2409 In Stock

• 1: ¥2,145.930940
• 10: ¥2,024.463151
• 100: ¥1,909.870894
• 500: ¥1,801.764997
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

Tray

AFS600

活跃

1.5000 V

1.425 V

1.575 V

172

0 to 70 °C

Fusion®

1.425V ~ 1.575V

110592

600000

STD

80 In Stock

• 1: ¥209.566579
• 10: ¥197.704322
• 100: ¥186.513507
• 500: ¥175.956141
查看所有的价格

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

活跃

5.24

1.575 V

微芯片技术

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

LBGA

108 MHz

AGL250V2-FGG144I

有

100 °C

1.14 V

40

1.2 V

-40 °C

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

LBGA,

97

Tray

AGL250

-40°C ~ 85°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

13 mm

13 mm

N/A

-

YES

44

5 V

40

4.5 V

85 °C

有

A1020B-2PLG44I

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.8

PLASTIC, MS-007-AB, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

e3

Matte Tin (Sn)

MAX 34 I/OS

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

INDUSTRIAL

547 CLBS, 2000 GATES

4.445 mm

现场可编程门阵列

3.4 ns

547

2000

16.51 mm

16.51 mm

N/A

-

YES

172

未说明

4.75 V

70 °C

无

A1280A-CQ172C

50 MHz

HGQFF

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.84

CERAMIC, CQFP-172

FLATPACK, HEAT SINK/SLUG, GUARD RING

CERAMIC, METAL-SEALED COFIRED

TPAK172,2.5SQ,25

5 V

e0

EAR99

锡铅

MAX 140 I/OS

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

FLAT

未说明

0.635 mm

compliant

S-CQFP-F172

140

不合格

5 V

COMMERCIAL

140

1232 CLBS, 8000 GATES

2.9464 mm

现场可编程门阵列

5 ns

1232

1232

8000

29.972 mm

29.972 mm

N/A

-

N/A

-

YES

80

5 V

30

4.5 V

85 °C

无

A1020B-VQ80I

TQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

8.71

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

鸥翼

240

0.65 mm

compliant

S-PQFP-G80

不合格

INDUSTRIAL

547 CLBS, 2000 GATES

1.2 mm

现场可编程门阵列

547

2000

14 mm

14 mm

N/A

-

NO

84

20

4.5 V

125 °C

无

A1020B-1PG84M

44 MHz

PGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.59

CERAMIC, PGA-84

网格排列

CERAMIC, METAL-SEALED COFIRED

-55 °C

5 V

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

MAX 69 I/OS

8542.39.00.01

CMOS

PERPENDICULAR

PIN/PEG

225

2.54 mm

unknown

S-CPGA-P84

不合格

MILITARY

547 CLBS, 2000 GATES

4.318 mm

现场可编程门阵列

4.7 ns

547

547

2000

27.94 mm

27.94 mm

N/A

-

YES

68

LDCC68,1.0SQ

5 V

40

4.75 V

70 °C

有

A1010B-PLG68C

45 MHz

QCCJ

SQUARE

Actel Corporation

Transferred

ACTEL CORP

5.25 V

5.79

PLASTIC, MS-007-AD, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

e3

哑光锡

MAX 57 I/OS

现场可编程门阵列

CMOS

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

57

不合格

5 V

COMMERCIAL

57

295 CLBS, 1200 GATES

4.445 mm

现场可编程门阵列

4.5 ns

295

295

1200

24.13 mm

24.13 mm

N/A

-

表面贴装

YES

68

68

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

4.5 V

85 °C

有

A1010B-2PLG68I

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

8.59

8542390000/8542390000/8542390000/8542390000/8542390000

57

Compliant

PLASTIC, MS-007-AD, LCC-68

e3

Matte Tin (Sn)

85 °C

-40 °C

MAX 57 I/OS

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

5 V

INDUSTRIAL

3.4 ns

3.4 ns

295 CLBS, 1200 GATES

4.445 mm

现场可编程门阵列

1200

295

2

147

3.4 ns

295

1200

24.13 mm

24.13 mm

无

N/A

-

YES

208

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

1.14 V

85 °C

有

A3P1000L-PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

YES

132

132

UNSPECIFIED

1.5 V

30

1.425 V

85 °C

有

A3P125-QNG132

350 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

7.57

84

Compliant

HVBCC,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

70 °C

0 °C

8542.39.00.01

CMOS

BOTTOM

BUTT

260

0.5 mm

compliant

231 MHz

S-XBCC-B132

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

4.5 kB

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

125000

3072

3072

125000

8 mm

8 mm

无

无铅

2281 In Stock

• 1: ¥2,029.646921
• 10: ¥1,914.761243
• 100: ¥1,806.378532
• 500: ¥1,704.130691
查看所有的价格

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

A3P1000

活跃

BGA, BGA256,16X16,40

网格排列

微芯片技术

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

40

1.14 V

85 °C

有

A3P1000L-FGG256I

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.38

177

Tray

-40°C ~ 100°C (TJ)

