N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

This product may require additional documentation to export from the United States.

Details

72 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

247 MHz

微芯片技术

有

16

Actel

0.239083 oz

Tray

A42MX09

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-1PLG84M

135 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

-55°C ~ 125°C (TC)

Tube

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

MILITARY

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

2.1 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

0 C

+ 70 C

SMD/SMT

250 MHz

有

微芯片技术

24

Actel

0.196363 oz

3.3, 5 V

3 V

5.25 V

5.25 V

Tray

A42MX24

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-PQG160

84 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

1.58

Details

125 I/O

3 V

0 to 70 °C

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

STD

1410

2.5 ns

1890

36000

3.4 mm

28 mm

28 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

Copper, Silver, Tin

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.425 V

1.575 V

Tray

A3PE3000

活跃

1.575 V

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

40

70 °C

有

A3PE3000-FGG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

620 I/O

0°C ~ 85°C (TJ)

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

N

3000 LE

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

892.86 MHz

有

90

IGLOOe

1.575 V

Tray

AGL250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AGL250V5-VQ100

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0°C ~ 70°C (TA)

Tray

AGL250V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.5 V

OTHER

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

N

1500 LE

71 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3

0.017813 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

100 °C

无

A3P125-VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.5

-40 to 85 °C

Tray

A3P125

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

-

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

STD

-

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1.575 V

1.575 V

Tray

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

231 MHz

STD

24576

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

3 V

- 40 C

+ 85 C

SMD/SMT

139 MHz

有

微芯片技术

90

Actel

Tray

A40MX02

活跃

5.5 V

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX02-VQG80I

80 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

57 I/O

-40°C ~ 85°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

INDUSTRIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

STD

2.7 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

3 V

0 C

+ 70 C

SMD/SMT

237 MHz

有

微芯片技术

16

Actel

0.239083 oz

5.25 V

Tray

A42MX16

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-3PLG84

129 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

0°C ~ 70°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

1.9 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-100

YES

100

100-PQFP (20x14)

1.758804 g

100

SMD/SMT

237 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.5 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

未说明

85 °C

有

A42MX16-3PQG100I

129 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

未说明

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

24000

2.7 mm

20 mm

14 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

4.75 V

- 40 C

+ 125 C

SMD/SMT

120 MHz

有

微芯片技术

90

Actel

Tray

A40MX04

活跃

5.25 V

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A40MX04-VQG80A

116 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

69 I/O

-40°C ~ 125°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

5 V

AUTOMOTIVE

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

STD

2.2 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

174 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

有

24

Actel

Tray

A54SX32

活跃

2.75 V

-55°C ~ 125°C (TC)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

34 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

188 MHz

有

微芯片技术

27

Actel

0.084185 oz

Tray

A40MX04

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-3PLG44I

109 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

3

1.7 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

CQFP-256

256-CQFP (75x75)

微芯片技术

N

213 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

217 MHz

有

1

Actel

2.75 V

Tray

A54SX72

活跃

0°C ~ 70°C (TA)

A54SX72A

2.25V ~ 5.25V

2.5 V

108000

6036

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

77 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P030-2VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

0°C ~ 85°C (TJ)

Tray

A3P030

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

2

768

30000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

微芯片技术

16

Actel

0.239083 oz

Tray

A42MX24

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-1PLG84I

105.57 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

-40°C ~ 85°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

36000

2.1 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

This product may require additional documentation to export from the United States.

Details

57 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

160 MHz

微芯片技术

有

19

Actel

0.171777 oz

Tray

A40MX02

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX02-1PLG68M

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

-55°C ~ 125°C (TC)

Tube

A40MX02

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

MILITARY

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

101 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

269 MHz

有

微芯片技术

24

Actel

0.196363 oz

5.5 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-2PQG160I

146 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

INDUSTRIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

1.8 ns

684

14000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

N

1500 LE

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

90

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

AGL125V5-VQ100I

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

AGL125V5

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

Details

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

5.24

MICROSEMI CORP

活跃

SQUARE

TFQFP

350 MHz

A3P125-2VQG100I

有

100 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK, THIN PROFILE, FINE PITCH

TFQFP,

-40 to 85 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

2

3072

125000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3PE600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE600-1FGG256I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

165 I/O

1.425 V

-40 to 85 °C

Tray

A3PE600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

N

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P060

活跃

1.575 V

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P060-2VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.53

-40 to 85 °C

Tray

A3P060

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

1.575 V

Tray

M7A3P1000

活跃

1.575 V

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

0 to 70 °C

Tray

M7A3P1000

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

272 MHz

1

24576

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE3000-1FG896I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

A3PE3000

e0

锡铅

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

154 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

微芯片技术

24

ProASIC3

0.225753 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P1000-PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

M1A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

28 mm

28 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

Details

186 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.625 V

Tray

APA450

活跃

-40°C ~ 125°C (TJ)

Tray

APA450

125 °C

-40 °C

2.375V ~ 2.625V

2.5 V

2.625 V

2.375 V

13.5 kB

110592

450000

180 MHz

STD

12288

1.2 mm

17 mm

17 mm

无