品牌是'Microchip' (5152)
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![]() | AGL400V2-FGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 有 | AGL400V2-FGG144 | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 8.58 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.2 V | 40 | 1.14 V | 85 °C | e1 | 3A001.A.7.A | 锡银铜 | 8542.39.00.01 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | OTHER | 9216 CLBS, 400000 GATES | 1.55 mm | 现场可编程门阵列 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-TQ176M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 176 | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX16-TQ176M | 94 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | LFQFP, QFP176,1.0SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | e0 | 3A001.A.2.C | 锡铅 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 176 | S-PQFP-G176 | 140 | 不合格 | 3.3,3.3/5,5 V | MILITARY | 140 | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 2.8 ns | 1232 | 1232 | 24000 | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-TQG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 70 °C | 有 | A54SX16P-TQG144 | 240 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.6 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | e3 | 哑光锡 | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | COMMERCIAL | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 0.9 ns | 1452 | 16000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250L-1VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3P250L-1VQG100I | 350 MHz | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 7.67 | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | -40 °C | e3 | 哑光锡 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 68 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 68 | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 6144 | 250000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-1PLG84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | 4.5 V | 85 °C | 有 | A1020B-1PLG84I | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.8 | PLASTIC, MS-007-AE, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 40 | e3 | Matte Tin (Sn) | MAX 69 I/OS | 8542.39.00.01 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | INDUSTRIAL | 547 CLBS, 2000 GATES | 4.45 mm | 现场可编程门阵列 | 3.8 ns | 547 | 2000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-PL44C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | 30 | 4.75 V | 70 °C | 无 | A1020B-PL44C | 45 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 8.76 | LCC | QCCJ, LDCC44,.7SQ | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC44,.7SQ | 5 V | e0 | Tin/Lead (Sn/Pb) | MAX 34 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 69 | 不合格 | 5 V | COMMERCIAL | 69 | 547 CLBS, 2000 GATES | 4.572 mm | 现场可编程门阵列 | 4.5 ns | 547 | 547 | 2000 | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-PG84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-PL44I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | 5 V | 4.5 V | 85 °C | 无 | A1010B-PL44I | 40.5 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 8.76 | LCC | QCCJ, LDCC44,.7SQ | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC44,.7SQ | -40 °C | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 1.27 mm | unknown | 44 | S-PQCC-J44 | 57 | 不合格 | 5 V | INDUSTRIAL | 57 | 295 CLBS, 1200 GATES | 4.572 mm | 现场可编程门阵列 | 295 | 295 | 1200 | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-FGG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 256 | 微芯片技术 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 1.425 V | 85 °C | 有 | AFS250-FGG256 | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.6 | 1.5000 V | 1.425 V | 1.575 V | 114 | Compliant | Tray | AFS250 | 0 to 70 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B256 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | 现场可编程门阵列 | 36864 | 250000 | 350 MHz | STD | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | 无 | 无铅 | |||||||||||||||||||||||||||
![]() | A3P600L-FGG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 256 | 400.011771 mg | 256 | -40 °C | 1.2 V | 40 | 1.14 V | 85 °C | 有 | A3P600L-FGG256I | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.28 | 177 | Compliant | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | e1 | 锡银铜 | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | A1020B-2PLG68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1020B-1PL68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | 30 | 4.5 V | 85 °C | 无 | A1020B-1PL68I | 47.7 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | LCC | PLASTIC, LCC-68 | CHIP CARRIER | PLASTIC/EPOXY | LDCC68,1.0SQ | -40 °C | 5 V | MAX 57 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 68 | S-PQCC-J68 | 69 | 不合格 | 5 V | INDUSTRIAL | 69 | 547 CLBS, 2000 GATES | 4.572 mm | 现场可编程门阵列 | 3.8 ns | 547 | 547 | 2000 | 24.2316 mm | 24.2316 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX250-CQ352M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 352-BFCQFP with Tie Bar | 352-CQFP (75x75) | 微芯片技术 | 活跃 | 198 | Tray | AX250 | -55°C ~ 125°C (TA) | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL030V5-QNG132I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-TQ176M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 176 | 147 | Compliant | 125 °C | -55 °C | 238 MHz | 2.5 V | 2.75 V | 2.25 V | 1.2 ns | 1.2 ns | 2880 | 48000 | 238 MHz | 2880 | 1980 | 1.4 mm | 24 mm | 24 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-TQ176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 176 | 终身购买 | MICROSEMI CORP | 5.84 | FLATPACK | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -40 °C | 85 °C | 无 | A54SX08-TQ176I | 230 MHz | QFP | SQUARE | Microsemi Corporation | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G176 | 128 | 不合格 | 3.3,5 V | INDUSTRIAL | 128 | 现场可编程门阵列 | 768 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010T-FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL010 | 活跃 | 12084 LE | + 85 C | 微芯片技术 | 1.2 V | 0 C | 1.2 V | SMD/SMT | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 85 °C | 无 | M2GL010T-FG484 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.3 | 233 | Non-Compliant | Tray | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | OTHER | 114 kB | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | 933888 | STD | 4 Transceiver | 12084 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||
