品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 材料 | 介电材料 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 零件状态 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 额定电流 | 频率 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 电压 | 内存大小 | 极数 | 传播延迟 | 输入类型 | 接通延迟时间 | 谐振@频率 | 电流源 | 保护措施 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 调整类型 | 端子类型 | 逻辑元件/单元数 | 产品类别 | 转速/转速 | 总 RAM 位数 | 阀门数量 | 显示类型 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 频带数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 过载保护 | 电容范围 | 等效门数 | 连接类型 | 特征 | 显示位数 | 手柄类型 | 产品类别 | 相位 | 知识产权评级 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | A3P600L-FGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 微芯片技术 | MICROSEMI CORP | 1.575 V | 0.78 | Compliant | 97 | 8542310000/8542310000/8542310000/8542310000/8542310000 | 活跃 | A3P600 | Tray | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | A3P600L-FGG144 | 350 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | 0°C ~ 85°C (TJ) | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | 不合格 | 1.5/3.3 V | COMMERCIAL | 13.5 kB | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | 现场可编程门阵列 | 110592 | 600000 | 781.25 MHz | STD | 13824 | 13824 | 13824 | 1.26 V | 1.14 V | 600000 | 1.05 mm | 13 mm | 13 mm | 无 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-CQ256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | YES | 256 | 256-CQFP (75x75) | 256 | 微芯片技术 | MICROSEMI CORP | 3.6 V | 5.18 | QFP | 202 | Tray | A42MX36 | 活跃 | 8542390000/8542390000/8542390000/8542390000/8542390000 | Compliant | GQFF, | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | -55 °C | 3.3 V | 20 | 3 V | 125 °C | 无 | A42MX36-CQ256M | 73 MHz | GQFF | SQUARE | Microsemi Corporation | 活跃 | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | S-CQFP-F256 | 不合格 | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 1184 | 1822 | 2.7 ns | 2438 | 5.5 V | 3 V | 54000 | 36 mm | 36 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-2PL68 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 68 | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | 5.25 | LCC | 57 | Tray | A40MX02 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A40MX02-2PL68 | 101 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | COMMERCIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 2 ns | 295 | 3000 | 24.2316 mm | 24.2316 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-TQ176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 176 | 176 | Obsolete | MICROSEMI CORP | 3.6 V | 5.54 | QFP | 150 | OHB65J6T | 2.56 | ABB | Compliant | 1.40 MM HEIGHT, PLASTIC, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | 3.3 V | 30 | 3 V | 70 °C | 无 | 84 MHz | LFQFP | SQUARE | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | Black | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G176 | 150 | 不合格 | 3.3,3.3/5,5 V | COMMERCIAL | 150 | 1890 CLBS, 36000 GATES | 1.6 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 1866 | 5.25 V | 3 V | 36000 | Pistol Handle | IP65 | 1.4 mm | 24 mm | 24 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1240A-PG132B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | NO | 132 | 132 | PGA | SQUARE | Transferred | ACTEL CORP | 5.5 V | 5.82 | Military grade | FAZ-B1/1-NA-L-SP | CCC, CSA, UL, VDE | Cutler Hammer, Div of Eaton Co | 有 | DIN Rail | 104 | CERAMIC, PGA-132 | 网格排列 | CERAMIC, METAL-SEALED COFIRED | PGA133M,13X13 | -55 °C | 5 V | 30 | 4.5 V | 125 °C | 无 | 54 MHz | e0 | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | MAX 104 I/OS | 现场可编程门阵列 | CMOS | 5 V | PERPENDICULAR | PIN/PEG | 225 | 2.54 mm | compliant | 1 A | S-CPGA-P132 | 104 | 不合格 | 5 V | MILITARY | 5 ns | Branch Circuit | 104 | 684 CLBS, 4000 GATES | 4.318 mm | 现场可编程门阵列 | Screw | 4000 | MIL-STD-883 | 684 | 568 | 5 ns | 684 | 684 | 4000 | 34.544 mm | 34.544 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX2000-1CQ256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 256-CQFP (75x75) | 10.567001 g | 微芯片技术 | 9-36 VDC | H345322642 | cUL, UL | Simpson Electric | 136 | Non-Compliant | Tray | AX2000 | 活跃 | 32-122 °F | Axcelerator | 125 °C | -55 °C | 1.5 V | 763 MHz | 36 kB | 850 ps | 850 ps | 21504 | 294912 | 2e+06 | LED | 763 MHz | 32256 | 21504 | 1 | 21504 | 1.575 V | 1.425 V | 4.5 | 2.8 mm | 36 mm | 36 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-1VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | SQUARE | LFBGA | Compliant | 1.2 V | 1.2 V | 1.2 V | 30 | 有 | 5.3 | OHB80J6BEH | 3.15 | ABB | 195 | Tray | M2GL010 | 活跃 | 12084 LE | + 100 C | - 40 C | SMD/SMT | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | MICROSEMI CORP | 活跃 | -40°C ~ 100°C (TJ) | IGLOO2 | 100 °C | -40 °C | Black | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 114 kB | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 1 | 12084 | Pistol Handle | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA750-FG676 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 676 | 400.011771 mg | GB1090BP24 | Cutler Hammer, Div of Eaton Co | 8542390000/8542390000/8542390000/8542390000/8542390000 | 454 | Compliant | 70 °C | 0 °C | 2.5 V | 180 MHz | 18 kB | 750000 | 180 MHz | 32768 | 2.7 V | 2.3 V | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-FGG896M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | Hubbell | VP10487 | UL;CSA | 620 | Compliant | Tray | A3PE3000 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | 250 MHz | BGA | -55°C ~ 125°C (TJ) | ProASIC3L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.5 V | BOTTOM | BALL | 250 | 1 mm | compliant | 100 Amps | 50 to 400 Hertz | S-PBGA-B896 | 620 | 不合格 | 1.2/1.5,1.2/3.3 V | MILITARY | 600 | 63 kB | 4 | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 516096 | 3e+06 | 75264 | 75264 | 75264 | 1.575 V | 1.14 V | 3000000 | Plug | 31 mm | 31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1225A-PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | Footed | YES | 84 | 84 | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | Totally Enclosed Fan Cooled | 0752XSSB42B-P | Toshiba | 无 | 72 | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC84,1.2SQ | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | 75 MHz | QCCJ | SQUARE | e0 | 通用型 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | Cast Iron | PLD EQUIVALENT GATES=6250 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | J BEND | 225 | 1.27 mm | compliant | 60 Hz | S-PQCC-J84 | 83 | 不合格 | 5 V | INDUSTRIAL | 5 ns | 5 ns | 83 | 451 CLBS, 2500 GATES | 4.572 mm | 现场可编程门阵列 | 451 | 3,600 RPM | 2500 | 451 | 5 ns | 451 | 451 | 5.5 V | 4.5 V | None | 2500 | 3 | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-TQ176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 176 | 176 | 无 | 91.8 MHz | LFQFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | QFP | FAZ-B1/3-NA-L | CCC, CSA, UL, VDE | Cutler Hammer, Div of Eaton Co | 有 | DIN Rail | 150 | 1.40 MM HEIGHT, PLASTIC, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -40 °C | 3.3 V | 30 | 3 V | 85 °C | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 1 A | S-PQFP-G176 | 150 | 不合格 | 3.3,3.3/5,5 V | INDUSTRIAL | Branch Circuit | 150 | 1890 CLBS, 36000 GATES | 1.6 mm | 现场可编程门阵列 | Screw | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 1866 | 5.5 V | 3 V | 36000 | 1.4 mm | 24 mm | 24 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A10V10B-PL68C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 68 | Obsolete | ACTEL CORP | 3.6 V | 5.9 | 11/5VX1060 | Continental Belt | 106 | 57 | Compliant | PLASTIC, MS-007-AD, LCC-68 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC68,1.0SQ | 3.3 V | 30 | 3 V | 70 °C | 无 | 50 MHz | QCCJ | SQUARE | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | MAX 57 I/OS | 现场可编程门阵列 | CMOS | 3.3 V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J68 | 57 | 不合格 | 3.3 V | COMMERCIAL | 6.5 ns | 57 | 295 CLBS, 1200 GATES | 4.445 mm | 现场可编程门阵列 | 1200 | 295 | 11 | 147 | 4.5 ns | 295 | 295 | 1200 | 24.13 mm | 24.13 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-TQ176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 176 | 176 | PLASTIC/EPOXY | 3 | FLATPACK, LOW PROFILE, FINE PITCH | LFQFP, QFP176,1.0SQ,20 | 11/5VX1120 | Continental Belt | 112 | 117 MHz | LFQFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | 无 | 85 °C | 3 V | 30 | 3.3 V | -40 °C | QFP176,1.0SQ,20 | e0 | 锡铅 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G176 | 104 | 不合格 | 3.3,3.3/5,5 V | INDUSTRIAL | 104 | 684 CLBS, 14000 GATES | 1.6 mm | 现场可编程门阵列 | 11 | 2.5 ns | 684 | 684 | 14000 | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGL600V2-FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 484 | Cast Iron | 400.011771 mg | 484 | GR-HMQ830-10-H1-140-23 | Grove Gear | 235 | Compliant | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 40 | 1.14 V | 100 °C | 有 | 108 MHz | BGA | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.81 | e1 | 锡银铜 | 85 °C | -40 °C | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | INDUSTRIAL | C-Face Quilled | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 13824 | 600000 | 13824 | 1.575 V | 1.14 V | 600000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | PEI-Genesis | 1.575 V | 5.88 | Bulk | 活跃 | 93 | Compliant | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | AFS250-1PQ208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | * | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | QUAD | FLAT | 225 | 0.5 mm | unknown | R-PQFP-F208 | 不合格 | INDUSTRIAL | 4.5 kB | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 250000 | 1.28205 GHz | 1 | 6144 | 6144 | 1.575 V | 1.425 V | 250000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGLE3000V2-FGG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 896 | 400.011771 mg | 896 | 620 | Compliant | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 70 °C | 有 | M1AGLE3000V2-FGG896 | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | e1 | 锡银铜 | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 245 | 1 mm | compliant | S-PBGA-B896 | 不合格 | COMMERCIAL | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 75264 | 3e+06 | 892.86 MHz | 75264 | 75264 | 1.575 V | 1.14 