N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

1.5000 V

1.425 V

1.575 V

34

Tray

A3PN010

微芯片技术

活跃

HQCCN,

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

-20 °C

1.5 V

30

1.425 V

70 °C

有

A3PN010-1QNG48

HQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.44

-20 to 70 °C

ProASIC3 nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

OTHER

260 CLBS, 10000 GATES

现场可编程门阵列

10000

1

260

10000

6 mm

6 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

Tray

AX500

活跃

1.5000 V

1.425 V

1.575 V

115

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

2

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

111

Tray

A54SX08

微芯片技术

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

3.3 V

30

3 V

70 °C

无

A54SX08-FG144

240 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

0 to 70 °C

SX

e0

Tin/Lead/Silver (Sn/Pb/Ag)

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

3.3,5 V

COMMERCIAL

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

12000

768

STD

0.9 ns

768

768

8000

13 mm

13 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Obsolete

FQFP,

FLATPACK, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A54SX16P-1PQ208

280 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

175

Tray

A54SX16

0°C ~ 70°C (TA)

SX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.8 ns

1452

16000

28 mm

28 mm

N/A

-

N/A

-

N/A

-

表面贴装

100-BQFP

100-PQFP (20x14)

微芯片技术

Tray

A42MX09

Obsolete

83

-40°C ~ 85°C (TA)

MX

3V ~ 3.6V, 4.5V ~ 5.5V

14000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

M2GL050

活跃

31 X 31 MM, 1 MM PITCH, FBGA-896

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

85 °C

无

M2GL050-FG896

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

377

Non-Compliant

Tray

0°C ~ 85°C (TJ)

IGLOO2

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

Tray

AX500

活跃

115

-40°C ~ 85°C (TA)

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

1

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

Tray

A54SX32A

Obsolete

174

-40°C ~ 125°C (TA)

SX-A

2.25V ~ 5.25V

48000

2880

N/A

-

N/A

-

表面贴装

132

Turck

A0851

87

Compliant

125 °C

-40 °C

4.5 kB

250000

N/A

-

表面贴装

Axial

Axial

微芯片技术

Tray

M1A3P1000

Obsolete

154

-55°C ~ 175°C

Bulk

CMF

0.180 Dia x 0.562 L (4.57mm x 14.27mm)

±1%

活跃

2

±100ppm/°C

5.9 MOhms

Metal Film

1.5W

1.425V ~ 1.575V

--

147456

1000000

Flame Retardant Coating, Moisture Resistant, Safety

--

N/A

-

表面贴装

84-LCC (J-Lead)

84-PLCC (29.31x29.31)

微芯片技术

Tray

A42MX24

Obsolete

72

-55°C ~ 125°C (TC)

MX

3V ~ 3.6V, 4.5V ~ 5.5V

36000

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

3.3, 5 V

3 V

5.5 V

69

Tray

A40MX04

微芯片技术

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

3 V

85 °C

有

A40MX04-PQG100I

80 MHz

QFP

RECTANGULAR

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.28

-40 to 85 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

STD

2.7 ns

547

6000

20 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

1.14 V

85 °C

有

AGLN250V2-VQG100I

TFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.48

68

Tray

AGLN250

-40°C ~ 100°C (TJ)

IGLOO nano

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

14 mm

14 mm

N/A

-

表面贴装

329-BBGA

329-PBGA (31x31)

微芯片技术

Tray

A54SX32

活跃

2.5000 V

2.25 V

2.75 V

249

0 to 70 °C

SX-A

2.25V ~ 5.25V

48000

2880

STD

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

活跃

BGA, BGA896,30X30,40

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

有

M2GL050TS-1FGG896I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

377

Compliant

Tray

M2GL050

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

Tray

AGLN125

活跃

71

-20°C ~ 85°C (TJ)

IGLOO nano

1.425V ~ 1.575V

3072

36864

125000

STD

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Tray

M1A3PE1500

Obsolete

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

30

1.425 V

85 °C

无

M1A3PE1500-1PQ208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.6

147

-40°C ~ 100°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

38400

38400

1500000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Obsolete

FQFP,

FLATPACK, FINE PITCH

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P600-2PQ208I

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

154

Tray

M1A3P600

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

13824

600000

28 mm

28 mm