N/A

-

N/A

-

N/A

-

表面贴装

84

Compliant

70 °C

0 °C

4.5 kB

3072

125000

N/A

-

YES

132

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

HVBCC, LGA132(UNSPEC)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LGA132(UNSPEC)

1.5 V

未说明

1.425 V

70 °C

有

AGL060V5-QNG132

108 MHz

HVBCC

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B132

80

不合格

1.5 V

COMMERCIAL

80

1536 CLBS, 60000 GATES

0.8 mm

现场可编程门阵列

1536

1536

60000

8 mm

8 mm

N/A

-

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.2 V

1.14 V

无

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.29

HS350060G1100

Hollowshaft

Hollow

Danaher Controls

267

Non-Compliant

Tray

M2GL050

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 to 70 Degrees C

IGLOO2

e0

6 Pin Connector

Tin/Lead (Sn/Pb)

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

20

S-PBGA-B484

267

不合格

5~26 VDC

单端

1.2 V

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

5~26 VDC

有

IP67

不包括

23 mm

23 mm

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

484-FBGA (19x19)

Aluminum

微芯片技术

(2) 125V Receptacles

P-P1#2-K3RD0

Grace Technologies

Non-Compliant

248

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

146124

5120000

IP65

N/A

-

表面贴装

YES

400

400

207

Non-Compliant

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

无

M2GL050S-1VF400I

FBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.3

100 °C

-40 °C

现场可编程门阵列

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

现场可编程门阵列

56340

56340

N/A

-

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

729-BBGA

YES

729

729-PBGA (35x35)

729

微芯片技术

PLASTIC/EPOXY

BGA729,27X27,50

-40 °C

1.5 V

30

1.425 V

85 °C

无

AX1000-BG729I

649 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

1.5000 V

1.425 V

1.575 V

516

Compliant

Tray

AX1000

活跃

BGA, BGA729,27X27,50

网格排列

3

-40 to 85 °C

Axcelerator

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1.27 mm

unknown

649 MHz

729

S-PBGA-B729

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.54 mm

现场可编程门阵列

12096

165888

1e+06

649 MHz

18144

12096

STD

12096

0.99 ns

12096

18144

1000000

1.73 mm

35 mm

35 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

1.425 V

85 °C

无

A3P600-FG144

350 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

1.5000 V

1.425 V

1.575 V

97

Compliant

Tray

A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

0 to 70 °C

ProASIC3

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

231 MHz

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

484-BFBGA

484-FPBGA (19x19)

微芯片技术

284

Tray

MPF100

活跃

109000 LE

1.03 V/1.08 V

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

PolarFire™

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

PolarFire

Details

584

Tray

MPF500

活跃

有

This product may require additional documentation to export from the United States.

481000 LE

+ 100 C

1.08 V

1.771987 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

-40°C ~ 100°C (TJ)

Tray

PolarFire™

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

481000

FPGA - Field Programmable Gate Array

33792000

24 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

BGA, BGA676,26X26,40

网格排列

5.27

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

M2GL090TS-1FG676I

无

20

1.2 V

BGA676,26X26,40

PLASTIC/EPOXY

3

425

Tray

M2GL090

活跃

Non-Compliant

86184 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

N/A

-

表面贴装

YES

176

Plastic

176

3 V

85 °C

无

129 MHz

LFQFP

SQUARE

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

22962

Brady

140

Compliant

LFQFP, QFP176,1.0SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

-40 °C

3.3 V

30

e0

Safety Signs

锡铅

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

176

S-PQFP-G176

140

不合格

5 V

3.3,3.3/5,5 V

INDUSTRIAL

5.5 V

3 V

140

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

608

24000

237 MHz

608

3

Do Not Start Machine Being Repaired

928

1.9 ns

1232

1232

White

24000

English

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

YES

176

176

无

A42MX24-1TQ176I

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

150

Compliant

1.40 MM HEIGHT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

-40 °C

3.3 V

30

3 V

85 °C

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

176

S-PQFP-G176

150

不合格

5 V

3.3,3.3/5,5 V

INDUSTRIAL

5.5 V

3 V

150

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

912

1

1410

2.1 ns

1890

1866

36000

1.4 mm

24 mm

24 mm

无

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

无

微芯片技术

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

377

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-1FG896

0°C ~ 85°C (TJ)

IGLOO2

Black

Power

Receptacle

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

216251

Pepperl Fuchs

N/A

-

表面贴装

YES

68

68

SQUARE

Obsolete

MICROSEMI CORP

5.5 V

5.84

CHIP CARRIER

PLASTIC, LCC-68

LCC

STS366FW3

Cutler Hammer, Div of Eaton Corp

57

Compliant

PLASTIC/EPOXY

LDCC68,1.0SQ

-40 °C

5 V

4.5 V

85 °C

无

54.1 MHz

QCCJ

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

J BEND

1.27 mm

unknown

68

S-PQCC-J68

57

不合格

5 V

5 V

INDUSTRIAL

3.4 ns

3.4 ns

57

547 CLBS, 2000 GATES

4.572 mm

现场可编程门阵列

1200

295

2

147

547

295

2000

24.2316 mm

24.2316 mm

无

N/A

-

Surface Mount, Through Hole

NO

176

176

PGA176,15X15

-55 °C

5 V

未说明

4.5 V

125 °C

无

75 MHz

PGA

SQUARE

Obsolete

MICROSEMI CORP

5.5 V

5.84

PDG23K0150E3WL

CE, CSA, UL

Cutler Hammer, Div of Eaton Corp

Panel

140

Compliant

PGA, PGA176,15X15

网格排列

3

CERAMIC, METAL-SEALED COFIRED

e0

EAR99

Tin/Lead (Sn/Pb)

125 °C

-55 °C

MAX 140 I/OS

8542.39.00.01

现场可编程门阵列

CMOS

PERPENDICULAR

PIN/PEG

未说明

2.54 mm

unknown

150 A

90 MHz

S-CPGA-P176

140

不合格

5 V

5 V

MILITARY

5.5 V

4.5 V

4.3 ns

140

1232 CLBS, 8000 GATES

7.874 mm

现场可编程门阵列

1232

8000

1232

1

998

4.3 ns

1232

1232

8000

39.878 mm

39.878 mm

无