对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

已出版

系列

JESD-609代码

零件状态

湿度敏感性等级(MSL)

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

基本部件号

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

最大电源电压

最小电源电压

内存大小

内存大小

传播延迟

接通延迟时间

数据率

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

筛选水平

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

等效门数

高度

长度

宽度

辐射硬化

RoHS状态

无铅

A54SX16P-PQG208M
A54SX16P-PQG208M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

SMD/SMT

240 MHz

24

Actel

SX

125C

PQFP

微芯片技术

24000

-55C to 125C

175

16000

1452

0.35um

3.6/5.25(V)

3.3/5(V)

3/4.75(V)

-55C

924

528

表面贴装

3.6 V

Tray

A54SX16

活跃

QFP, QFP208,1.2SQ,20

FLATPACK

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

125 °C

A54SX16P-PQG208M

207 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.81

This product may require additional documentation to export from the United States.

Details

175 I/O

3 V

- 55 C

+ 125 C

-55°C ~ 125°C (TC)

Tray

A54SX16P

3A001.A.2.C

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

0.5 mm

compliant

240(MHz)

208

S-PQFP-G208

175

不合格

3.3 V, 5 V

3.3,3.3/5 V

MILITARY

175

现场可编程门阵列

24000

1452

1452

3.4 mm

28 mm

28 mm

MPF100TL-FCG484E
MPF100TL-FCG484E
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

1

PolarFire

1.03 V/1.08 V

244

Tray

MPF100

活跃

0°C ~ 100°C (TJ)

Tray

MPF100TL

0.97V ~ 1.08V

109000

7782400

MPF200T-FCG784E
MPF200T-FCG784E
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

PolarFire

1

SMD/SMT

+ 100 C

0 C

0.97 V

364 I/O

192000 LE

Details

This product may require additional documentation to export from the United States.

1.08 V

Tray

MPF200

活跃

0°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

192000

13619200

16 Transceiver

APA600-FG256A
APA600-FG256A
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

- 40 C

+ 125 C

SMD/SMT

180 MHz

90

Actel

0.014110 oz

Tray

APA600

活跃

2.625 V

This product may require additional documentation to export from the United States.

N

186 I/O

2.375 V

-40°C ~ 125°C (TJ)

Tray

APA600

125 °C

-40 °C

2.375V ~ 2.625V

2.5 V

2.625 V

2.375 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.2 mm

17 mm

17 mm

MPF300T-FCSG536E
MPF300T-FCSG536E
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

300 I/O

0.97 V

0 C

+ 100 C

SMD/SMT

1

20.6 Mbit

PolarFire

1.08 V

Tray

0°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

300000

21094400

4 Transceiver

MPF100TL-FCSG325E
MPF100TL-FCSG325E
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

1

PolarFire

1.03 V/1.08 V

170

Tray

MPF100

活跃

0°C ~ 100°C (TJ)

Tray

MPF100TL

0.97V ~ 1.08V

109000

7782400

A54SX08A-TQG100A
A54SX08A-TQG100A
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

Details

81 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

238 MHz

90

Actel

0.023175 oz

2.75 V

Tray

A54SX08

活跃

-40°C ~ 125°C (TA)

Tray

A54SX08A

2.25V ~ 5.25V

2.5 V

12000

768

STD

1.4 mm

14 mm

14 mm

APA450-FGG144
APA450-FGG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

180 MHz

5.26

MICROSEMI CORP

活跃

SQUARE

LBGA

This product may require additional documentation to export from the United States.

Details

100 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

160

Actel

0.014110 oz

2.7 V

活跃

APA450

Tray

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

40

70 °C

APA450-FGG144

0°C ~ 70°C (TA)

Tray

APA450

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

260

1 mm

compliant

180 MHz

S-PBGA-B144

100

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

13.5 kB

100

450000 GATES

1.55 mm

现场可编程门阵列

110592

450000

180 MHz

STD

12288

12288

450000

1.05 mm

13 mm

13 mm

MPF300TS-1FCVG484I
MPF300TS-1FCVG484I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

-40°C ~ 100°C (TJ)

Tray

MPF300TS

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

AX1000-FG676I
AX1000-FG676I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

649 MHz

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

AX1000-FG676I

-40°C ~ 85°C (TA)

Tray

AX1000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B676

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

1000000

1.73 mm

27 mm

27 mm

A3PE3000L-1FGG324
A3PE3000L-1FGG324
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

BGA324,18X18,40

1.2 V

40

70 °C

A3PE3000L-1FGG324

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

221 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

84

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

A3PE3000

活跃

1.26 V

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

0 to 70 °C

Tray

A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.5 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无铅

