品牌是'Microchip' (5152)
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![]() | A3PE3000L-1FG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | BGA | 250 MHz | A3PE3000L-1FG896 | 无 | 70 °C | 1.14 V | 30 | 1.2 V | BGA896,30X30,40 | PLASTIC/EPOXY | 3 | 网格排列 | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | 620 | Compliant | Tray | A3PE3000 | 活跃 | 5.3 | 0°C ~ 85°C (TJ) | ProASIC3L | e0 | 锡铅 | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | 不合格 | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | 无 | ||||||||||||||||||||||
![]() | A3P400-FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | 144-FPBGA (13x13) | 微芯片技术 | 97 | Tray | A3P400 | 活跃 | -40°C ~ 100°C (TJ) | ProASIC3 | 1.425V ~ 1.575V | 55296 | 400000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA1000-LG624B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | Surface Mount, Through Hole | 表面贴装 | 624-BCLGA | YES | 624 | 624-CLGA (32.5x32.5) | 624 | 微芯片技术 | 网格排列 | CERAMIC, METAL-SEALED COFIRED | -55 °C | 2.5 V | 未说明 | 2.3 V | 125 °C | 无 | APA1000-LG624B | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.26 | Military grade | 440 | Tray | APA1000 | 活跃 | Compliant | BGA, | -55°C ~ 125°C (TJ) | ProASICPLUS | 3A001.A.2.C | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 未说明 | compliant | 180 MHz | S-CBGA-B624 | 不合格 | 2.5 V | MILITARY | 2.7 V | 2.3 V | 5 mA | 24.8 kB | 1000000 GATES | 现场可编程门阵列 | 202752 | 1000000 | 150 MHz | MIL-STD-883 Class B | 56320 | 1000000 | 无 | ||||||||||||||||||||||||||||||||||
![]() | A3PE600-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | A3PE600-2PQ208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 8.76 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600L-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 208 | 208 | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | A3P600L-PQ208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | 154 | Compliant | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | 含铅 | ||||||||||||||||||||||||||||||||
![]() | A3P1000L-1FG256I | Microchip | 数据表 | 2775 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 1.2000 V | 1.14 V | 1.26 V | 177 | Tray | A3P1000 | 微芯片技术 | 活跃 | MICROSEMI CORP | 1.575 V | 1.55 | 活跃 | Microsemi Corporation | SQUARE | BGA | 350 MHz | A3P1000L-1FG256I | 无 | 85 °C | 1.14 V | 30 | 1.2 V | -40 °C | BGA256,16X16,40 | PLASTIC/EPOXY | 3 | 网格排列 | BGA, BGA256,16X16,40 | -40 to 85 °C | ProASIC3L | e0 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||
![]() | A3P250L-FGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | BGA144,12X12,40 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | A3P250L-FGG144 | 350 MHz | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 7.67 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | 不合格 | 1.5/3.3 V | COMMERCIAL | 97 | 6144 CLBS, 250000 GATES | 1.55 mm | 现场可编程门阵列 | 6144 | 6144 | 250000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-FGG256T | Microchip | 数据表 | 2445 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | Tray | A3P1000 | 活跃 | 1 MM PITCH, GREEN, FBGA-256 | 网格排列 | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.5 V | 40 | 1.425 V | 125 °C | 有 | A3P1000-FGG256T | 350 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | Automotive grade | 177 | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | 现场可编程门阵列 | 147456 | 1000000 | AEC-Q100 | STD | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||
![]() | A1020B-2PLG84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A14100A-1CQ256M | Microchip | 数据表 | 2 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 4.5 V | 125 °C | A14100A-1CQ256M | 125 MHz | GQFF | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.79 | GQFF, TPAK256,3SQ,20 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | TPAK256,3SQ,20 | -55 °C | 5 V | e0 | 3A001.A.2.C | 锡铅 | 25000 PLD EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | FLAT | 0.5 mm | compliant | S-CQFP-F256 | 228 | 不合格 | 5 V | MILITARY | 228 | 1377 CLBS, 10000 GATES | 3.3 mm | 现场可编程门阵列 | 2.6 ns | 1377 | 1377 | 10000 | 36 mm | 36 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-1VQ80I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 80 | Non-Compliant | 57 | 85 °C | -40 °C | 57 MHz | 5 V | 5.5 V | 4.5 V | 3.8 ns | 295 | 1200 | 295 | 1 | 147 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PL44I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 44 | 44 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC44,.7SQ | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | A1020B-PL44I | 40.5 MHz | QCCJ | SQUARE | Actel Corporation | Transferred | ACTEL CORP | 5.5 V | 5.83 | 34 | Compliant | QCCJ, LDCC44,.7SQ | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | MAX 34 I/OS | 现场可编程门阵列 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 48 MHz | S-PQCC-J44 | 69 | 不合格 | 5 V | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 4.5 ns | 4.5 ns | 69 | 547 CLBS, 2000 GATES | 4.445 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 273 | 4.5 ns | 547 | 547 | 2000 | 16.51 mm | 16.51 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | A3P125-1QNG132I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX500-1FGG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 317 | Tray | AX500 | 活跃 | -55°C ~ 125°C (TA) | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL400V2-FGG144 | Microchip | 数据表 | 23 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | 144 | 1.14 V | 85 °C | 有 | AGL400V2-FGG144 | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 8.58 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.2 V | 40 | e1 | 3A001.A.7.A | 锡银铜 | 8542.39.00.01 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | OTHER | 9216 CLBS, 400000 GATES | 