N/A

-

Dwyer Instruments

5 Inches

BT15S54551

N/A

-

HS351024G134D

Danaher Controls

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

Details

Tray

MPF300

活跃

240789-100003

Pepperl Fuchs

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

512 I/O

+ 100 C

1.08 V

9.210472 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip Technology / Atmel

PolarFire

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

16 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

78101197456

Cooper

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

微芯片技术

HQCCN

SQUARE

不推荐

MICROSEMI CORP

1.575 V

7.07

Miscellaneous

SW-05V

34

Tray

A3PN030

活跃

HQCCN,

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

-40 °C

1.5 V

30

1.425 V

85 °C

有

-40°C ~ 100°C (TJ)

ProASIC3 nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

现场可编程门阵列

30000

STD

768

30000

6 mm

6 mm

N/A

-

表面贴装

536-LFBGA

536-BGA (16x16)

微芯片技术

P56H319

Reliance Electric

300

Tray

活跃

-55°C ~ 125°C (TJ)

PolarFire™

0.97V ~ 1.08V

300000

21600666

N/A

-

表面贴装

1206 (3216 Metric)

1206

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RK73G2B

活跃

84

-55°C ~ 155°C

RK73G-RT

0.126 L x 0.063 W (3.20mm x 1.60mm)

±0.25%

2

±50ppm/°C

634 kOhms

厚膜

0.25W, 1/4W

1.14V ~ 2.625V

-

12084

933888

Anti-Sulfur, Automotive AEC-Q200

0.028 (0.70mm)

AEC-Q200

N/A

-

YES

208

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

30

1.425 V

85 °C

无

AX250-PQ208I

649 MHz

FQFP

e0

Tin/Lead (Sn/Pb)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

248

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

248

2816 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

0.99 ns

2816

4224

250000

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

有

A3P600L-FGG144I

350 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

0.78

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

97

Compliant

Tray

A3P600

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

1.14 V

85 °C

-40°C ~ 100°C (TJ)

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

1.26 V

1.14 V

5 mA

13.5 kB

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

781.25 MHz

STD

13824

13824

13824

600000

1.05 mm

13 mm

13 mm

无

N/A

-

YES

208

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.81

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

1.425 V

85 °C

有

A3PE600-PQG208I

350 MHz

FQFP

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

Copper, Silver, Tin

表面贴装

表面贴装

484-BGA

484

484-FPBGA (23x23)

微芯片技术

FLASH

Tray

A3P600

活跃

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

235

Compliant

0°C ~ 85°C (TJ)

ProASIC3

70 °C

0 °C

1.425V ~ 1.575V

231 MHz

1.5 V

1.575 V

1.4 V

128 B

5 mA

13.5 kB

6500

110592

600000

231 MHz

STD

13824

85 °C

1.73 mm

23 mm

23 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

1.2 V

BGA896,30X30,40

PLASTIC/EPOXY

3

网格排列

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

620

Compliant

Tray

A3PE3000

活跃

5.3

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

250 MHz

A3PE3000L-1FG896

无

70 °C

1.14 V

30

0°C ~ 85°C (TJ)

ProASIC3L

e0

锡铅

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.2 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3e+06

892.86 MHz

1

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

144-LBGA

144-FPBGA (13x13)

微芯片技术

97

Tray

A3P400

活跃

-40°C ~ 100°C (TJ)

ProASIC3

1.425V ~ 1.575V

55296

400000

STD

N/A

-

Production (Last Updated: 2 months ago)

Surface Mount, Through Hole

表面贴装

624-BCLGA

YES

624

624-CLGA (32.5x32.5)

624

微芯片技术

活跃

MICROSEMI CORP

2.7 V

5.26

Military grade

440

Tray

APA1000

活跃

Compliant

BGA,

网格排列

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

未说明

2.3 V

125 °C

无

APA1000-LG624B

BGA

SQUARE

Microsemi Corporation

-55°C ~ 125°C (TJ)

ProASICPLUS

3A001.A.2.C

125 °C

-55 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

未说明

compliant

180 MHz

S-CBGA-B624

不合格

2.5 V

MILITARY

2.7 V

2.3 V

5 mA

24.8 kB

1000000 GATES

现场可编程门阵列

202752

1000000

150 MHz

MIL-STD-883 Class B

56320

1000000

无

N/A

-

YES

208

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

8.76

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

30

1.425 V

85 °C

无

A3PE600-2PQ208I

350 MHz

FQFP

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

208

208

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

154

Compliant

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

30

1.14 V

85 °C

无

A3P600L-PQ208I

350 MHz

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

1.26 V

1.14 V

5 mA

13.5 kB

154

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

600000

781.25 MHz

13824

13824

13824

600000

3.4 mm

28 mm

28 mm

无

含铅

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

Microsemi Corporation

SQUARE

BGA

350 MHz

A3P1000L-1FG256I

无

85 °C

1.14 V

30

1.2 V

-40 °C

BGA256,16X16,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA256,16X16,40

1.2000 V

1.14 V

1.26 V

177

Tray

A3P1000

活跃

MICROSEMI CORP

1.575 V

1.55

活跃

-40 to 85 °C

ProASIC3L

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

17 mm

17 mm

N/A

-

YES

144

Obsolete

MICROSEMI CORP

1.575 V

7.67

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

40

1.14 V

70 °C

有

A3P250L-FGG144

350 MHz

LBGA

SQUARE

Microsemi Corporation

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

COMMERCIAL

97

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

6144

250000

13 mm

13 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

125 °C

有

A3P1000-FGG256T

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

Automotive grade

177

Tray

A3P1000

活跃

1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.5 V

40

1.425 V

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

AUTOMOTIVE

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

AEC-Q100

STD

24576

24576

1000000

17 mm

17 mm

N/A

-

N/A

-

YES

256

GQFF, TPAK256,3SQ,20

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

TPAK256,3SQ,20

-55 °C

5 V

4.5 V

125 °C

A14100A-1CQ256M

125 MHz

GQFF

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.79

e0

3A001.A.2.C

锡铅

25000 PLD EQUIVALENT GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

228

不合格

5 V

MILITARY

228

1377 CLBS, 10000 GATES

3.3 mm

现场可编程门阵列

2.6 ns

1377

1377

10000

36 mm

36 mm

N/A

-

表面贴装

80

Non-Compliant

57

85 °C

-40 °C

57 MHz

5 V

5.5 V

4.5 V

3.8 ns

295

1200

295

1

147

N/A

-

表面贴装

YES

44

44

40.5 MHz

QCCJ

SQUARE

Actel Corporation

Transferred

ACTEL CORP

5.5 V

5.83

34

Compliant

QCCJ, LDCC44,.7SQ

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC44,.7SQ

-40 °C

5 V

30

4.5 V

85 °C

无

A1020B-PL44I

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

MAX 34 I/OS

现场可编程门阵列

CMOS

QUAD

J BEND

225

1.27 mm

compliant

48 MHz

S-PQCC-J44

69

不合格

5 V

5 V

INDUSTRIAL

5.5 V

4.5 V

4.5 ns

4.5 ns

69

547 CLBS, 2000 GATES

4.445 mm

现场可编程门阵列

547

2000

547

273

4.5 ns

547

547

2000

16.51 mm

16.51 mm

无

N/A

-

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

317

Tray

AX500

活跃

-55°C ~ 125°C (TA)

Axcelerator

1.425V ~ 1.575V

73728

500000

8064