品牌是'Microchip' (5152)
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![]() | M2GL005S-1VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | 1.26 V | 1.14 V | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.2 V | 有 | SQUARE | 活跃 | 5.3 | DH361UCK | CUL, UL | Cutler Hammer, Div of Eaton Co | 169 | Tray | M2GL005 | LFBGA, BGA400,20X20,32 | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | LFBGA | MICROSEMI CORP | Compliant | 活跃 | -40°C ~ 100°C (TJ) | IGLOO2 | 100 °C | -40 °C | Non-Metallic | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | 30 A | 30 | S-PBGA-B400 | 171 | 不合格 | 1.2 V | 600 V | 87.9 kB | 3 | 重型 | 171 | 1.51 mm | 现场可编程门阵列 | 6060 | 719872 | 6060 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN250V2-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Footed | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 3 | PLASTIC/EPOXY | -20 °C | 1.2 V | 未说明 | 1.14 V | 70 °C | 有 | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 2.05 | Totally Enclosed Fan Cooled | 0752XDSC42B-P | Toshiba | 无 | 68 | Tray | AGLN250 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | -20°C ~ 85°C (TJ) | IGLOO nano | e3 | 3A001.A.7.A | 通用型 | Tin (Sn) | Cast Iron | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | 60 Hz | S-PQFP-G100 | 不合格 | OTHER | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 3,600 RPM | 36864 | 250000 | STD | 6144 | None | 250000 | 3 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-TQ176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 176 | 176 | QFP176,1.0SQ,20 | 3.3 V | 30 | 3 V | 70 °C | 无 | 84 MHz | LFQFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.54 | QFP | OHB65J6T | 2.56 | ABB | 150 | Compliant | 1.40 MM HEIGHT, PLASTIC, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | Black | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 176 | S-PQFP-G176 | 150 | 不合格 | 5 V | 3.3,3.3/5,5 V | COMMERCIAL | 5.25 V | 3 V | 150 | 1890 CLBS, 36000 GATES | 1.6 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 1866 | 36000 | Pistol Handle | IP65 | 1.4 mm | 24 mm | 24 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN250-ZVQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | Single Superphosphate | 微芯片技术 | Brady | 68 | Tray | A3PN250 | 活跃 | 81814 | -40°C ~ 100°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 36864 | 250000 | STD | Exit (Up Left Arrow Picto) | Gray | English | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1240A-PG132B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | NO | 132 | 132 | PGA133M,13X13 | -55 °C | 5 V | 30 | 4.5 V | 125 °C | 无 | 54 MHz | PGA | SQUARE | Transferred | ACTEL CORP | 5.5 V | 5.82 | Military grade | FAZ-B1/1-NA-L-SP | CCC, CSA, UL, VDE | Cutler Hammer, Div of Eaton Co | 有 | DIN Rail | 104 | CERAMIC, PGA-132 | 网格排列 | CERAMIC, METAL-SEALED COFIRED | e0 | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | MAX 104 I/OS | 现场可编程门阵列 | CMOS | PERPENDICULAR | PIN/PEG | 225 | 2.54 mm | compliant | 1 A | S-CPGA-P132 | 104 | 不合格 | 5 V | 5 V | MILITARY | 5 ns | Branch Circuit | 104 | 684 CLBS, 4000 GATES | 4.318 mm | 现场可编程门阵列 | Screw | 4000 | MIL-STD-883 | 684 | 568 | 5 ns | 684 | 684 | 4000 | 34.544 mm | 34.544 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-1CQ84B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10250T434H688 | Cutler Hammer, Div of Eaton Co | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX2000-1CQ256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 256-CQFP (75x75) | 10.567001 g | 微芯片技术 | H345322642 | cUL, UL | Simpson Electric | 136 | Non-Compliant | Tray | AX2000 | 活跃 | 9-36 VDC | 32-122 °F | Axcelerator | 125 °C | -55 °C | 1.425V ~ 1.575V | 763 MHz | 1.5 V | 1.575 V | 1.425 V | 36 kB | 850 ps | 850 ps | 21504 | 294912 | 2e+06 | LED | 763 MHz | 32256 | 21504 | 1 | 21504 | 4.5 | 2.8 mm | 36 mm | 36 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-1VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 有 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | OHB80J6BEH | 3.15 | ABB | 195 | Compliant | Tray | M2GL010 | 活跃 | 12084 LE | -40°C ~ 100°C (TJ) | IGLOO2 | 100 °C | -40 °C | Black | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | 1.2 V | 114 kB | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 1 | 12084 | Pistol Handle | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA750-FG676 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 676 | 400.011771 mg | 8542390000/8542390000/8542390000/8542390000/8542390000 | 454 | Compliant | GB1090BP24 | Cutler Hammer, Div of Eaton Co | 70 °C | 0 °C | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 18 kB | 750000 | 180 MHz | 32768 | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLE3000V5-FGG896I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | 1.425 V | 85 °C | 有 | 250 MHz | BGA | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.8 | VMVS3TW070GP/120-COHI | Crouse-Hinds Industrial Products | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | -40 °C | 1.5 V | 40 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 620 | 不合格 | 1.5 V | INDUSTRIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-FGG896M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | BGA896,30X30,40 | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | 250 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | VP10487 | UL;CSA | Hubbell | 620 | Compliant | Tray | A3PE3000 | 活跃 | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | -55°C ~ 125°C (TJ) | ProASIC3L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 100 Amps | 50 to 400 Hertz | S-PBGA-B896 | 620 | 不合格 | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 600 | 1.575 V | 1.14 V | 63 kB | 4 | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 516096 | 3e+06 | 75264 | 75264 | 75264 | 3000000 | Plug | 31 mm | 31 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS090-1QNG180I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 180 | 1.425 V | 85 °C | 有 | 350 MHz | VBCC | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.31 | 10250T436 | Cutler Hammer, Div of Eaton Co | VBCC, LGA180,20X20,20 | CHIP CARRIER, VERY THIN PROFILE | 3 | UNSPECIFIED | LGA180,20X20,20 | -40 °C | 1.5 V | 30 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BUTT | 260 | 0.5 mm | compliant | S-XBCC-B180 | 60 | 不合格 | 1.5,3.3 V | INDUSTRIAL | 60 | 2304 CLBS, 90000 GATES | 0.8 mm | 现场可编程门阵列 | 2304 | 2304 | 90000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A14V25A-VQ100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OHB80J6E20 | 3.15 | ABB | Black | Pistol Handle | IP65 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-1PLG68C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | 有 | 53 MHz | QCCJ | SQUARE | Obsolete | MICROSEMI CORP | 5.25 V | 5.79 | ACH580-BCR-07A6-4+B6FJL2 | ABB | QCCJ, LDCC68,1.0SQ | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC68,1.0SQ | 5 V | 40 | 4.75 V | 70 °C | e3 | 哑光锡 | MAX 57 I/OS | 现场可编程门阵列 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | 69 | 不合格 | 5 V | COMMERCIAL | 69 | 547 CLBS, 2000 GATES | 4.445 mm | 现场可编程门阵列 | 3.8 ns | 547 | 547 | 2000 | 24.13 mm | 24.13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 317 | Tray | AX500 | 活跃 | GE - General Electric | -40°C ~ 85°C (TA) | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P400-FGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | 100 | 微芯片技术 | 40 | 1.425 V | 85 °C | 有 | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | Kit | 39752 | Cully-Minerallac | 97 | Tray | A3P400 | 活跃 | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 0°C ~ 85°C (TJ) | ProASIC3 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | 现场可编程门阵列 | 55296 | #12 | 400000 | STD | 9216 | Hex, Slotted | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1225A-PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | Footed | YES | 84 | 84 | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | 75 MHz | QCCJ | SQUARE | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | Totally Enclosed Fan Cooled | 0752XSSB42B-P | Toshiba | 无 | 72 | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC84,1.2SQ | e0 | 通用型 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | Cast Iron | PLD EQUIVALENT GATES=6250 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 60 Hz | S-PQCC-J84 | 83 | 不合格 | 5 V | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 5 ns | 5 ns | 83 | 451 CLBS, 2500 GATES | 4.572 mm | 现场可编程门阵列 | 451 | 3,600 RPM | 2500 | 451 | 5 ns | 451 | 451 | None | 2500 | 3 | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-TQ176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 176 | 176 | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | 91.8 MHz | LFQFP | SQUARE | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | QFP | FAZ-B1/3-NA-L | CCC, CSA, UL, VDE | Cutler Hammer, Div of Eaton Co | 有 | DIN Rail | 150 | 1.40 MM HEIGHT, PLASTIC, TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 1 A | 176 | S-PQFP-G176 | 150 | 不合格 | 5 V | 3.3,3.3/5,5 V | INDUSTRIAL | 5.5 V | 3 V | Branch Circuit | 150 | 1890 CLBS, 36000 GATES | 1.6 mm | 现场可编程门阵列 | Screw | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 1866 | 36000 | 1.4 mm | 24 mm | 24 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250L-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | 350 MHz | TFQFP | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 7.67 | ZDHKUSBD000A000000XX | UL | ABB | FIXED | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | e3 | 哑光锡 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 68 | 不合格 | 1.5/3.3 V | COMMERCIAL | 68 | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 6144 | 250000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS250-PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 40 | 1.425 V | 85 °C | 有 | QFF | RECTANGULAR | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | 9-36 VDC | H345323002 | cUL, UL | Simpson Electric | QFF, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 32-122 °F | e3 | 哑光锡 | 8542.39.00.01 | CMOS | QUAD | FLAT | 245 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | LED | 6144 | 250000 | 4.5 | 30.6 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000L-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | 350 MHz | FQFP | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | Maintained | MP2-42W02F8 | CSA, IEC, UL | ABB | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | e3 | 哑光锡 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | COMMERCIAL | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | Fingersafe Screw | 1.91 | 24576 | 24576 | 1000000 | Incandescent | 2NC | IP66 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A10V10B-PL68C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 68 | LDCC68,1.0SQ | 3.3 V | 30 | 3 V | 70 °C | 无 | 50 MHz | QCCJ | SQUARE | Obsolete | ACTEL CORP | 3.6 V | 5.9 | 11/5VX1060 | Continental Belt | 106 | 57 | Compliant | PLASTIC, MS-007-AD, LCC-68 | CHIP CARRIER | 3 | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | MAX 57 I/OS | 现场可编程门阵列 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J68 | 57 | 不合格 | 3.3 V | 3.3 V | COMMERCIAL | 6.5 ns | 57 | 295 CLBS, 1200 GATES | 4.445 mm | 现场可编程门阵列 | 1200 | 295 | 11 | 147 | 4.5 ns | 295 | 295 | 1200 | 24.13 mm | 24.13 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-9958501QXC | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) | 微芯片技术 | VP204513 | UL;CSA | Hubbell | 202 | Tray | 5962-9958501 | 活跃 | -55°C ~ 125°C (TJ) | MX | 3V ~ 3.6V, 4.5V ~ 5.5V | 200 Amps | 50 to 400 Hertz | 600 | 4 | 2560 | 54000 | Plug | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE600-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 1.425 V | 85 °C | 有 | 350 MHz | FQFP | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | SKLA36AT1200 | GE - General Electric | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.5 V | 40 | e3 | 哑光锡 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250L-1VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | A3P250L-1VQ100 | 350 MHz | TFQFP | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.28 | Bernstein | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | 1.2 V | 30 | 1.14 V | 70 °C | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 68 | 不合格 | 1.5/3.3 V | COMMERCIAL | 68 | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 6144 | 250000 | 14 mm | 14 mm |
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