

484-FPBGA (23x23)

484

ITT Cannon, LLC

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

A3P600-1FGG484I

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.24

-

Bulk

Metal

KJ0F1

活跃

Gold

235

BGA,

-65°C ~ 175°C

KJ

e1

Crimp

Receptacle, Male Pins

22

Tin/Silver/Copper (Sn/Ag/Cu)

橄榄色

8542.39.00.01

卡口锁

-

CMOS

1.425V ~ 1.575V

BOTTOM

N (Normal)

BALL

-

250

抗环境干扰

1 mm

compliant

橄榄色镉

12-35

S-PBGA-B484

不合格

INDUSTRIAL

-

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

Strain Relief

23 mm

23 mm

50.0µin (1.27µm)

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

PLASTIC/EPOXY

QFP100,.63SQ,20

-55 °C

2.5 V

30

2.25 V

5.25

2.75 V

MICROSEMI CORP

Obsolete

SQUARE

LFQFP

263 MHz

A54SX16A-1TQ100M

无

125 °C

Miscellaneous

81

Tray

A54SX16A

Obsolete

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

-55°C ~ 125°C (TC)

SX-A

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,3.3/5 V

MILITARY

81

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

14 mm

14 mm

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

微芯片技术

30

1.425 V

100 °C

有

A3P030-1QNG48I

HQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.24

34

Tray

A3P030

活跃

HQCCN,

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

-40 °C

1.5 V

-40°C ~ 100°C (TJ)

ProASIC3

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

现场可编程门阵列

30000

1

768

30000

6 mm

6 mm

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

A3PN125

Obsolete

71

Tray

-20°C ~ 85°C (TJ)

ProASIC3 nano

1.425V ~ 1.575V

36864

125000

N/A

-

N/A

-

表面贴装

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

M2GL060

活跃

56520 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

200

Tray

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

1.2 V

56520

1869824

2 Transceiver

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

YES

256

400.011771 mg

256

AFS090-1FG256I

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.89

75

Compliant

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

85 °C

无

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

3.4 kB

2304 CLBS, 90000 GATES

1.68 mm

现场可编程门阵列

90000

1.28205 GHz

1

2304

2304

90000

1.2 mm

17 mm

17 mm

无