![]() | A42MX24-3TQ176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 176 | 176 | QFP176,1.0SQ,20 | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX24-3TQ176I | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | QFP | 150 | Compliant | LFQFP, QFP176,1.0SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | e0 | 锡铅 | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 176 | S-PQFP-G176 | 150 | 不合格 | 5 V | 3.3,3.3/5,5 V | INDUSTRIAL | 5.5 V | 3 V | 150 | 1890 CLBS, 36000 GATES | 1.6 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 3 | 1410 | 2 ns | 1890 | 1866 | 36000 | 1.4 mm | 24 mm | 24 mm | 无 | ||||||||||||||||||||||||||||||||||
![]() | A3P600L-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 208 | 208 | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | A3P600L-1PQ208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | 154 | Compliant | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | A3P600L-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 208 | 208 | 1.2 V | 30 | 1.14 V | 70 °C | 无 | A3P600L-PQ208 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | 154 | Compliant | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.2 V | 1.5/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 154 | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||
![]() | AX250-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 85 °C | 1.425 V | 40 | 1.5 V | -40 °C | QFP208,1.2SQ,20 | PLASTIC/EPOXY | 3 | FLATPACK, FINE PITCH | FQFP, QFP208,1.2SQ,20 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.6 | FQFP | 763 MHz | AX250-1PQG208I | 有 | e3 | 哑光锡 | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 248 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 248 | 2816 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 0.84 ns | 2816 | 4224 | 250000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL600V5-CSG281I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 281-TFBGA, CSBGA | 281-CSP (10x10) | 微芯片技术 | 1.5000 V | 1.425 V | 1.575 V | 215 | Tray | AGL600 | 活跃 | -40 to 85 °C | IGLOO | 1.425V ~ 1.575V | 281 | 13824 | 110592 | 600000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL400V5-CSG196I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 196 | 1.425 V | 100 °C | 有 | AGL400V5-CSG196I | TFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.28 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 未说明 | 3A001.A.7.A | 8542.39.00.01 | CMOS | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B196 | 不合格 | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.2 mm | 现场可编程门阵列 | STD | 9216 | 400000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1240A-PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 84 | 84 | LDCC84,1.2SQ | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | A1240A-PL84I | 66 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | 72 | Compliant | QCCJ, LDCC84,1.2SQ | CHIP CARRIER | 3 | PLASTIC/EPOXY | e0 | EAR99 | 锡铅 | 85 °C | -40 °C | PLD EQUIVALENT GATES=10000 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 90 MHz | S-PQCC-J84 | 104 | 不合格 | 5 V | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 5 ns | 5 ns | 104 | 684 CLBS, 4000 GATES | 4.572 mm | 现场可编程门阵列 | 684 | 4000 | 684 | 568 | 5 ns | 684 | 684 | 4000 | 29.3116 mm | 29.3116 mm | 无 | |||||||||||||||||||||||||||||||||
![]() | A1225A-PQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 100 | 100 | QFP100,.7X.9 | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | A1225A-PQ100I | 75 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | 83 | Non-Compliant | PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | e0 | EAR99 | 锡铅 | 85 °C | -40 °C | PLD EQUIVALENT GATES=6250 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.65 mm | unknown | 110 MHz | R-PQFP-G100 | 83 | 不合格 | 5 V | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 5 ns | 83 | 451 CLBS, 2500 GATES | 3.4 mm | 现场可编程门阵列 | 451 | 2500 | 451 | 5 ns | 451 | 451 | 2500 | 20 mm | 14 mm |
AGL400V2-FGG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-TQ176M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16P-TQG144
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P250L-1VQG100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-1PLG84I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-PL44C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1010B-PG84C
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1010B-PL44I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS250-FGG256
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600L-FGG256I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-2PLG68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1020B-1PL68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX250-CQ352M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL030V5-QNG132I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-TQ176M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08-TQ176I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010T-FG484
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-3TQ176I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600L-1PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600L-PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX250-1PQG208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL600V5-CSG281I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL400V5-CSG196I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1240A-PL84I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A1225A-PQ100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
