N/A

-

YES

44

PLASTIC, MS-007-AB, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

4.5 V

85 °C

有

A1010B-PLG44I

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

8.01

e3

Tin (Sn)

MAX 34 I/OS

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

INDUSTRIAL

295 CLBS, 1200 GATES

4.445 mm

现场可编程门阵列

4.5 ns

295

1200

16.51 mm

16.51 mm

N/A

-

CSON

无

Industrial grade

2.5(mm)

-40C to 85C

Industrial

3.2(mm)

1.05(mm)

5000 In Stock

• 1: ¥711.214144
• 10: ¥670.956739
• 100: ¥632.978059
• 500: ¥597.149110
查看所有的价格

-

Production (Last Updated: 2 months ago)

Free Hanging (In-Line)

484-BGA

YES

-

484

铝合金

484-FPBGA (23x23)

484

SMD/SMT

ITT Cannon, LLC

Microchip

Microchip Technology / Atmel

IGLOO2

Details

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL025-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

50V

Bulk

Metal

CA310

活跃

Gold

267

有

27696 LE

+ 85 C

1.26 V

0 C

60

1.14 V

-55°C ~ 125°C

Tray

MIL-DTL-5015, CA-B

焊杯

Plug, Male Pins

14

85 °C

0 °C

橄榄色

8542.39.00.01

反向卡口锁

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

N (Normal)

BALL

-

260

IP67 - Dust Tight, Waterproof

1 mm

compliant

22A

橄榄色镉

22-19

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

256 kB

138 kB

-

667 Mb/s

267

2.44 mm

现场可编程门阵列

27696

FPGA - Field Programmable Gate Array

1130496

400 MHz

34

STD

4 Transceiver

27696

-

FPGA - Field Programmable Gate Array

23 mm

23 mm

19.7µin (0.50µm)

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

微芯片技术

81

Tray

A54SX16A

Obsolete

-40°C ~ 125°C (TA)

SX-A

2.25V ~ 5.25V

24000

1452

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

FDC3175L

UL

Cutler Hammer, Div of Eaton Corp

Panel

154

Tray

M1A3P1000

Obsolete

-55°C ~ 125°C (TJ)

ProASIC3

1.425V ~ 1.575V

175 A

147456

1000000

N/A

-

YES

144

175G5536

Danfoss Electronics

Non-Compliant

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.5 V

40

1.425 V

70 °C

有

108 MHz

LBGA

SQUARE

Transferred

ACTEL CORP

1.575 V

5.78

e1

锡银铜

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5 V

COMMERCIAL

97

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

6144

250000

13 mm

13 mm

N/A

-

表面贴装

YES

Brass

84

Killark-Hubbell Electrical Products

69

Non-Compliant

PLASTIC, MS-007-AE, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC84,1.2SQ

3.3 V

30

3 V

70 °C

无

A10V20B-PL84C

50 MHz

QCCJ

SQUARE

Obsolete

ACTEL CORP

3.6 V

5.87

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

Metallic

MAX 69 I/OS

现场可编程门阵列

CMOS

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

69

不合格

3.3 V

3.3 V

COMMERCIAL

6.5 ns

69

547 CLBS, 2000 GATES

4.45 mm

现场可编程门阵列

2000

547

273

4.5 ns

547

547

2000

29.21 mm

29.21 mm

无

240 In Stock

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

1.26 V

5.26

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

-55 °C

1.2 V

30

1.14 V

125 °C

有

M2GL150T-1FCG1152M

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

-55°C ~ 125°C (TJ)

IGLOO2

3A001.A.2.C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

MILITARY

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

896

400.011771 mg

896

620

Compliant

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

70 °C

有

M1AGLE3000V2-FGG896

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

e1

锡银铜

70 °C

0 °C

8542.39.00.01

CMOS

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.14 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

3e+06

892.86 MHz

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

2729 In Stock

• 1: ¥1,570.019216
• 10: ¥1,481.150203
• 100: ¥1,397.311511
• 500: ¥1,318.218407
查看所有的价格

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

207

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-1VF400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

YES

208

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

70 °C

有

M7AFS600-1PQG208

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.8

e3

哑光锡

8542.39.00.01

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

600000 GATES

4.1 mm

现场可编程门阵列

600000

28 mm

28 mm

N/A

-

YES

208

5.82

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

RECTANGULAR

QFF

M1AFS250-PQG208

有

85 °C

1.425 V

40

1.5 V

PLASTIC/EPOXY

3

FLATPACK

QFF,

e3

哑光锡

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

表面贴装

68-LCC (J-Lead)

YES

68-PLCC (24.23x24.23)

68

微芯片技术

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

LCC

Non-Compliant

57

Tray

A40MX04

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX04-2PL68I

101 MHz

QCCJ

SQUARE

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

68

S-PQCC-J68

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

24.2316 mm

24.2316 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

0603 (1608 Metric)

YES

1152

0603

400.011771 mg

1152

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73R1J

活跃

712

Compliant

BGA, BGA1152,34X34,40

网格排列

3

PLASTIC/EPOXY

BGA1152,34X34,40

2.5 V

20

2.3 V

70 °C

无

APA1000-FG1152

180 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.7 V

5.26

-55°C ~ 155°C

RN73R

0.063 L x 0.031 W (1.60mm x 0.80mm)

±0.25%

2

±50ppm/°C

94.2 kOhms

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

Thin Film

0.1W, 1/10W

8542.39.00.01

现场可编程门阵列

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1 mm

unknown

180 MHz

S-PBGA-B1152

712

不合格

2.5 V

-

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

24.8 kB

712

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1e+06

180 MHz

56320

56320

1000000

Automotive AEC-Q200, Moisture Resistant

1.73 mm

0.022 (0.55mm)