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

620

Tray

A3PE3000

微芯片技术

活跃

Compliant

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

70 °C

无

A3PE3000L-FG896

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

1.2000 V

1.14 V

1.26 V

0 to 70 °C

ProASIC3L

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.2 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

YES

44

44

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

4.5 V

85 °C

有

A1020B-PLG44I

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.79

8542390000/8542390000/8542390000/8542390000/8542390000

34

Compliant

QCCJ,

e3

Tin (Sn)

85 °C

-40 °C

MAX 34 I/OS

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

compliant

48 MHz

S-PQCC-J44

不合格

5 V

INDUSTRIAL

5.5 V

4.5 V

4.5 ns

547 CLBS, 2000 GATES

4.445 mm

现场可编程门阵列

547

2000

547

273

4.5 ns

547

2000

16.51 mm

16.51 mm

无

N/A

-

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

FQFP,

FLATPACK, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P250-PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.26

151

Tray

M1A3P250

Obsolete

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

6144

250000

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-BFCQFP with Tie Bar

YES

256

256-CQFP (75x75)

256

8542390000/8542390000/8542390000/8542390000/8542390000

Compliant

微芯片技术

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

3.3 V

20

3 V

125 °C

无

A42MX36-CQ256M

73 MHz

GQFF

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.18

QFP

202

Tray

A42MX36

活跃

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

FLAT

225

0.5 mm

compliant

256

S-CQFP-F256

不合格

3.3 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1822

2.7 ns

2438

54000

36 mm

36 mm

无

29 In Stock

• 1: ¥682.085076
• 10: ¥643.476484
• 100: ¥607.053291
• 500: ¥572.691786
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

活跃

微芯片技术

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

0.78

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

LBGA

350 MHz

A3P600L-FGG144

有

70 °C

1.14 V

40

1.2 V

BGA144,12X12,40

PLASTIC/EPOXY

3

8542310000/8542310000/8542310000/8542310000/8542310000

97

Compliant

Tray

A3P600

0°C ~ 85°C (TJ)

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

1.26 V

1.14 V

13.5 kB

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

781.25 MHz

STD

13824

13824

13824

600000

1.05 mm

13 mm

13 mm

无

无铅

N/A

-

表面贴装

YES

176

176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX24-1TQ176I

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

150

Compliant

1.40 MM HEIGHT, PLASTIC, TQFP-176

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

176

S-PQFP-G176

150

不合格

5 V

3.3,3.3/5,5 V

INDUSTRIAL

5.5 V

3 V

150

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

1

1410

2.1 ns

1890

1866

36000

1.4 mm

24 mm

24 mm

无

2528 In Stock

• 1: ¥2,547.675908
• 10: ¥2,403.467842
• 100: ¥2,267.422487
• 500: ¥2,139.077817
查看所有的价格

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

484-BGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

2.5000 V

2.3 V

2.7 V

344

Compliant

Tray

APA450

活跃

-40 to 85 °C

ProASICPLUS

85 °C

-40 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

13.5 kB

110592

450000

180 MHz

STD

12288

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

111

Tray

A54SX08

微芯片技术

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

3.3 V

30

3 V

85 °C

无

A54SX08-FG144I

240 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

-40 to 85 °C

SX

e0

Tin/Lead/Silver (Sn/Pb/Ag)

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

3.3,5 V

INDUSTRIAL

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

12000

768

STD

0.9 ns

768

768

8000

13 mm

13 mm

2988 In Stock

• 1: ¥1,731.236957
• 10: ¥1,633.242413
• 100: ¥1,540.794731
• 500: ¥1,453.579933
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

484

微芯片技术

网格排列

3

PLASTIC/EPOXY

1.2 V

40

1.14 V

85 °C

有

M1AGL1000V2-FGG484

108 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

300

Compliant

Tray

M1AGL1000

活跃

BGA,

0°C ~ 70°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

Tray

A54SX16

活跃

2.5000 V

2.25 V

2.75 V

175

-40 to 85 °C

SX-A

2.25V ~ 5.25V

24000

1452

STD

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

113

Tray

A54SX32

微芯片技术

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

3.3 V

40

3 V

70 °C

有

A54SX32-2TQG144

320 MHz

LFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

0 to 70 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3,5 V

COMMERCIAL

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

2

0.7 ns

2880

2880

32000

20 mm

20 mm

N/A

-

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

2.97, 4.5 V

3.63, 5.5 V

111

Tray

A54SX08

微芯片技术

活跃

Compliant

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

3.3 V

30

3 V

85 °C

无

A54SX08-2FG144I

320 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

3.3, 5 V

-40 to 85 °C

SX

e0

锡铅银

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1 mm

compliant

320 MHz

S-PBGA-B144

111

不合格

5 V

3.3,5 V

INDUSTRIAL

5.5 V

4.5 V

700 ps

700 ps

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

768

12000

320 MHz

768

768

2

256

0.7 ns

768

768

8000

1.05 mm

13 mm

13 mm

无