N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

QFP100,.63SQ,20

2.5 V

40

70 °C

有

A54SX08A-1TQG100

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

278 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX08

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

0°C ~ 70°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

127

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

127

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.1 ns

768

768

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

微芯片技术

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-1FGG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

-40 to 85 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

-40 °C

5 V

40

125 °C

有

A40MX04-PLG84A

116 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.59

0.239083 oz

Actel

16

有

120 MHz

SMD/SMT

+ 125 C

- 40 C

4.75 V

69 I/O

Details

5.25 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40°C ~ 125°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

5 V

AUTOMOTIVE

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

STD

2.2 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

AFS600

活跃

This product may require additional documentation to export from the United States.

N

7000 LE

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

-40°C ~ 100°C (TJ)

Tray

AFS600

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

微芯片技术

Tray

M1A3PE1500

活跃

1.575 V

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

有

M1A3PE1500-2FGG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

0 to 70 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

AFS600

活跃

This product may require additional documentation to export from the United States.

N

7000 LE

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.47059 GHz

2

13824

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

AFS600

活跃

This product may require additional documentation to export from the United States.

N

7000 LE

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.47059 GHz

2

13824

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

, BGA325,21X21,20

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090-FCSG325I

活跃

MICROSEMI CORP

5.3

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

20

无

M2GL025T-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

STD

4 Transceiver

27696

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-LBGA

256

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

7000 LE

有

90

Fusion

119

Tray

AFS600

活跃

-55°C ~ 100°C (TJ)

Tray

AFS600

100 °C

-55 °C

1.425V ~ 1.575V

13.5 kB

110592

600000

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-2FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE1500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

-40°C ~ 100°C (TJ)

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M1A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

0 to 70 °C

Tray

M1A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-1PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

0 to 70 °C

Tray

M1A3P600

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

1

13824

600000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

无

M1AGL250V5-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

3000 LE

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

有

160

IGLOOe

0.014110 oz

1.575 V

Tray

M1AGL250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

0°C ~ 70°C (TA)

Tray

M1AGL250V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

OTHER

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-1FGG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

-40°C ~ 100°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

100-VQFP (14x14)

微芯片技术

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

Details

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

0 to 70 °C

Tray

M1A3P250

1.425V ~ 1.575V

1.5 V

36864

250000

2

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

M1A3PE1500-2FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA484,22X22,40

网格排列

0°C ~ 85°C (TJ)

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

Tray

MPF500

活跃

MPF500T-1FCG1152E

活跃

MICROSEMI CORP

5.77

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

PolarFire

1

1.03 V/1.08 V

584

0°C ~ 100°C (TJ)

Tray

MPF500T

0.97V ~ 1.08V

compliant

1.05 V

现场可编程门阵列

481000

33792000

N/A

-

Production (Last Updated: 2 months ago)

Lead, Tin

表面贴装

表面贴装

FBGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

0.014110 oz

2.5000 V

2.3 V

2.7 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

N

454 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

40

Actel

-40 to 85 °C

Tray

APA600

85 °C

-40 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

微芯片技术

125 °C

有

A42MX36-BGG272M

73 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Actel

40

有

131 MHz

SMD/SMT

+ 125 C

- 55 C

3 V

202 I/O

Details

This product may require additional documentation to export from the United States.

5.5 V

Tray

A42MX36

Obsolete

ROHS COMPLIANT, PLASTIC, BGA-272

网格排列

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

-55°C ~ 125°C (TC)

Tray

A42MX36

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

131 MHz

1184

1822

2.7 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

202 I/O

3 V

0 C

+ 70 C

SMD/SMT

164 MHz

有

40

Actel

5.25 V

Tray

A42MX36

Obsolete

BGA,

网格排列

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-2BGG272

91 MHz

0°C ~ 70°C (TA)

Tray

A42MX36

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

164 MHz

1184

2

1822

2.1 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

有

90

ProASIC3

1.425 V

71 I/O

N

ProASIC®3

85C

微芯片技术

Commercial

VQFP

60000

0C to 85C

71

60000

130NM

1.575(V)

1.5(V)

无

1.425(V)

0C

有

1536

表面贴装

1.575 V

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P060-1VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.22

0 C

+ 70 C

SMD/SMT

272 MHz

0°C ~ 85°C (TJ)

Tray

A3P060

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

272(MHz)

100

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

微芯片技术

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

70 °C

无

M1A3PE3000L-1FG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

27

ProASIC3

0.014110 oz

1.26 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

0°C ~ 85°C (TJ)

Tray

M1A3PE3000L

e0

锡铅

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

P1AFS1500

活跃

This product may require additional documentation to export from the United States.

N

有

60

Fusion

223

Tray

0°C ~ 85°C (TJ)

Tray

P1AFS1500

1.425V ~ 1.575V

276480

1500000

2