N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

N

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

Tray

M1A3PE3000

活跃

1.575 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE3000-1FG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

24

ProASIC3

Tray

A3P600

Obsolete

1.575 V

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

A3P600

85 °C

-40 °C

1.425V ~ 1.575V

231 MHz

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

231 MHz

13824

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0 C

+ 70 C

SMD/SMT

250 MHz

有

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

有

A54SX72A-1FGG256

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

0°C ~ 70°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

- 40 C

+ 85 C

SMD/SMT

172 MHz

有

微芯片技术

24

Actel

0.196363 oz

5.5 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-PQG160I

94 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

1.52

Details

125 I/O

3 V

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

有

微芯片技术

40

Actel

5.5 V

Tray

A42MX36

Obsolete

ROHS COMPLIANT, PLASTIC, BGA-272

网格排列

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX36-2BGG272I

91 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

202 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

164 MHz

-40°C ~ 85°C (TA)

Tray

A42MX36

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B272

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

164 MHz

1184

2

1822

2.1 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

180 MHz

有

微芯片技术

40

Actel

5.5 V

Tray

A42MX36

Obsolete

PLASTIC, BGA-272

网格排列

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

85 °C

无

A42MX36-3BG272I

100 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

BGA

N

202 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

A42MX36

e0

锡铅银

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

BOTTOM

BALL

225

1.27 mm

compliant

272

S-PBGA-B272

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

180 MHz

1184

3

1822

1.9 ns

2438

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

+ 70 C

SMD/SMT

175 MHz

有

微芯片技术

27

Actel

0.084185 oz

5.25 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-2PLG44

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

3 V

34 I/O

Details

0 C

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE3000-2FG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

2

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M7A3P1000-2FG256I

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

M7A3P1000

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.7 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1000000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

活跃

1 MM PITCH, GREEN, FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-55 °C

1.5 V

30

1.425 V

100 °C

有

M1AFS600-1FGG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

Tray

M1AFS600

-55°C ~ 100°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

不合格

OTHER

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

600000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

20

70 °C

无

M1AGLE3000V2-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

0 C

0 to 70 °C

Tray

M1AGLE3000V2

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.2 V to 1.5 V

COMMERCIAL

1.575 V

1.14 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

892.86 MHz

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

248 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

763 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

-40°C ~ 85°C (TA)

Tray

AX250

1.425V ~ 1.575V

1.5 V

55296

250000

4224

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

60

Actel

0.014110 oz

Tray

AX500

活跃

1.575 V

0°C ~ 70°C (TA)

Tray

AX500

1.425V ~ 1.575V

1.5 V

73728

500000

8064

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

+ 85 C

SMD/SMT

微芯片技术

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

BGA

AFS600-2FGG484I

有

85 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

网格排列

BGA,

This product may require additional documentation to export from the United States.

Details

7000 LE

172 I/O

1.425 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

600000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

870 MHz

微芯片技术

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

AX1000-2FGG484

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1282.05 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

119 I/O

N

1.575 V

Tray

M7AFS600

活跃

0.014110 oz

Fusion

90

有

0°C ~ 70°C (TA)

Tray

M7AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

7000 LE

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

-40°C ~ 100°C (TJ)

Tray

AFS600

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.47059 GHz

2

13824

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

Tray

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0.014110 oz

ProASIC3

90

有

310 MHz

1.5000 V

1.425 V

1.575 V

1.575 V

0 to 70 °C

Tray

M7A3P1000

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

310 MHz

2

24576

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 85 C

SMD/SMT

1470.59 MHz

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

LBGA

M7AFS600-2FGG256I

有

85 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

LBGA,

Details

119 I/O

1.425 V

- 40 C

-40°C ~ 85°C (TA)

Tray

M7AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

2

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGLE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

70 °C

有

AGLE3000V2-FGG484

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

AGLE3000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.2 V to 1.5 V

1.2/1.5 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

M7A3P1000-1FGG256

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

177 I/O

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

272 MHz

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1000000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

活跃

M7A3P1000

Tray

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M7A3P1000-2FG484I

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

-40 to 85 °C

Tray

M7A3P1000

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

1098.9 MHz

有

微芯片技术

60

Fusion

0.014110 oz

Tray

M7AFS600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M7AFS600-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

172 I/O

1.425 V

- 40 C

-40°C ~ 85°C (TA)

Tray

M7AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

600000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

Tray

M1AFS1500

活跃

1.575 V

N

119 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1AFS1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.47059 GHz

2

38400

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

248 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

870 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

-40°C ~ 85°C (TA)

Tray

AX250

1.425V ~ 1.575V

1.5 V

55296

250000

4224

1.73 mm

23 mm

23 mm