N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

有

24

IGLOO2

574

Tray

微芯片技术

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

85 °C

无

M2GL150-FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

146124

35 mm

35 mm

N/A

-

表面贴装

484-BFBGA

484-BGA

微芯片技术

有

84

IGLOO2

248

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-BGA

484

IGLOO2

248

Tray

微芯片技术

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

1.14 V

85 °C

有

M2GL150TS-FCVG484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

0°C ~ 85°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

有

90

IGLOO2

293

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

有

60

IGLOO2

267

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

M2GL050T

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

IGLOO2

248

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

有

84

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

有

N

This product may require additional documentation to export from the United States.

207

Tray

M2GL050

活跃

IGLOO2

90

0°C ~ 85°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

484-BFBGA

YES

484-BGA

484

84

IGLOO2

248

Tray

微芯片技术

M2GL150

活跃

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

1.14 V

85 °C

有

M2GL150T-FCVG484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

IGLOO2

248

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

有

84

0°C ~ 85°C (TJ)

Tray

M2GL150TS

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

176

IGLOO2

200

Tray

微芯片技术

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

有

M2GL050T-1FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

有

60

IGLOO2

267

Tray

微芯片技术

M2GL050

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

1.14 V

85 °C

无

M2GL050-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

表面贴装

484-BFBGA

484-BGA

微芯片技术

有

84

IGLOO2

248

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

YES

108

85 °C

1.425 V

未说明

1.5 V

LGA108,17X17,20

UNSPECIFIED

3

CHIP CARRIER, VERY THIN PROFILE

VBCC, LGA108,17X17,20

5.31

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

VBCC

350 MHz

AFS090-2QNG108

有

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B108

37

不合格

1.5,3.3 V

OTHER

37

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

8 mm

8 mm

N/A

-

YES

180

1.5 V

30

1.425 V

85 °C

有

AFS090-QNG180

350 MHz

VBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.32

VBCC, LGA180,20X20,20

CHIP CARRIER, VERY THIN PROFILE

3

UNSPECIFIED

LGA180,20X20,20

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

260

0.5 mm

compliant

S-XBCC-B180

60

不合格

1.5,3.3 V

OTHER

60

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

10 mm

10 mm

N/A

-

YES

108

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.31

1.425 V

未说明

1.5 V

LGA108,17X17,20

UNSPECIFIED

3

CHIP CARRIER, VERY THIN PROFILE

VBCC, LGA108,17X17,20

85 °C

有

AFS090-QNG108

350 MHz

VBCC

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B108

37

不合格

1.5,3.3 V

OTHER

37

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

8 mm

8 mm

N/A

-

YES

132

LGA132(UNSPEC)

-40 °C

1.2 V

未说明

1.14 V

85 °C

有

AGL060V2-QNG132I

108 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.6

HVBCC, LGA132(UNSPEC)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B132

80

不合格

1.2/1.5 V

INDUSTRIAL

80

1536 CLBS, 60000 GATES

0.8 mm

现场可编程门阵列

1536

1536

60000

8 mm

8 mm

N/A

-

YES

132

1.5 V

未说明

1.425 V

70 °C

有

AGL125V5-QNG132

108 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

8.31

HVBCC, LGA132(UNSPEC)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LGA132(UNSPEC)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B132

84

不合格

1.5 V

COMMERCIAL

84

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

3072

3072

125000

8 mm

8 mm

N/A

-

YES

132

1.2 V

未说明

1.14 V

70 °C

有

AGL125V2-QNG132

108 MHz

HVBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

HVBCC, LGA132(UNSPEC)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

LGA132(UNSPEC)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

未说明

0.5 mm

compliant

S-XBCC-B132

84

不合格

1.2/1.5 V

COMMERCIAL

84

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

3072

3072

125000

8 mm

8 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

M2GL150

活跃

Non-Compliant

293

Tray

-40°C ~ 100°C (TJ)

IGLOO2

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

-40 °C

85 °C

无

A54SX16P-PQ208I

230 MHz

QFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.77

Cables

175

Tray

A54SX16

Obsolete

FLATPACK

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40°C ~ 85°C (TA)

SX

Tinel锁适配器

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G208

175

不合格

3.3,3.3/5 V

INDUSTRIAL

175

现场可编程门阵列

24000

1452

1452

N/A

-

表面贴装

64-LQFP

YES

64-TQFP (10x10)

64

TQFP-64

FLATPACK, LOW PROFILE, FINE PITCH

3

微芯片技术

PLASTIC/EPOXY

-40 °C

2.5 V

30

2.3 V

85 °C

无

EX128-TQ64I

250 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

5.32

46

Tray

EX128

Obsolete

-40°C ~ 85°C (TA)

EX

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G64

INDUSTRIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

1 ns

6000

10 mm

10 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

Obsolete

158

Tray

APA300

-55°C ~ 125°C (TC)

ProASICPLUS

2.3V ~ 2.7V

73728

300000

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

Obsolete

158

Tray

APA450

0°C ~ 70°C (TA)

ProASICPLUS

2.3V ~ 2.7V

110592

450000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

624-BCLGA

624

624-CLGA (32.5x32.5)

微芯片技术

Tray

AX1000

活跃

418

Non-Compliant

-55°C ~ 125°C (TA)

Axcelerator

125 °C

-55 °C

1.425V ~ 1.575V

20.3 kB

12096

165888

1e+06

350 MHz

18144

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Obsolete

PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

微芯片技术

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

30

2.25 V

85 °C

无

A54SX72A-2PQ208I

294 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.27

171

Tray

A54SX72A

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

171

不合格

2.5,3.3/5 V

INDUSTRIAL

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

108000

6036

1.1 ns

6036

6036

108000

28 mm

28 mm