35 mm

35 mm

无

AEC-Q200

N/A

-

表面贴装

YES

313

313

Fuji

249

Compliant

网格排列

PLASTIC/EPOXY

BGA313,25X25,50

-40 °C

85 °C

无

230 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.84

V7-BT

85 °C

-40 °C

现场可编程门阵列

CMOS

BOTTOM

BALL

1.27 mm

unknown

S-PBGA-B313

249

不合格

3.3,5 V

INDUSTRIAL

900 ps

249

现场可编程门阵列

48000

2880

1080

2880

无

2927 In Stock

• 1: ¥2,510.646356
• 10: ¥2,368.534296
• 100: ¥2,234.466319
• 500: ¥2,107.987093
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

1.575 V

5.3

ILME

1.5000 V

1.425 V

1.575 V

Compliant

252

Tray

M1AFS1500

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1AFS1500-1FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

0 to 70 °C

Fusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1.5e+06

1.28205 GHz

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

无

890 In Stock

• 1: ¥4,981.940239
• 10: ¥4,699.943621
• 100: ¥4,433.909080
• 500: ¥4,182.933094
查看所有的价格

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

Tray

M1A3PE3000

活跃

有

35000 LE

+ 100 C

1.575 V

0.014110 oz

- 40 C

微芯片技术

60

1.14 V

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

738-428

Altech

1.5000 V

1.425 V

1.575 V

341

-40 to 85 °C

Tray

ProASIC3E

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

-

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

516096

3000000

2

-

75264

75264

3000000

FPGA - Field Programmable Gate Array

1.73 mm

23 mm

23 mm

2819 In Stock

• 1: ¥3,017.098511
• 10: ¥2,846.319352
• 100: ¥2,685.206933
• 500: ¥2,533.214088
查看所有的价格

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

有

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

2.75 V

5.25

Turck

U-90298

2.5000 V

2.25 V

2.75 V

113

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

2.25 V

70 °C

0 to 70 °C

SX-A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

COMMERCIAL

113

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

2

0.9 ns

2880

2880

48000

20 mm

20 mm

2878 In Stock

• 1: ¥2,155.470449
• 10: ¥2,033.462684
• 100: ¥1,918.361027
• 500: ¥1,809.774553
查看所有的价格

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

FQFP

SQUARE

活跃

MICROSEMI CORP

2.75 V

5.25

Cutler Hammer, Div of Eaton Corp

DD367NWKW-00V3

2.5000 V

175

Tray

A54SX16

活跃

FQFP, QFP208,1.2SQ

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ

-40 °C

2.5 V

40

2.25 V

85 °C

有

294 MHz

-40 to 85 °C

SX-A

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

2.5,3.3/5 V

INDUSTRIAL

175

1452 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

1452

2

1 ns

1452

1452

24000

28 mm

28 mm

2386 In Stock

• 1: ¥1,459.675541
• 10: ¥1,377.052398
• 100: ¥1,299.106033
• 500: ¥1,225.571735
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

有

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

738B-BOX

Arrow Hart - Cooper Wiring Devices

1.2000 V

1.14 V

1.26 V

97

Compliant

Tray

A3P600

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

1.14 V

85 °C

-40 to 85 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

1.26 V

1.14 V

5 mA

13.5 kB

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

892.86 MHz

1

13824

13824

13824

600000

1.05 mm

13 mm

13 mm

无

2583 In Stock

• 1: ¥1,971.083029
• 10: ¥1,859.512294
• 100: ¥1,754.256878
• 500: ¥1,654.959323
查看所有的价格

-

Foot Mount,Rigid

676-BGA

676-FBGA (27x27)

微芯片技术

活跃

Totally Enclosed Fan Cooled

LM60036

CSA, UL

Lincoln Electric

1.5000 V

1.425 V

1.575 V

336

Tray

AX500

0 to 70 °C

Axcelerator

通用型

Cast Iron

1.425V ~ 1.575V

1,200 RPM

Ball

73728

500000

8064

1

24.92

3

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

30

1.425 V

85 °C

无

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

U-97917

UL

Turck

TPE

Cat 5e

1.5000 V

1.425 V

1.575 V

252

Tray

M1AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

0 to 70 °C

Fusion®

e0

RJ45

Tin/Lead (Sn/Pb)

Teal

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

无

225

1 mm

compliant

S-PBGA-B676

不合格

OTHER

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

1500000

无

16 Feet

25 mm

N/A

-

表面贴装

160-BQFP

YES

160-PQFP (28x28)

Aluminum

160

微芯片技术

85 °C

有

117 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

3.6 V

5.27

None

P-D4P1#2P11#2R2-K3RX

Grace Technologies

3.3, 5 V

3 V

5.5 V

101

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

3 V

-40 to 85 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

STD

2.5 ns

684

14000

IP65

28 mm

28 mm

710 In Stock

• 1: ¥3,973.500977
• 10: ¥3,748.585832
• 100: ¥3,536.401726
• 500: ¥3,336.228043
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-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

Turck

1.5000 V

336

Tray

AX500

活跃

U-90539

0 to 70 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

STD

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

3.6 V

5.25

QFP

176

Compliant

Tray

A42MX24

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX24-2PQ208I

114.75 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.5 mm

compliant

208

S-PQFP-G208

不合格

5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

3.4 mm

28 mm

28 mm

无