43 In Stock

• 1: ¥62.111344
• 10: ¥58.595606
• 100: ¥55.278872
• 500: ¥52.149882
查看所有的价格

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

UNSPECIFIED

微芯片技术

-40 °C

85 °C

3

1.45

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68

MICROSEMI CORP

活跃

有

A3PN020-QNG68I

49

Tray

A3PN020

活跃

1.425 V

30

1.5 V

1.575 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

SQUARE

HVQCCN

-40°C ~ 100°C (TJ)

ProASIC3 nano

8542.39.00.01

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

520 CLBS, 20000 GATES

1 mm

现场可编程门阵列

20000

STD

520

20000

8 mm

8 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

LCC

QCCJ,

5.23

微芯片技术

92 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

34

Tray

A40MX02

Obsolete

3 V

A40MX02-1PL44M

无

Obsolete

MICROSEMI CORP

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

44

S-PQCC-J44

不合格

MILITARY

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

16.5862 mm

16.5862 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

5.24

350 MHz

微芯片技术

125 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

71

Tray

A3P125

Obsolete

1.425 V

Automotive grade

A3P125-1VQ100T

无

Obsolete

MICROSEMI CORP

TFQFP, TQFP100,.63SQ

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

71

不合格

1.5/3.3 V

AUTOMOTIVE

71

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

AEC-Q100

3072

3072

125000

14 mm

14 mm

N/A

-

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

LCC

QCCJ,

5.24

微芯片技术

146 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

72

Tray

A42MX09

Obsolete

3 V

A42MX09-2PL84I

无

Obsolete

MICROSEMI CORP

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

1.8 ns

684

14000

29.3116 mm

29.3116 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

5.25

350 MHz

微芯片技术

3

100 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.575 V

1.5 V

30

91

Tray

A3P060

Obsolete

1.425 V

A3P060-1TQ144I

无

Obsolete

MICROSEMI CORP

LFQFP,

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

18432

60000

1536

60000

20 mm

20 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

QFP

QFP,

5.23

微芯片技术

80 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

3.6 V

3 V

3.3 V

30

57

Tray

A40MX02

Obsolete

A40MX02-PQ100M

无

Obsolete

MICROSEMI CORP

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

MILITARY

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

2.7 ns

295

3000

20 mm

14 mm

N/A

-

YES

84

活跃

无

A54SX08-PL84

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

QCCJ

PLASTIC/EPOXY

70 °C

240 MHz

5.84

QCCJ, LDCC84,1.2SQ

MICROSEMI CORP

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J84

69

不合格

3.3,5 V

COMMERCIAL

69

现场可编程门阵列

768

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

5.61

357 MHz

微芯片技术

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.7 V

2.5 V

30

81

Tray

EX256

Obsolete

2.3 V

EX256-PTQ100I

无

Obsolete

MICROSEMI CORP

TQFP-100

-40°C ~ 85°C (TA)

EX

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G100

INDUSTRIAL

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

0.7 ns

12000

14 mm

14 mm

N/A

-

表面贴装

64-LQFP

YES

64-TQFP (10x10)

64

5.32

微芯片技术

250 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.7 V

2.5 V

46

Tray

EX128

Obsolete

2.3 V

无

30

EX128-TQ64

Obsolete

MICROSEMI CORP

TQFP-64

0°C ~ 70°C (TA)

EX

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G64

COMMERCIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

1 ns

6000

10 mm

10 mm

N/A

-

YES

144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.5 V

40

1.425 V

70 °C

有

108 MHz

LBGA

SQUARE

Transferred

ACTEL CORP

1.575 V

5.78

175G5536

Danfoss Electronics

Non-Compliant

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, FBGA-144

e1

锡银铜

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5 V

COMMERCIAL

97

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

6144

250000

13 mm

13 mm

N/A

-

表面贴装

YES

Brass

84

3

PLASTIC/EPOXY

LDCC84,1.2SQ

3.3 V

30

3 V

70 °C

无

A10V20B-PL84C

50 MHz

QCCJ

SQUARE

Obsolete

ACTEL CORP

3.6 V

5.87

Killark-Hubbell Electrical Products

69

Non-Compliant

PLASTIC, MS-007-AE, LCC-84

CHIP CARRIER

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

Metallic

MAX 69 I/OS

现场可编程门阵列

CMOS

QUAD

J BEND

225

1.27 mm

compliant

S-PQCC-J84

69

不合格

3.3 V

3.3 V

COMMERCIAL

6.5 ns

69

547 CLBS, 2000 GATES

4.45 mm

现场可编程门阵列

2000

547

273

4.5 ns

547

547

2000

29.21 mm

29.21 mm

无

N/A

-

表面贴装

68-LCC (J-Lead)

YES

68-PLCC (24.23x24.23)

