品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 内存大小 | 传播延迟 | 接通延迟时间 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | A54SX16P-PQG208M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | SMD/SMT | 240 MHz | 有 | 24 | Actel | SX | 125C | PQFP | 微芯片技术 | 24000 | -55C to 125C | 175 | 16000 | 1452 | 0.35um | 3.6/5.25(V) | 3.3/5(V) | 无 | 3/4.75(V) | -55C | 有 | 924 | 528 | 表面贴装 | 3.6 V | Tray | A54SX16 | 活跃 | QFP, QFP208,1.2SQ,20 | FLATPACK | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -55 °C | 125 °C | 有 | A54SX16P-PQG208M | 207 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.81 | This product may require additional documentation to export from the United States. | Details | 175 I/O | 3 V | - 55 C | + 125 C | -55°C ~ 125°C (TC) | Tray | A54SX16P | 3A001.A.2.C | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 0.5 mm | compliant | 240(MHz) | 208 | S-PQFP-G208 | 175 | 不合格 | 3.3 V, 5 V | 3.3,3.3/5 V | MILITARY | 175 | 现场可编程门阵列 | 24000 | 1452 | 1452 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF100TL-FCG484E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FPBGA (19x19) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 109000 LE | 970 mV/1.02 V | SMD/SMT | 7.6 Mbit | 有 | 1 | PolarFire | 1.03 V/1.08 V | 244 | Tray | MPF100 | 活跃 | 0°C ~ 100°C (TJ) | Tray | MPF100TL | 0.97V ~ 1.08V | 109000 | 7782400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200T-FCG784E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-784 | 784-FCBGA (29x29) | 微芯片技术 | PolarFire | 1 | 有 | SMD/SMT | + 100 C | 0 C | 0.97 V | 364 I/O | 192000 LE | Details | This product may require additional documentation to export from the United States. | 1.08 V | Tray | MPF200 | 活跃 | 0°C ~ 100°C (TJ) | Tray | MPF200T | 0.97V ~ 1.08V | 1 V, 1.05 V | 12.5 Gb/s | 192000 | 13619200 | 16 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA600-FG256A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | 微芯片技术 | - 40 C | + 125 C | SMD/SMT | 180 MHz | 有 | 90 | Actel | 0.014110 oz | Tray | APA600 | 活跃 | 2.625 V | This product may require additional documentation to export from the United States. | N | 186 I/O | 2.375 V | -40°C ~ 125°C (TJ) | Tray | APA600 | 125 °C | -40 °C | 2.375V ~ 2.625V | 2.5 V | 2.625 V | 2.375 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.2 mm | 17 mm | 17 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300T-FCSG536E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-536 | 536-CSPBGA (16x16) | 微芯片技术 | MPF300 | 活跃 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 300 I/O | 0.97 V | 0 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.08 V | Tray | 0°C ~ 100°C (TJ) | Tray | MPF300T | 0.97V ~ 1.08V | 1 V, 1.05 V | 12.5 Gb/s | 300000 | 21094400 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF100TL-FCSG325E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-325 | 325-FCBGA (11x11) | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 109000 LE | 970 mV/1.02 V | SMD/SMT | 7.6 Mbit | 有 | 1 | PolarFire | 1.03 V/1.08 V | 170 | Tray | MPF100 | 活跃 | 0°C ~ 100°C (TJ) | Tray | MPF100TL | 0.97V ~ 1.08V | 109000 | 7782400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-TQG100A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TQFP-100 | 100-TQFP (14x14) | 微芯片技术 | Details | 81 I/O | 2.25 V | - 40 C | + 125 C | SMD/SMT | 238 MHz | 有 | 90 | Actel | 0.023175 oz | 2.75 V | Tray | A54SX08 | 活跃 | -40°C ~ 125°C (TA) | Tray | A54SX08A | 2.25V ~ 5.25V | 2.5 V | 12000 | 768 | STD | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA450-FGG144 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 微芯片技术 | 180 MHz | 5.26 | MICROSEMI CORP | 活跃 | SQUARE | LBGA | This product may require additional documentation to export from the United States. | Details | 100 I/O | 2.3 V | 0 C | + 70 C | SMD/SMT | 180 MHz | 有 | 160 | Actel | 0.014110 oz | 2.7 V | 活跃 | APA450 | Tray | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 2.5 V | 40 | 70 °C | 有 | APA450-FGG144 | 0°C ~ 70°C (TA) | Tray | APA450 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | 180 MHz | S-PBGA-B144 | 100 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 13.5 kB | 100 | 450000 GATES | 1.55 mm | 现场可编程门阵列 | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 