N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

77

Tray

A3PN030

Obsolete

-40°C ~ 100°C (TJ)

ProASIC3 nano

1.425V ~ 1.575V

30000

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

Non-Compliant

N/A

-

YES

208

1.575 V

5.27

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P1000L-PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

24576

24576

1000000

28 mm

28 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

208

208-PQFP (28x28)

微芯片技术

Obsolete

Compliant

A42MX36

176

Tray

-40°C ~ 85°C (TA)

MX

85 °C

-40 °C

3V ~ 3.6V, 4.5V ~ 5.5V

5 V

5.5 V

3 V

320 B

1184

2560

54000

180 MHz

1184

3

1822

3.4 mm

28 mm

28 mm

无

N/A

-

YES

84

PLASTIC/EPOXY

LDCC84,1.2SQ

-40 °C

85 °C

无

A54SX08-PL84I

230 MHz

QCCJ

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.84

QCCJ, LDCC84,1.2SQ

CHIP CARRIER

现场可编程门阵列

CMOS

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J84

69

不合格

3.3,5 V

INDUSTRIAL

69

现场可编程门阵列

768

510 In Stock

-

YES

44

PLASTIC, MS-007-AB, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

5 V

40

4.75 V

70 °C

有

A1010B-PLG44C

45 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.8

e3

Matte Tin (Sn)

MAX 34 I/OS

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

295 CLBS, 1200 GATES

4.445 mm

现场可编程门阵列

4.5 ns

295

1200

16.51 mm

16.51 mm

N/A

-

YES

456

1.27 MM PITCH, PLASTIC, BGA-456

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

2.5 V

30

2.3 V

70 °C

无

APA150-BG456

180 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

5.86

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B456

242

不合格

2.5,2.5/3.3 V

COMMERCIAL

242

150000 GATES

2.54 mm

现场可编程门阵列

6144

150000

35 mm

35 mm

N/A

-

YES

121

PLASTIC/EPOXY

1.5 V

1.425 V

85 °C

无

A3P060-CS121

VFBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8542.39.00.01

CMOS

BOTTOM

BALL

0.5 mm

compliant

S-PBGA-B121

不合格

COMMERCIAL

1536 CLBS, 60000 GATES

0.99 mm

现场可编程门阵列

1536

60000

6 mm

6 mm

N/A

-

YES

208

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

AX250-2PQ208

870 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.88

e0

Tin/Lead (Sn/Pb)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

248

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

248

2816 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

0.74 ns

2816

4224

250000

28 mm

28 mm

N/A

-

NO

84

5.84

Military grade

CERAMIC, PGA-84

网格排列

CERAMIC, METAL-SEALED COFIRED

PGA84M,11X11

-55 °C

5 V

30

4.5 V

125 °C

无

A1010B-PG84B

37 MHz

PGA

SQUARE

Actel Corporation

Obsolete

ACTEL CORP

5.5 V

e0

Tin/Lead (Sn/Pb)

MAX 57 I/OS

现场可编程门阵列

CMOS

PERPENDICULAR

PIN/PEG

225

2.54 mm

compliant

S-CPGA-P84

57

不合格

5 V

MILITARY

57

295 CLBS, 1200 GATES

4.318 mm

现场可编程门阵列

MIL-STD-883 Class B

5.5 ns

295

295

1200

27.94 mm

27.94 mm

N/A

-

N/A

-

N/A

-

YES

68

MICROSEMI CORP

Microsemi Corporation

AGL015V2-QNG68I

3

100 °C

-40 °C

UNSPECIFIED

HVQCCN

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, QFN-68

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Obsolete

未说明

5.25

有

1.575 V

1.14 V

1.2 V

8542.39.00.01

CMOS

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

YES

176

3 V

3.3 V

146 MHz

MICROSEMI CORP

Microsemi Corporation

A42MX09-2TQ176

3

70 °C

PLASTIC/EPOXY

LFQFP

LFQFP, QFP176,1.0SQ,20

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

30

5.24

无

3.6 V

e0

锡铅

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

176

S-PQFP-G176

104

不合格

3.3,3.3/5,5 V

COMMERCIAL

104

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

1.8 ns

684

684

14000

24 mm

24 mm

2112 In Stock

• 1: ¥1,380.719359
• 10: ¥1,302.565433
• 100: ¥1,228.835314
• 500: ¥1,159.278600
查看所有的价格

-

784-FBGA

784-VFBGA (23x23)

微芯片技术

+ 100 C

- 40 C

SMD/SMT

56500 LE

Tray

活跃

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

39 In Stock

-

N/A

-

N/A

-

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.25

113

Tray

A54SX16A

Obsolete

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-55 °C

2.5 V

30

2.25 V

125 °C

无

A54SX16A-1TQ144M

263 MHz

LFQFP

-55°C ~ 125°C (TC)

SX-A

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

MILITARY

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

20 mm

20 mm

N/A

-

表面贴装

84-CQFP Exposed Pad and Tie Bar

YES

84-CQFP (42x42)

84

微芯片技术

活跃

MICROSEMI CORP

QFP

QFF,

5.29

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

RECTANGULAR

FLATPACK

5.5 V

5 V

69

Tray

5962-0151801

活跃

4.5 V

5962-0151801QZC

-55°C ~ 125°C (TJ)

SX-A

3A001.A.2.C

8542.39.00.01

2.25V ~ 5.25V

QUAD

FLAT

compliant

84

R-CQFP-F84

Qualified

MILITARY

32000 GATES

现场可编程门阵列

48000

2880

32000

N/A

-

YES

256

FLATPACK, GUARD RING

SQUARE

GQFF

CERAMIC, METAL-SEALED COFIRED

-55 °C

125 °C

5.26

GQFF,

MICROSEMI CORP

Obsolete

5962-9956904QXC

2.97 V

Military grade

3.3 V

3.63 V

e4

3A001.A.2.C

GOLD

ALSO REQUIRES 5V SUPPLY

8542.39.00.01

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F256

Qualified

MILITARY

1452 CLBS, 16000 GATES

3.81 mm

现场可编程门阵列

MIL-PRF-38535 Class Q

1452

16000

36 mm

36 mm

2658 In Stock

• 1: ¥817.215138
• 10: ¥770.957678
• 100: ¥727.318564
• 500: ¥686.149591
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

微芯片技术

FBGA

1.5000 V

1.425 V

600000

235

600000

1.575 V

表面贴装

1.575 V

Tray

A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Commercial grade

This product may require additional documentation to export from the United States.

N

0 to 70 °C

Tray

A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

484

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

Commercial

1

13824

13824

600000

1.73 mm

23 mm

23 mm