N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

M1A3PE3000-2FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

2

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

+ 125 C

SMD/SMT

153 MHz

有

微芯片技术

40

Actel

5.25 V

Tray

A42MX16

活跃

TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-TQG176A

139 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

140 I/O

4.75 V

- 40 C

-40°C ~ 125°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

5 V

AUTOMOTIVE

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

STD

2.2 ns

1232

24000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

- 40 C

+ 85 C

SMD/SMT

215 MHz

有

微芯片技术

16

Actel

0.239083 oz

5.5 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-2PLG84I

117 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

-40°C ~ 85°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

0 to 70 °C

Tray

M1A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

Fusion

0.014110 oz

1.575 V

活跃

M1AFS1500

Tray

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS1500-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

0°C ~ 85°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

无铅

N/A

-

表面贴装

PQFP-208

208-CQFP (75x75)

微芯片技术

This product may require additional documentation to export from the United States.

N

176 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

151 MHz

有

1

Actel

5.5 V

Tray

5962-9958502

活跃

-55°C ~ 125°C (TJ)

MX

3V ~ 3.6V, 4.5V ~ 5.5V

3.3 V, 5 V

2560

54000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

SMD/SMT

151 MHz

微芯片技术

有

40

Actel

5.5 V

Tray

A42MX36

Obsolete

BGA,

网格排列

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX36-1BGG272M

83 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

202 I/O

3 V

- 55 C

+ 125 C

-55°C ~ 125°C (TC)

Tray

A42MX36

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

Tray

M1A3P1000

活跃

1.575 V

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

1.425V ~ 1.575V

1.5 V

147456

1000000

1

N/A

-

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

Details

113 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

238 MHz

有

60

Actel

0.046530 oz

Tray

A54SX08

活跃

2.75 V

-40°C ~ 125°C (TA)

Tray

A54SX08A

2.25V ~ 5.25V

2.5 V

12000

768

STD

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

微芯片技术

Tray

M1AGL1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1AGL1000V5-FGG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

11000 LE

SMD/SMT

有

90

IGLOOe

177

-40°C ~ 85°C (TA)

Tray

M1AGL1000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

Tray

微芯片技术

M1A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P400-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

160

ProASIC3

97

0°C ~ 85°C (TJ)

Tray

M1A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

微芯片技术

60

ProASIC3

0.046530 oz

1.575 V

Tray

A3P060

Obsolete

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P060-TQ144I

350 MHz

LFQFP

SQUARE

Obsolete

MICROSEMI CORP

5.24

N

91 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

A3P060

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

18432

60000

1536

60000

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

160

ProASIC3

0.014110 oz

SMD/SMT

+ 85 C

- 40 C

微芯片技术

1.14 V

97 I/O

N

This product may require additional documentation to export from the United States.

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P600

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

A3P600L-FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

781.25 MHz

有

-40 to 85 °C

Tray

A3P600L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

1.26 V

1.14 V

5 mA

13.5 kB

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

781.25 MHz

STD

13824

13824

13824

600000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL025TS-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

267 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

N

138 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

微芯片技术

有

90

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

-55 °C

1.5 V

30

125 °C

无

AX250-FG256M

649 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

-55°C ~ 125°C (TA)

Tray

AX250

3A001.A.2.C

TIN LEAD/TIN LEAD SILVER

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

248

2816 CLBS, 250000 GATES

1.7 mm

现场可编程门阵列

55296

250000

4224

MIL-STD-883 Class B

0.99 ns

2816

4224

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

Tray

微芯片技术

M1A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

90

ProASIC3

178

0°C ~ 85°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

Tray

微芯片技术

M1A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

160

ProASIC3

97

0°C ~ 85°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

Tray

微芯片技术

M1A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P400-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

160

ProASIC3

97

0°C ~ 85°C (TJ)

Tray

M1A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-2FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

Details

This product may require additional documentation to export from the United States.

1.5000 V

1.425 V

微芯片技术

1.575 V

178

Tray

M1A3P400

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-2FGG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

ProASIC3

90

有

SMD/SMT

-40 to 85 °C

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

STD

9216

400000

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

24

ProASIC3

1.5000 V

1.425 V

微芯片技术

1.575 V

151

Tray

M1A3P400

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

0 to 85 °C

Tray

M1A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

STD

9216

400000

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE3000-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

Lead, Silver, Tin

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

90

Fusion

0.014110 oz

Tray

AFS600

活跃

1.575 V

8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS600-FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.73

N

119 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

1098.9 MHz

有

-40°C ~ 100°C (TJ)

Tray

AFS600

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

1.0989 GHz

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

-40°C ~ 85°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

STD

1.2 mm

17 mm

17 mm