450000 | 1.05 mm | 13 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TS-1FCVG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-484 | 484-FCBGA (19x19) | 微芯片技术 | MPF300 | 活跃 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 284 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.03 V/1.08 V | Tray | -40°C ~ 100°C (TJ) | Tray | MPF300TS | 0.97V ~ 1.08V | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-FG676I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | 649 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | This product may require additional documentation to export from the United States. | N | 418 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 649 MHz | 有 | 40 | Actel | 0.014110 oz | 1.575 V | Tray | AX1000 | 活跃 | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 85 °C | 无 | AX1000-FG676I | -40°C ~ 85°C (TA) | Tray | AX1000 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B676 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | 12096 | 0.99 ns | 12096 | 1000000 | 1.73 mm | 27 mm | 27 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-1FGG324 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | 微芯片技术 | BGA324,18X18,40 | 1.2 V | 40 | 70 °C | 有 | A3PE3000L-1FGG324 | 250 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | This product may require additional documentation to export from the United States. | Details | 221 I/O | 1.14 V | 0 C | + 70 C | SMD/SMT | 892.86 MHz | 有 | 84 | ProASIC3 | 0.014110 oz | 1.2000 V | 1.14 V | 1.26 V | Tray | A3PE3000 | 活跃 | 1.26 V | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324 | 网格排列 | 3 | PLASTIC/EPOXY | 0 to 70 °C | Tray | A3PE3000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B324 | 221 | 不合格 | 1.5 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | 现场可编程门阵列 | 516096 | 3000000 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P060-1FGG144I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FBGA | 144-FPBGA (13x13) | 微芯片技术 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P060 | 活跃 | Details | 96 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 272 MHz | 有 | 160 | ProASIC3 | -40 to 85 °C | Tray | A3P060 | 1.425V ~ 1.575V | 1.5 V | 18432 | 60000 | 1 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-3PQG208I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 活跃 | MICROSEMI CORP | 5.3 | Details | 176 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 180 MHz | 有 | 24 | Actel | 5.5 V | Tray | A42MX36 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX36-3PQG208I | 100 MHz | FQFP | SQUARE | -40°C ~ 85°C (TA) | Tray | A42MX36 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 54000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TL-FCG1152I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-1152 | 1152-FCBGA (35x35) | 微芯片技术 | MPF300 | 活跃 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 512 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.03 V/1.08 V | Tray | -40°C ~ 100°C (TJ) | Tray | MPF300TL | 0.97V ~ 1.08V | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-0054302QYC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | 微芯片技术 | 171 I/O | 2.5 V | - 55 C | + 125 C | SMD/SMT | 250 MHz | 有 | 1 | 2.5 V | Tray | 5962-0054302 | 活跃 | GQFF, | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | -55 °C | 2.5 V | 125 °C | 5962-0054302QYC | GQFF | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Military grade | This product may require additional documentation to export from the United States. | N | -55°C ~ 125°C (TJ) | SX-A | e4 | 3A001.A.2.C | GOLD | 125 °C | -55 °C | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 0.5 mm | compliant | 250 MHz | S-CQFP-F208 | Qualified | 2.5 V | MILITARY | 2.75 V | 2.25 V | 1.3 ns | 1.3 ns | 72000 GATES | 3.16 mm | 现场可编程门阵列 | 4024 | 108000 | 250 MHz | 6036 | MIL-PRF-38535 Class Q | 6036 | 1 | 4024 | 72000 | 29.21 mm | 29.21 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200T-1FCSG536E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-536 | 536-CSPBGA (16x16) | 微芯片技术 | Details | 192000 LE | 300 I/O | 970 mV/1.02 V | SMD/SMT | 有 | 1 | PolarFire | 1.03 V/1.08 V | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C (TJ) | Tray | MPF200T | 0.97V ~ 1.08V | 1.05 V | 192000 | 13619200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT40K20-2AJC | Microchip Technology | 数据表 | 1050 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 84-PLCC (29.31x29.31) | 62 | 0°C~70°C TC | Tube | 1997 | AT40K/KLV | Obsolete | 2 (1 Year) | 70°C | 0°C | 4.75V~5.25V | AT40K20 | 5V | 5.25V | 4.75V | 1kB | 1kB | 1024 | 8192 | 30000 | 100MHz | 1024 | 2 | 1024 | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-1PQG208 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.6 | ProASIC3 | 24 | 有 | 892.86 MHz | SMD/SMT | + 70 C | 0 C | 1.14 V | 147 I/O | Details | This product may require additional documentation to export from the United States. | 1.26 V | Tray | A3PE3000 | 活跃 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 40 | 70 °C | 有 | A3PE3000L-1PQG208 | 250 MHz | 0°C ~ 85°C (TJ) | Tray | A3PE3000L | e3 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TL-FCG784E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-784 | 784-FCBGA (29x29) | 微芯片技术 | 有 | 1 | PolarFire | 1.03 V/1.08 V | 388 | Tray | MPF500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 0°C ~ 100°C (TJ) | Tray | MPF500TL | 0.97V ~ 1.08V | 1.05 V | 481000 | 33792000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-VQG100M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 有 | A42MX16-VQG100M | 94 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.55 | This product may require additional documentation to export from the United States. | Details | 83 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 172 MHz | 有 | 90 | Actel | 5.5 V | Tray | A42MX16 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 未说明 | 125 °C | -55°C ~ 125°C (TC) | Tray | A42MX16 | 3A001.A.2.C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 3.3 V, 5 V | MILITARY | 1232 CLBS, 24000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 24000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050-FCS325I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | 有 | 176 | IGLOO2 | 200 | Tray | M2GL050 | 活跃 | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | 网格排列 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 20 | 1.14 V | 无 | M2GL050-FCS325I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | N | -40°C ~ 100°C (TJ) | Tray | M2GL050 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | 200 | 现场可编程门阵列 | 56340 | 1869824 | STD | 56340 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200TS-FCSG536I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-536 | 536-CSPBGA (16x16) | 微芯片技术 | 有 | 1 | PolarFire | 1.03 V/1.08 V | 300 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | -40°C ~ 100°C (TJ) | Tray | MPF200TS | 0.97V ~ 1.08V | 1.05 V | 192000 | 13619200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200TL-FCSG536E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-536 | 536-CSPBGA (16x16) | 微芯片技术 | 有 | 1 | PolarFire | 1.03 V/1.08 V | 300 | Tray | MPF200 | 活跃 | This product may require additional documentation to export from the United States. | Details | 970 mV/1.02 V | SMD/SMT | 0°C ~ 100°C (TJ) | Tray | MPF200TL | 0.97V ~ 1.08V | 1.05 V | 192000 | 13619200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300T-FCG1152I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-1152 | 1152-FCBGA (35x35) | 微芯片技术 | MPF300 | 活跃 | This product may require additional documentation to export from the United States. | Details | 300000 LE | 512 I/O | 970 mV/1.02 V | - 40 C | + 100 C | SMD/SMT | 有 | 1 | 20.6 Mbit | PolarFire | 1.03 V/1.08 V | Tray | -40°C ~ 100°C (TJ) | Tray | MPF300T | 0.97V ~ 1.08V | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-2PLG84 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | 微芯片技术 | 117 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Details | 72 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 215 MHz | 有 | 16 | Actel | 0.239083 oz | 5.25 V | Tray | A42MX16 | 活跃 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-2PLG84 | 0°C ~ 70°C (TA) | Tube | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.572 mm | 现场可编程门阵列 | 24000 | 2.1 ns | 1232 | 24000 | 3.68 mm | 29.31 mm | 29.31 mm |
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