1.55 mm | 现场可编程门阵列 | 9216 | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-TQ176M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 176 | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX16-TQ176M | 94 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | LFQFP, QFP176,1.0SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | e0 | 3A001.A.2.C | 锡铅 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 176 | S-PQFP-G176 | 140 | 不合格 | 3.3,3.3/5,5 V | MILITARY | 140 | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 2.8 ns | 1232 | 1232 | 24000 | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-TQG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 40 | 3 V | 70 °C | 有 | A54SX16P-TQG144 | 240 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.6 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | e3 | 哑光锡 | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | COMMERCIAL | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 0.9 ns | 1452 | 16000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250L-1VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | PLASTIC/EPOXY | TQFP100,.63SQ | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3P250L-1VQG100I | 350 MHz | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 7.67 | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | e3 | 哑光锡 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 68 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 68 | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 6144 | 250000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-1PLG84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | 5 V | 40 | 4.5 V | 85 °C | 有 | A1020B-1PLG84I | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.8 | PLASTIC, MS-007-AE, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | e3 | Matte Tin (Sn) | MAX 69 I/OS | 8542.39.00.01 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | INDUSTRIAL | 547 CLBS, 2000 GATES | 4.45 mm | 现场可编程门阵列 | 3.8 ns | 547 | 2000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PL44C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | PLASTIC/EPOXY | LDCC44,.7SQ | 5 V | 30 | 4.75 V | 70 °C | 无 | A1020B-PL44C | 45 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 8.76 | LCC | QCCJ, LDCC44,.7SQ | CHIP CARRIER | 3 | e0 | Tin/Lead (Sn/Pb) | MAX 34 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 69 | 不合格 | 5 V | COMMERCIAL | 69 | 547 CLBS, 2000 GATES | 4.572 mm | 现场可编程门阵列 | 4.5 ns | 547 | 547 | 2000 | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-PG84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-PL44I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | PLASTIC/EPOXY | LDCC44,.7SQ | -40 °C | 5 V | 4.5 V | 85 °C | 无 | A1010B-PL44I | 40.5 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 8.76 | LCC | QCCJ, LDCC44,.7SQ | CHIP CARRIER | 3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 1.27 mm | unknown | 44 | S-PQCC-J44 | 57 | 不合格 | 5 V | INDUSTRIAL | 57 | 295 CLBS, 1200 GATES | 4.572 mm | 现场可编程门阵列 | 295 | 295 | 1200 | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-FGG256 | Microchip | 数据表 | 2071 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 256 | Compliant | Tray | 微芯片技术 | AFS250 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AFS250-FGG256 | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.6 | 1.5000 V | 1.425 V | 1.575 V | 114 | 0 to 70 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B256 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | 现场可编程门阵列 | 36864 | 250000 | 350 MHz | STD | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | 无 | 无铅 | ||||||||||||||||||||||||
![]() | A3P600L-FGG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 256 | 400.011771 mg | 256 | PLASTIC/EPOXY | BGA256,16X16,40 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3P600L-FGG256I | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.28 | 177 | Compliant | BGA, BGA256,16X16,40 | 网格排列 | 3 | e1 | 锡银铜 | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | A1020B-2PLG68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 |
A3PE3000L-1FG896
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P400-FG144I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA1000-LG624B
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE600-2PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600L-PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000L-1FG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
2,448.192680
A3P250L-FGG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-FGG256T
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
2,276.709113
A1020B-2PLG84C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A14100A-1CQ256M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1010B-1VQ80I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-PL44I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P125-1QNG132I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-1FGG484M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL400V2-FGG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
370.497747
A42MX16-TQ176M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16P-TQG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P250L-1VQG100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-1PLG84I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-PL44C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1010B-PG84C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1010B-PL44I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS250-FGG256
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,290.967657
A3P600L-FGG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-2PLG68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