68

Tray

A40MX04

Obsolete

QCCJ,

CHIP CARRIER

微芯片技术

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX04-2PL68I

101 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

LCC

Non-Compliant

57

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

68

S-PQCC-J68

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

24.2316 mm

24.2316 mm

240 In Stock

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

微芯片技术

PLASTIC/EPOXY

BGA1152,34X34,40

-55 °C

1.2 V

30

1.14 V

125 °C

有

M2GL150T-1FCG1152M

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.26

574

Tray

M2GL150

活跃

-55°C ~ 125°C (TJ)

IGLOO2

3A001.A.2.C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

MILITARY

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

896

400.011771 mg

896

1.425 V

70 °C

有

M1AGLE3000V2-FGG896

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

620

Compliant

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

e1

锡银铜

70 °C

0 °C

8542.39.00.01

CMOS

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.14 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

3e+06

892.86 MHz

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

2729 In Stock

• 1: ¥1,570.019216
• 10: ¥1,481.150203
• 100: ¥1,397.311511
• 500: ¥1,318.218407
查看所有的价格

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

PLASTIC/EPOXY

微芯片技术

BGA400,20X20,32

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-1VF400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

207

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

YES

208

70 °C

有

M7AFS600-1PQG208

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.8

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

e3

哑光锡

8542.39.00.01

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

600000 GATES

4.1 mm

现场可编程门阵列

600000

28 mm

28 mm

N/A

-

YES

208

M1AFS250-PQG208

有

85 °C

1.425 V

40

1.5 V

PLASTIC/EPOXY

3

FLATPACK

QFF,

5.82

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

RECTANGULAR

QFF

e3

哑光锡

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

360 In Stock

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

70 °C

无

A54SX16P-VQ100

240 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.79

Allen Bradley Control

81

Tray

A54SX16

Obsolete

QFP, TQFP100,.63SQ

FLATPACK

PLASTIC/EPOXY

TQFP100,.63SQ

0°C ~ 70°C (TA)

SX

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G100

81

不合格

3.3,3.3/5 V

COMMERCIAL

81

现场可编程门阵列

24000

1452

1452

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

Tray

A42MX24

微芯片技术

Obsolete

PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

FQFP

SQUARE

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

C3SS1-30B-20

CE, CSA, UL

ABB

176

Compliant

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

3

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.5 mm

compliant

208

S-PQFP-G208

不合格

5 V

MILITARY

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

Fingersafe Screw

912

36000

1.65

912

1

1410

2.1 ns

1890

1866

36000

2NO

IP66, IP67, IP69K

3.4 mm

28 mm

28 mm

无

N/A

-

YES

180

LGA180,20X20,20

-40 °C

1.5 V

未说明

1.425 V

85 °C

有

AFS250-QNG180I

5.32

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

VBCC

350 MHz

VBCC, LGA180,20X20,20

CHIP CARRIER, VERY THIN PROFILE

2

UNSPECIFIED

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B180

65

不合格

1.5,3.3 V

INDUSTRIAL

65

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

6144

6144

250000

10 mm

10 mm

N/A

-

表面贴装

YES

208

208

-40 °C

1.5 V

30

1.425 V

85 °C

无

AFS600-1PQ208I

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.84

95

Compliant

QFP-208

FLATPACK

3

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

QUAD

FLAT

225

0.5 mm

unknown

R-PQFP-F208

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

600000

1.28205 GHz

1

13824

13824

600000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

YES

108

108

3

UNSPECIFIED

LGA108,17X17,20

-40 °C

1.5 V

未说明

1.425 V

85 °C

有

AFS090-QNG108I

350 MHz

VBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.31

37

Compliant

VBCC, LGA108,17X17,20

CHIP CARRIER, VERY THIN PROFILE

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

1.0989 GHz

S-XBCC-B108

37

不合格

1.5 V

1.5,3.3 V

INDUSTRIAL

1.575 V

1.425 V

3.4 kB

37

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

90000

2304

2304

2304

90000

8 mm

8 mm

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

PLASTIC/EPOXY

微芯片技术

-20 °C

1.5 V

未说明

1.425 V

70 °C

有

AGLN125V5-ZCSG81

VFBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.81

60

Tray

AGLN125

Obsolete

5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

-20°C ~ 85°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

OTHER

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

3072

36864

125000

3072

125000

5 mm

5 mm

2352 In Stock

• 1: ¥1,676.162702
• 10: ¥1,581.285566
• 100: ¥1,491.778835
• 500: ¥1,407.338523
查看所有的价格

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

活跃

56520 LE

+ 100 C

1.2 V

微芯片技术

- 40 C

1.2 V

SMD/SMT

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-FG484I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.26

267

Tray

M2GL060

-40°C ~ 100°C (TJ)

IGLOO2

e0

Tin/Lead (Sn63Pb37)

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

1.2 V

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

23 mm

23 mm

11 In Stock

• 1: ¥155.122931
• 10: ¥146.342387
• 100: ¥138.058855
• 500: ¥130.244199
查看所有的价格

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

LFBGA,

微芯片技术

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL005S-1VFG256

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.28

161

Tray

M2GL005

活跃

1.26 V

1.14 V

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm