N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-2FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

5.25 V

Tray

A42MX24

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-3PQG160

QFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

24

Actel

0.196363 oz

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

5.25 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

- 40 C

+ 85 C

SMD/SMT

175 MHz

有

16

微芯片技术

Actel

0.239083 oz

Tray

A40MX04

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

5.3

MICROSEMI CORP

活跃

SQUARE

QCCJ

101 MHz

A40MX04-2PLG84I

有

85 °C

40

3.3 V

-40 °C

PLASTIC/EPOXY

Details

69 I/O

3 V

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

171 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

217 MHz

有

24

Actel

Tray

A54SX72

活跃

2.75 V

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A54SX72A

125 °C

-55 °C

2.5 V

217 MHz

1.5 ns

1.5 ns

6036

108000

217 MHz

6036

6036

4024

2.75 V

2.25 V

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

N

203 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

217 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

0°C ~ 70°C (TA)

Tray

A54SX72A

2.5 V

108000

6036

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

11000 LE

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

5.23

MICROSEMI CORP

活跃

SQUARE

BGA

350 MHz

A3P1000-2FGG256

有

85 °C

40

1.5 V

PLASTIC/EPOXY

3

网格排列

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

101 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

215 MHz

有

微芯片技术

24

Actel

0.196363 oz

Tray

A42MX09

活跃

5.5 V

3.3 V

MICROSEMI CORP

5.29

-55 °C

PLASTIC/EPOXY

3

FLATPACK

ROHS COMPLIANT, PLASTIC, QFP-160

活跃

SQUARE

QFP

117 MHz

A42MX09-PQG160M

有

125 °C

40

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

MILITARY

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.5 ns

684

14000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

通孔

通孔

CCGA-624

624

624-CCGA (32.5x32.5)

微芯片技术

150 MHz

有

1

Actel

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

N

440 I/O

- 55 C

+ 125 C

SMD/SMT

-55°C ~ 125°C (TC)

APA600

125 °C

-55 °C

2.5 V

15.8 kB

5 mA

129024

600000

150 MHz

21504

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE1500

活跃

FLASH

1.575 V

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

有

A3PE1500-FGG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

0 to 70 °C

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

350 MHz

S-PBGA-B676

444

不合格

1.5/3.3 V

COMMERCIAL

128 B

33.8 kB

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

231 MHz

STD

38400

38400

85 °C

38400

1.575 V

1.425 V

70 °C

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

Details

113 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

有

60

Actel

0.046530 oz

Tray

A54SX32

活跃

2.75 V

-55°C ~ 125°C (TC)

Tray

A54SX32A

2.5 V

48000

2880

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

有

微芯片技术

27

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-2FG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

0°C ~ 85°C (TJ)

Tray

A3PE3000

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

不合格

COMMERCIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

158 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

2.625 V

Tray

APA750

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 125°C (TJ)

Tray

APA750

125 °C

-40 °C

2.5 V

18 kB

147456

750000

180 MHz

STD

32768

2.625 V

2.375 V

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

77 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

90

微芯片技术

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P030-VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.5

N

-40 to 85 °C

Tray

A3P030

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

STD

768

30000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

+ 70 C

SMD/SMT

175 MHz

有

16

微芯片技术

Actel

0.239083 oz

Tray

A40MX04

活跃

5.25 V

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-2PLG84

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

69 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

0°C ~ 85°C (TJ)

Tray

M1A3P1000

1.5 V

147456

1000000

1

N/A

-

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

M7A3P1000-2FGG144

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

97 I/O

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

310 MHz

S-PBGA-B144

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1.575 V

1.425 V

1000000

1.05 mm

13 mm

13 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

1282.05 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

172 I/O

N

Tray

M7AFS600

活跃

1.575 V

0.014110 oz

Fusion

60

有

-40°C ~ 85°C (TA)

Tray

M7AFS600

85 °C

-40 °C

1.5 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.575 V

1.425 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

This product may require additional documentation to export from the United States.

Details

113 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

227 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX16

活跃

-55°C ~ 125°C (TC)

Tray

A54SX16A

2.5 V

24000

1452

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

N

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

-40°C ~ 85°C (TA)

Tray

M7AFS600

1.5 V

110592

600000

2

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

+ 70 C

SMD/SMT

198 MHz

有

66

微芯片技术

Actel

0.062040 oz

5.25 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-1PQG100

108 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.28

Details

83 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

3000 LE

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

526.32 MHz, 892.86 MHz

微芯片技术

有

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL250V2-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

AGL250V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

OTHER

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

- 40 C

+ 85 C

SMD/SMT

160 MHz

有

19

微芯片技术

Actel

0.171777 oz

5.5 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX02-1PLG68I

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

57 I/O

3 V

-40°C ~ 85°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

1.575 V

Tray

A3P600

活跃

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

0 to 70 °C

Tray

A3P600

1.5 V

110592

600000

1

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

90

有

247 MHz

SMD/SMT

+ 85 C

微芯片技术

- 40 C

5.5 V

Tray

A42MX09

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-1VQG100I

135 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

83 I/O

3 V

Actel

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

2.1 ns

684

14000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

- 40 C

+ 85 C

SMD/SMT

160 MHz

有

66

微芯片技术

Actel

0.062040 oz

Tray

A40MX04

活跃

5.5 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-1PQG100I

48 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

Details

69 I/O

3 V

-40°C ~ 85°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

2.3 ns

547

6000

2.7 mm

20 mm

14 mm