N/A

-

表面贴装

YES

144

微芯片技术

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL010S-1TQ144

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.57

84

Tray

Obsolete

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

12084

933888

20 mm

20 mm

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

158

Tray

APA300

Obsolete

-40°C ~ 125°C (TJ)

ProASICPLUS

2.375V ~ 2.625V

73728

300000

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

3

PLASTIC/EPOXY

1.2 V

40

1.14 V

85 °C

有

AGL125V2-FGG144

108 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

97

Tray

AGL125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

0°C ~ 70°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

13 mm

13 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

QFP-208

FLATPACK, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

1.5 V

30

1.425 V

125 °C

无

A3P1000-PQ208M

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.24

154

Tray

A3P1000

Obsolete

-55°C ~ 125°C (TJ)

ProASIC3

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5,1.5/3.3 V

MILITARY

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P250-2PQ208I

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

151

Tray

M1A3P250

Obsolete

FQFP,

FLATPACK, FINE PITCH

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

6144

250000

28 mm

28 mm

N/A

-

表面贴装

748-FBGA

748-FBGA (23x23)

微芯片技术

Tray

活跃

56500 LE

+ 85 C

0 C

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 1.26V

56520

1869824

N/A

-

YES

484

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P1000L-1FGG484I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

INDUSTRIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

YES

100

40

3 V

85 °C

有

A54SX16-2VQG100I

320 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.26

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

e3

哑光锡

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

0.7 ns

1452

16000

14 mm

14 mm

N/A

-

YES

144

-40 °C

2.5 V

30

2.25 V

85 °C

无

A54SX16A-1FG144I

263 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.32

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

e0

Tin/Lead/Silver (Sn/Pb/Ag)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

INDUSTRIAL

111

1452 CLBS, 24000 GATES

1.55 mm

现场可编程门阵列

1.2 ns

1452

1452

24000

13 mm

13 mm

N/A

-

表面贴装

144-LBGA

144-FPBGA (13x13)

微芯片技术

96

Tray

A3P060

活跃

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

1.425V ~ 1.575V

18432

60000

N/A

-

N/A

-

YES

208

3 V

70 °C

无

A54SX16-1PQ208

280 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

0.8 ns

1452

16000

28 mm

28 mm

N/A

-

YES

144

40

Obsolete

MICROSEMI CORP

2.75 V

5.32

Microsemi Corporation

SQUARE

LBGA

313 MHz

A54SX08A-2FGG144

有

70 °C

2.25 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

e1

锡银铜

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

COMMERCIAL

111

768 CLBS, 12000 GATES

1.55 mm

现场可编程门阵列

0.9 ns

768

768

12000

13 mm

13 mm

N/A

-

表面贴装

784-BBGA, FCBGA

784-FCBGA (29x29)

微芯片技术

388

Tray

活跃

-55°C ~ 125°C (TJ)

PolarFire™

0.97V ~ 1.08V

300000

21600666

N/A

-

N/A

-

N/A

-

YES

1152

MICROSEMI CORP

5.82

BGA, BGA1152,34X34,40

网格排列

PLASTIC

BGA1152,34X34,40

1.2 V

有

M2GL100T-1FCG1152I

BGA

SQUARE

Microsemi Corporation

Obsolete

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

YES

1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

无

M2GL100S-1FC1152I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.88

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

YES

1152

MICROSEMI CORP

5.82

BGA, BGA1152,34X34,40

网格排列

PLASTIC

BGA1152,34X34,40

1.2 V

有

M2GL100T-1FCG1152

BGA

SQUARE

Microsemi Corporation

Obsolete

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

3

有

M2S025S-1VFG400I

Microsemi Corporation

活跃

MICROSEMI CORP

5.78

,

compliant

现场可编程门阵列

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

A3P125

133

Tray

Obsolete

-40°C ~ 100°C (TJ)

ProASIC3

1.425V ~ 1.575V

36864

125000

N/A

-

N/A

-

表面贴装

208-BFCQFP with Tie Bar

YES

208-CQFP (75x75)

208

GQFF, TPAK208,2.9SQ,20

FLATPACK, GUARD RING

微芯片技术

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55 °C

1.5 V

20

1.425 V

125 °C

无

AX250-CQ208M

649 MHz

GQFF

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.29

Military grade

115

Tray

AX250

活跃

-55°C ~ 125°C (TA)

Axcelerator

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

248

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

248

2816 CLBS, 250000 GATES

3.3 mm

现场可编程门阵列

55296

250000

4224

MIL-STD-883 Class B

0.99 ns

2816

4224

250000

29.21 mm

29.21 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

微芯片技术

3

PLASTIC/EPOXY

-40 °C

5 V

30

4.75 V

125 °C

无

A42MX16-PQ100A

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.53

83

Tray

A42MX16

Obsolete

QFP,

FLATPACK

-40°C ~ 125°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

AUTOMOTIVE

24000 GATES

3.4 mm

现场可编程门阵列

24000

2.4 ns

24000

20 mm

14 mm