N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

649 MHz

微芯片技术

有

60

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

AX1000-FGG484

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

3000 LE

151 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

微芯片技术

有

24

36864 bit

ProASIC3

0.198628 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P250-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

0.76

0 to 70 °C

Tray

A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

3 mA

-

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

STD

-

6144

250000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

1.575 V

Details

96 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.425 V

1.575 V

Tray

A3P060

活跃

0°C ~ 85°C (TJ)

Tray

A3P060

1.425V ~ 1.575V

1.5 V

18432

60000

1

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

有

60

Fusion

0.014110 oz

Tray

AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS1500-2FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

-40°C ~ 100°C (TJ)

Tray

AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

SMD/SMT

320 MHz

有

微芯片技术

27

Actel

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

40

70 °C

有

A54SX32-2BGG329

320 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

+ 125 C

SMD/SMT

240 MHz

微芯片技术

有

24

Actel

3.6 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

3.3 V

40

125 °C

有

A54SX32-PQG208M

240 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

174 I/O

3 V

- 55 C

-55°C ~ 125°C (TC)

Tray

A54SX32

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

240 MHz

S-PQFP-G208

174

不合格

3.3 V, 5 V

3.3,5 V

MILITARY

5.5 V

4.5 V

900 ps

900 ps

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

0.9 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

LGA-624

YES

624

624-CLGA (32.5x32.5)

624

微芯片技术

1

Actel

Tray

APA1000

活跃

BGA,

网格排列

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

未说明

2.3 V

125 °C

无

APA1000-LG624M

BGA

SQUARE

活跃

MICROSEMI CORP

2.7 V

5.26

Military grade

This product may require additional documentation to export from the United States.

N

440 I/O

- 55 C

+ 125 C

SMD/SMT

150 MHz

有

-55°C ~ 125°C (TC)

APA1000

3A001.A.2.C

125 °C

-55 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

未说明

compliant

S-CBGA-B624

不合格

2.5 V

MILITARY

5 mA

24.8 kB

1000000 GATES

现场可编程门阵列

202752

1000000

150 MHz

MIL-STD-883 Class B

56320

1000000

无

N/A

-

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

Details

344 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

微芯片技术

有

24

Actel

2.7 V

2.3 V

2.5000 V

2.7 V

Tray

APA450

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

2.5 V

40

70 °C

有

APA450-BGG456

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

APA450

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

245

1.27 mm

compliant

456

S-PBGA-B456

344

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

344

450000 GATES

2.54 mm

现场可编程门阵列

110592

450000

STD

12288

450000

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

Details

356 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

APA600

85 °C

-40 °C

2.3V ~ 2.7V

456

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

SMD/SMT

280 MHz

有

微芯片技术

27

Actel

3.6 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

40

70 °C

有

A54SX32-1BGG329

280 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

微芯片技术

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS600-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

7000 LE

172 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

AFS600

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.28205 GHz

1

13824

13824

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

SMD/SMT

313 MHz

有

微芯片技术

27

Actel

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

2.5 V

40

70 °C

有

A54SX32A-2BGG329

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Details

249 I/O

2.25 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

+ 85 C

SMD/SMT

313 MHz

有

微芯片技术

27

Actel

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

2.5 V

40

85 °C

有

A54SX32A-2BGG329I

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Details

249 I/O

2.25 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

SMD/SMT

247 MHz

有

微芯片技术

24

Actel

0.196363 oz

5.25 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-1PQG160

135 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

101 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.1 ns

684

14000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

+ 70 C

SMD/SMT

278 MHz

有

微芯片技术

90

Actel

0.023175 oz

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

有

A54SX32A-1TQG100

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

81 I/O

2.25 V

0 C

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

TQFP-64

YES

64-TQFP (10x10)

64

Details

128 LE

41 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

微芯片技术

有

160

Actel

0.012720 oz

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

EX64

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

40

85 °C

有

EX64-TQG64I

250 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.58

-40 to 85 °C

Tray

EX64

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

2.5 V

INDUSTRIAL

-

3000 GATES

1.6 mm

现场可编程门阵列

128

3000

STD

-

1 ns

3000

1.4 mm

10 mm

10 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

SMD/SMT

217 MHz

有

24

Actel

2.75 V

Tray

A54SX72

活跃

Details

171 I/O

2.25 V

- 40 C

+ 125 C

-40°C ~ 125°C (TA)

Tray

A54SX72A

125 °C

-40 °C

2.25V ~ 5.25V

2.5 V

2.75 V

2.25 V

1.5 ns

108000

217 MHz

6036

6036

4024

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

0 C

+ 70 C

SMD/SMT

180 MHz

微芯片技术

有

24

Actel

2.7 V

Tray

APA300

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

2.5 V

40

70 °C

有

APA300-BGG456

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

290 I/O

2.3 V

0°C ~ 70°C (TA)

Tray

APA300

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

245

1.27 mm

compliant

S-PBGA-B456

290

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

290

300000 GATES

2.54 mm

现场可编程门阵列

73728

300000

STD

8192

300000

1.73 mm

35 mm

35 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

174 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

有

微芯片技术

24

Actel

2.5000 V

2.25 V

2.75 V

2.75 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

40

85 °C

有

A54SX32A-1PQG208I

278 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.34

Details

-40 to 85 °C

Tray

A54SX32A

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

1

1.1 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

Tray

M7A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M7A3P1000-FGG256I

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.7 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

SMD/SMT

294 MHz

有

微芯片技术

24

Actel

2.75 V

Tray

A54SX16

活跃

FQFP, QFP208,1.2SQ

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ

2.5 V

40

70 °C

有

A54SX16A-2PQG208

294 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

175 I/O

2.25 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

175

1452 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

+ 85 C

SMD/SMT

320 MHz

有

微芯片技术

27

Actel

Tray

A54SX32

活跃

3.6 V

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

3.3 V

40

85 °C

有

A54SX32-2BGG329I

320 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

INDUSTRIAL

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

SMD/SMT

280 MHz

有

微芯片技术

40

Actel

3.6 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

5.25

MICROSEMI CORP

活跃

SQUARE

LFQFP

280 MHz

A54SX16P-1TQG176

有

70 °C

40

3.3 V

QFP176,1.0SQ,20

PLASTIC/EPOXY

3

Details

147 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3 V, 5 V

3.3,3.3/5 V

COMMERCIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.8 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

+ 85 C

SMD/SMT

247 MHz

有

微芯片技术

24

Actel

0.196363 oz

5.5 V

Tray

A42MX09

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-1PQG160I

135 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

101 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

INDUSTRIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.1 ns

684

14000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

表面贴装

BGA-329

YES

329

329-PBGA (31x31)

329

有

微芯片技术

27

Actel

Tray

A54SX32

活跃

3.6 V

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

3.3 V

40

70 °C

有

A54SX32-BGG329

240 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

0°C ~ 70°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

240 MHz

S-PBGA-B329

249

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

5.25 V

4.75 V

900 ps

900 ps

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

0.9 ns

2880

2880

32000

1.8 mm

31 mm

31 mm

无