品牌是'Microchip' (5152)
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![]() | A54SX08-FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | 30 | 3 V | 85 °C | 无 | A54SX08-FG144I | 240 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | 3.3, 5 V | 2.97, 4.5 V | 3.63, 5.5 V | 111 | Tray | A54SX08 | 活跃 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 3.3 V | -40 to 85 °C | SX | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 3.3,5 V | INDUSTRIAL | 111 | 768 CLBS, 8000 GATES | 1.55 mm | 现场可编程门阵列 | 12000 | 768 | STD | 0.9 ns | 768 | 768 | 8000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGL1000V2-FGG484 | Microchip | 数据表 | 2638 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 484 | 微芯片技术 | 1.575 V | 5.3 | 300 | Compliant | Tray | M1AGL1000 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1AGL1000V2-FGG484 | 108 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 0°C ~ 70°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 不合格 | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | Tray | A54SX16 | 活跃 | 2.5000 V | 2.25 V | 2.75 V | 175 | -40 to 85 °C | SX-A | 2.25V ~ 5.25V | 24000 | 1452 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-2TQG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 70 °C | 有 | A54SX32-2TQG144 | 320 MHz | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | 3.3, 5 V | 2.97, 4.75 V | 3.63, 5.25 V | 113 | Tray | A54SX32 | 活跃 | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 3.3 V | 40 | 3 V | 0 to 70 °C | SX | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | 不合格 | 3.3,5 V | COMMERCIAL | 113 | 2880 CLBS, 32000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 2 | 0.7 ns | 2880 | 2880 | 32000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 微芯片技术 | 3 V | 85 °C | 无 | A54SX08-2FG144I | 320 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | 3.3, 5 V | 2.97, 4.5 V | 3.63, 5.5 V | 111 | Tray | A54SX08 | 活跃 | Compliant | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 3.3 V | 30 | -40 to 85 °C | SX | e0 | 锡铅银 | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | compliant | 320 MHz | S-PBGA-B144 | 111 | 不合格 | 5 V | 3.3,5 V | INDUSTRIAL | 5.5 V | 4.5 V | 700 ps | 700 ps | 111 | 768 CLBS, 8000 GATES | 1.55 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 768 | 2 | 256 | 0.7 ns | 768 | 768 | 8000 | 1.05 mm | 13 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-3PQ160I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | QFP | 101 | Tray | A42MX09 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX09-3PQ160I | 161 MHz | QFP | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 不合格 | INDUSTRIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | 1.6 ns | 684 | 14000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA450-FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | PEI-Genesis | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.24 | Bulk | 活跃 | 100 | APA450 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 2.5 V | 30 | 2.3 V | 85 °C | 无 | APA450-FG144I | 180 MHz | -40°C ~ 85°C (TA) | * | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 240 | 1 mm | unknown | S-PBGA-B144 | 100 | 不合格 | 2.5,2.5/3.3 V | INDUSTRIAL | 100 | 450000 GATES | 1.55 mm | 现场可编程门阵列 | 110592 | 450000 | STD | 12288 | 450000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL400V5-FGG256I | Microchip | 数据表 | 7 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | KYOCERA AVX | MICROSEMI CORP | 1.575 V | 1.46 | Tape & Reel (TR) | 活跃 | 178 | AGL400 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 1.425 V | 100 °C | 有 | AGL400V5-FGG256I | BGA | SQUARE | Microsemi Corporation | 活跃 | -40°C ~ 85°C (TA) | * | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 不合格 | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.8 mm | 现场可编程门阵列 | 9216 | 55296 | 400000 | STD | 9216 | 400000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-1PQ160M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | ams欧司朗 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | Bulk | 活跃 | 101 | A42MX09 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX09-1PQ160M | 135 MHz | QFP | - | - | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 不合格 | - | MILITARY | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | - | 14000 | 2.1 ns | 684 | 14000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGL600V5-FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 484 | 400.011771 mg | 484 | MS3101A18-08S | Amphenol | Non-Compliant | 235 | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | 网格排列 | 5.86 | 1.575 V | MICROSEMI CORP | Obsolete | SQUARE | BGA | 108 MHz | 无 | 85 °C | 1.425 V | 30 | 1.5 V | PLASTIC/EPOXY | 3 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 13824 | 600000 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 40 | 1.425 V | 85 °C | 有 | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.6 | LD9Z-6ALW-SC | CSA;cURus;CE | IDEC | 1.5000 V | 147 | Tray | M1A3PE3000 | 活跃 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.5 V | -40 to 85 °C | ProASIC3E | e3 | Matte Tin (Sn) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS600-FGG484K | Microchip | 数据表 | 2805 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 活跃 | MICROSEMI CORP | 5.79 | MRO315P | Brady | 1.5000 V | 1.425 V | 1.575 V | 172 | Tray | AFS600 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 30 | 有 | 350 MHz | BGA | SQUARE | 0 to 85 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 172 | 不合格 | 1.5,3.3 V | 172 | 现场可编程门阵列 | 110592 | 600000 | STD | 13824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS1500-1FGG676 | Microchip | 数据表 | 2927 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 676-BGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | ILME | 1.5000 V | 1.425 V | 1.575 V | Compliant | 252 | Tray | M1AFS1500 | 活跃 | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 1.425 V | 85 °C | 有 | M1AFS1500-1FGG676 | BGA | 0 to 70 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 276480 | 1.5e+06 | 1.28205 GHz | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000-2FGG484I | Microchip | 数据表 | 890 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 1.425 V | 1.575 V | 341 | Tray | M1A3PE3000 | 活跃 | 有 | 35000 LE | + 100 C | 1.575 V | 0.014110 oz | 微芯片技术 | - 40 C | 60 | 1.14 V | SMD/SMT | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.5 V | 40 | 85 °C | 有 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 738-428 | Altech | 1.5000 V | -40 to 85 °C | Tray | ProASIC3E | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | 不合格 | 1.5 V | 1.5/3.3 V | INDUSTRIAL | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | FPGA - Field Programmable Gate Array | 516096 | 3000000 | 2 | - | 75264 | 75264 | 3000000 | FPGA - Field Programmable Gate Array | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-2TQG144 | Microchip | 数据表 | 2819 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 40 | 2.25 V | 70 °C | 有 | 313 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 2.75 V | 5.25 | Turck | U-90298 | 2.5000 V | 2.25 V | 2.75 V | 113 | Tray | A54SX32 | 活跃 | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 2.5 V | 0 to 70 °C | SX-A | e3 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 113 | 2880 CLBS, 48000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 2 | 0.9 ns | 2880 | 2880 | 48000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-2PQG208I | Microchip | 数据表 | 2878 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 85 °C | 有 | 294 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 2.75 V | 5.25 | Cutler Hammer, Div of Eaton Corp | DD367NWKW-00V3 | 2.5000 V | 175 | Tray | A54SX16 | 活跃 | FQFP, QFP208,1.2SQ | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ | -40 °C | 2.5 V | 40 | 2.25 V | -40 to 85 °C | SX-A | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 175 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 175 | 1452 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 1452 | 2 | 1 ns | 1452 | 1452 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600L-1FGG144I | Microchip | 数据表 | 2386 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 微芯片技术 | 40 | 1.14 V | 85 °C | 有 | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | 738B-BOX | Arrow Hart - Cooper Wiring Devices | 1.2000 V | 1.14 V | 1.26 V | 97 | Compliant | Tray | A3P600 | 活跃 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 1.2 V | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | 不合格 | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | 现场可编程门阵列 | 110592 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-1FG676 | Microchip | 数据表 | 2583 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Foot Mount,Rigid | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | 活跃 | Totally Enclosed Fan Cooled | LM60036 | CSA, UL | Lincoln Electric | 1.5000 V | 1.425 V | 1.575 V | 336 | Tray | AX500 | 0 to 70 °C | Axcelerator | 通用型 | Cast Iron | 1.425V ~ 1.575V | 1,200 RPM | Ball | 73728 | 500000 | 8064 | 1 | 24.92 | 3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS1500-1FG676 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | U-97917 | UL | Turck | TPE | Cat 5e | 1.5000 V | 1.425 V | 1.575 V | 252 | Tray | M1AFS1500 | 活跃 | BGA, | 网格排列 | 0 to 70 °C | Fusion® | e0 | RJ45 | Tin/Lead (Sn/Pb) | Teal | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 无 | 225 | 1 mm | compliant | S-PBGA-B676 | 不合格 | OTHER | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 276480 | 1500000 | 1 | 38400 | 1500000 | 无 | 16 Feet | 25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-PQG160I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | Aluminum | 160 | 微芯片技术 | 3.3 V | 40 | 3 V | 85 °C | 有 | 117 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 3.6 V | 5.27 | None | P-D4P1#2P11#2R2-K3RX | Grace Technologies | 3.3, 5 V | 3 V | 5.5 V | 101 | Tray | A42MX09 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | -40 to 85 °C | MX | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | INDUSTRIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | STD | 2.5 ns | 684 | 14000 | IP65 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-FGG676 | Microchip | 数据表 | 710 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | Tray | AX500 | 活跃 | U-90539 | Turck | 1.5000 V | 336 | 0 to 70 °C | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | QFP | 176 | Compliant | Tray | A42MX24 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX24-2PQ208I | 114.75 MHz | FQFP | SQUARE | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-TQG144 | Microchip | 数据表 | 20 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-144 | 144-TQFP (20x20) | 微芯片技术 | Microchip Technology / Atmel | 350 MHz | ProASIC3 | Details | Tray | A3P125 | 活跃 | Miscellaneous | 1.5000 V | 1.425 V | 1.575 V | MSL 3 - 168 hours | 有 | 1500 LE | 36864 bit | 100 I/O | + 85 C | 1.575 V | 0.046530 oz | 0 C | 60 | 1.425 V | SMD/SMT | 0 to 70 °C | Tray | A3P125 | 可编程逻辑集成电路 | 1.425V ~ 1.575V | 1.5 V | 2 mA | - | FPGA - Field Programmable Gate Array | 36Kbit | 125000 | STD | - | FPGA - Field Programmable Gate Array | 1.4 mm | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600-FG484I | Microchip | 数据表 | 2992 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | 无 | A3P600-FG484I | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 1.53 | Miscellaneous | 1.5000 V | 1.425 V | 1.575 V | 235 | Compliant | Tray | A3P600 | 活跃 | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 100 °C | -40 to 85 °C | ProASIC3 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA075-FG144I | Microchip | 数据表 | 2318 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | 144-FPBGA (13x13) | 微芯片技术 | Tray | APA075 | 活跃 | SG3 | Hammond Power Solutions | 2.5000 V | 100 | -40 to 85 °C | ProASICPLUS | 2.3V ~ 2.7V | 27648 | 75000 | STD |
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3,017.098511
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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127.553331
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858.168513
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分类:Embedded - FPGAs (Field Programmable Gate Array)
1,872.595727