V | 3000000 | 1.73 mm | 31 mm | 31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-3PQG240I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | YES | 240 | Polytetrafluoroethylene (PTFE) | 240 | MICROSEMI CORP | 3.6 V | 5.81 | 500V | 202 | Compliant | FQFP, QFP240,1.3SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP240,1.3SQ,20 | -40 °C | 3.3 V | 40 | 3 V | 85 °C | 有 | A42MX36-3PQG240I | 100 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | -65°C ~ 125°C | A1_HV | -- | e3 | 活跃 | 哑光锡 | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G240 | 202 | 不合格 | 3.3,3.3/5,5 V | INDUSTRIAL | 320 B | 3000 @ 100MHz | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | Top | 1184 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 2438 | 5.5 V | 3 V | 0.5 ~ 8pF | 54000 | Sealed | 3.4 mm | 0.440 (11.18mm) | 32 mm | 32 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 608 LE | + 85 C | 5.5 V | 0.188543 oz | - 40 C | 微芯片技术 | 90 | 3 V | SMD/SMT | Microchip | Microchip Technology / Atmel | Actel | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX16-VQG100I | 94 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.28 | 3 V | 5.5 V | 83 | Tray | A42MX16 | 活跃 | 有 | Details | -40°C ~ 85°C (TA) | Tray | MX | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | - | 1232 CLBS, 24000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 24000 | STD | - | 2.8 ns | 1232 | 1232 | 24000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-2FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.62 | 1.5000 V | 1.425 V | 1.575 V | 8542310000/8542310000/8542310000/8542310000/8542310000 | 172 | Compliant | Tray | M1AFS600 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | 有 | M1AFS600-2FGG484I | -40 to 85 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 13824 | 1.575 V | 1.425 V | 600000 | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P060-1VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 71 I/O | + 85 C | 1.575 V | 0.289093 oz | 0 C | 90 | 1.425 V | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | Tray | A3P060 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P060-1VQG100 | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.32 | 1.5000 V | 1.425 V | 1.575 V | 有 | 700 LE | 18432 bit | 0 to 70 °C | Tray | A3P060 | e3 | Matte Tin (Sn) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.5 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 2 mA | - | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 18432 | 60000 | 1 | - | 1536 | 60000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-CQ256B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 256 | 10.567001 g | 256 | 5.26 | Military grade | 203 | Compliant | CERAMIC, QFP-256 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | TPAK256,3SQ,20 | -55 °C | 3.3 V | 20 | 2.97 V | 125 °C | 无 | A54SX32-CQ256B | 205 MHz | QFF | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.63 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 48000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F256 | 246 | 不合格 | 3.3,5 V | MILITARY | 1 ns | 246 | 2880 CLBS, 32000 GATES | 3.06 mm | 现场可编程门阵列 | 48000 | 205 MHz | MIL-STD-883 Class B | 2880 | 1080 | 1 ns | 2880 | 2880 | 5.5 V | 4.5 V | 32000 | 2.8 mm | 36 mm | 36 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-2PQ160 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | 微芯片技术 | QFP | 125 | Compliant | Tray | A42MX24 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX24-2PQ160 | 105 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | COMMERCIAL | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 5.25 V | 3 V | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGLE3000V5-FGG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 896 | 400.011771 mg | 896 | 620 | Compliant | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 70 °C | 有 | M1AGLE3000V5-FGG896 | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | e1 | 锡银铜 | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 245 | 1 mm | compliant | S-PBGA-B896 | 不合格 | COMMERCIAL | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 75264 | 3e+06 | 892.86 MHz | 75264 | 75264 | 1.575 V | 1.425 V | 3000000 | 1.73 mm | 31 mm | 31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | 95 | Compliant | 5.88 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | RECTANGULAR | QFF | M1AFS600-2PQ208I | 无 | 85 °C | 1.425 V | 30 | 1.5 V | -40 °C | PLASTIC/EPOXY | 3 | FLATPACK | QFF, | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | QUAD | FLAT | 225 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 1.47059 GHz | 2 | 13824 | 13824 | 1.575 V | 1.425 V | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | Compliant | 95 | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1AFS600-PQ208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | QUAD | FLAT | 225 | 0.5 mm | compliant | 1.0989 GHz | R-PQFP-F208 | 不合格 | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 1.0989 GHz | 13824 | 13824 | 1.575 V | 1.425 V | 600000 | 3.4 mm | 28 mm | 28 mm | 无 |
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