N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

0 C

+ 85 C

SMD/SMT

微芯片技术

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060T-FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B676

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

0 C

+ 85 C

SMD/SMT

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

无

M2GL010-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

85 °C

20

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA484,22X22,40

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

12084

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

SMD/SMT

微芯片技术

有

119

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL010T-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL010T

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

12084

933888

STD

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VFPBGA-400

400

400-VFBGA (17x17)

微芯片技术

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

This product may require additional documentation to export from the United States.

Details

27696 LE

0°C ~ 85°C (TJ)

Tray

M2GL025T

85 °C

0 °C

1.2 V

138 kB

27696

1130496

1

4 Transceiver

N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

425 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

40

IGLOO2

1.2000 V

1.14 V

1.26 V

1.2 V

活跃

M2GL090

Tray

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

有

M2GL090-FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

86184 LE

-40 to 100 °C

Tray

M2GL090

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

425

不合格

1.2 V

425

2.44 mm

现场可编程门阵列

86184

2648064

STD

86316

27 mm

27 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

0 C

+ 85 C

SMD/SMT

微芯片技术

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060TS-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

0 C

+ 85 C

SMD/SMT

微芯片技术

有

60

IGLOO2

Tray

M2GL060

活跃

1.2 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL060

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

STD

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060

1.2 V

56520

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

微芯片技术

有

40

IGLOO2

1.2000 V

1.14 V

1.26 V

1.2 V

Tray

M2GL090

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

85 °C

有

M2GL090T-FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

0 to 85 °C

Tray

M2GL090T

85 °C

0 °C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

STD

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

0°C ~ 85°C (TJ)

Tray

M2GL060TS

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

0 C

+ 85 C

SMD/SMT

微芯片技术

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

85 °C

无

M2GL025T-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

STD

2 Transceiver

27696

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

PLASTIC/EPOXY

1.2 V

1.14 V

有

M2GL150TS-1FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

625 kB

3.15 mm

现场可编程门阵列

146124

5120000

240

100 °C

3.45 V

1.14 V

3.15 mm

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

+ 85 C

SMD/SMT

微芯片技术

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

活跃

MICROSEMI CORP

5.27

BGA

SQUARE

LFBGA

M2GL025-VF400

无

85 °C

未说明

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

GRID ARRAY, LOW PROFILE, FINE PITCH

LFBGA, BGA400,20X20,32

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL025

无

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

STD

27696

1.26 V

1.14 V

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

无

M2GL025TS-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

100 °C

-40 °C

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

SMD/SMT

微芯片技术

有

90

IGLOO2

Tray

M2GL005

活跃

1.26 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL005-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

6060 LE

171 I/O

1.14 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

128 kB

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

400 MHz

11

STD

6060

17 mm

17 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152

1152-FCBGA (35x35)

1152

1.26 V

微芯片技术

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

1.14 V

85 °C

有

M2GL150-FCG1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

有

24

IGLOO2

1.2000 V

1.14 V

0 to 85 °C

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

146124

35 mm

35 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.2 V

0 C

+ 85 C

SMD/SMT

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL090TS-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

N

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

1.2 V

323.3 kB

86316

2648064

STD

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.2 V

0 C

+ 85 C

SMD/SMT

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL010TS-FG484

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060T

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

3000 LE

68 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

36 kbit

350 MHz

有

90

ProASIC3

1.575 V

Tray

A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

1.5 V

未说明

125 °C

无

A3P250-VQ100M

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.16

This product may require additional documentation to export from the United States.

N

-55°C ~ 125°C (TJ)

Tray

A3P250

e0

Tin/Lead (Sn85Pb15)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

MILITARY

3 mA

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

-

6144

250000

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

1.2 V

0 C

+ 85 C

SMD/SMT

微芯片技术

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

5.27

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL025TS-VFG400

有

85 °C

30

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

3

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

207

1.51 mm

现场可编程门阵列

27696

1130496

STD

4 Transceiver

27696

17 mm

17 mm