A3P060-1FGG144I
A3P060-1FGG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

Details

96 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

160

ProASIC3

-40 to 85 °C

Tray

A3P060

1.425V ~ 1.575V

1.5 V

18432

60000

1

1.05 mm

13 mm

13 mm

A42MX36-3PQG208I
A42MX36-3PQG208I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

活跃

MICROSEMI CORP

5.3

Details

176 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

24

Actel

5.5 V

Tray

A42MX36

活跃

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX36-3PQG208I

100 MHz

FQFP

SQUARE

-40°C ~ 85°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

180 MHz

1184

3

1822

1.9 ns

2438

54000

3.4 mm

28 mm

28 mm

MPF300TL-FCG1152I
MPF300TL-FCG1152I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

512 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

-40°C ~ 100°C (TJ)

Tray

MPF300TL

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

5962-0054302QYC
5962-0054302QYC
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

微芯片技术

171 I/O

2.5 V

- 55 C

+ 125 C

SMD/SMT

250 MHz

1

2.5 V

Tray

5962-0054302

活跃

GQFF,

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

125 °C

5962-0054302QYC

GQFF

SQUARE

活跃

MICROSEMI CORP

5.3

Military grade

This product may require additional documentation to export from the United States.

N

-55°C ~ 125°C (TJ)

SX-A

e4

3A001.A.2.C

GOLD

125 °C

-55 °C

2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

compliant

250 MHz

S-CQFP-F208

Qualified

2.5 V

MILITARY

2.75 V

2.25 V

1.3 ns

1.3 ns

72000 GATES

3.16 mm

现场可编程门阵列

4024

108000

250 MHz

6036

MIL-PRF-38535 Class Q

6036

1

4024

72000

29.21 mm

29.21 mm

MPF200T-1FCSG536E
MPF200T-1FCSG536E
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

Details

192000 LE

300 I/O

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1.05 V

192000

13619200

AT40K20-2AJC
AT40K20-2AJC
Microchip Technology 数据表

1050 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

84-LCC (J-Lead)

84

84-PLCC (29.31x29.31)

62

0°C~70°C TC

Tube

1997

AT40K/KLV

Obsolete

2 (1 Year)

70°C

0°C

4.75V~5.25V

AT40K20

5V

5.25V

4.75V

1kB

1kB

1024

8192

30000

100MHz

1024

2

1024

Non-RoHS Compliant

含铅

A3PE3000L-1PQG208
A3PE3000L-1PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

ProASIC3

24

892.86 MHz

SMD/SMT

+ 70 C

0 C

1.14 V

147 I/O

Details

This product may require additional documentation to export from the United States.

1.26 V

Tray

A3PE3000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.2 V

40

70 °C

A3PE3000L-1PQG208

250 MHz

0°C ~ 85°C (TJ)

Tray

A3PE3000L

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

3000000

3.4 mm

28 mm

28 mm

MPF500TL-FCG784E
MPF500TL-FCG784E
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

0°C ~ 100°C (TJ)

Tray

MPF500TL

0.97V ~ 1.08V

1.05 V

481000

33792000

A42MX16-VQG100M
A42MX16-VQG100M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

A42MX16-VQG100M

94 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.55

This product may require additional documentation to export from the United States.

Details

83 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

172 MHz

90

Actel

5.5 V

Tray

A42MX16

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

未说明

125 °C

-55°C ~ 125°C (TC)

Tray

A42MX16

3A001.A.2.C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

MILITARY

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

1 mm

14 mm

14 mm

M2GL050-FCS325I
M2GL050-FCS325I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

176

IGLOO2

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

M2GL050-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

STD

56340

MPF200TS-FCSG536I
MPF200TS-FCSG536I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

1

PolarFire

1.03 V/1.08 V

300

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

MPF200TS

0.97V ~ 1.08V

1.05 V

192000

13619200

MPF200TL-FCSG536E
MPF200TL-FCSG536E
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

1

PolarFire

1.03 V/1.08 V

300

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

0°C ~ 100°C (TJ)

Tray

MPF200TL

0.97V ~ 1.08V

1.05 V

192000

13619200

MPF300T-FCG1152I
MPF300T-FCG1152I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

512 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

-40°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

A42MX16-2PLG84
A42MX16-2PLG84
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

117 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

215 MHz

16

Actel

0.239083 oz

5.25 V

Tray

A42MX16

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX16-2PLG84

0°C ~ 70°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm