N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-PLG44I

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

Details

547 LE

34 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

139 MHz

有

-

27

Actel

0.084185 oz

3.3, 5 V

3 V

5.5 V

Tray

A40MX04

-40 to 85 °C

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

STD

2.7 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-256

YES

256

256-CQFP (75x75)

256

微芯片技术

202 I/O

3.3 V

0 C

+ 70 C

SMD/SMT

有

1

Actel

Tray

A42MX36

活跃

3.3 V

CERAMIC, QFP-256

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

3.3 V

70 °C

无

A42MX36-1CQ256

83 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

N

0°C ~ 70°C (TA)

A42MX36

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

FLAT

0.5 mm

compliant

256

S-CQFP-F256

不合格

3.3 V

COMMERCIAL

5.25 V

3 V

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1

1822

2.3 ns

2438

54000

36 mm

36 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

A3PE3000-2FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

27

ProASIC3

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

0°C ~ 85°C (TJ)

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

40

100 °C

有

AGL600V2-FGG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.42

This product may require additional documentation to export from the United States.

Details

7000 LE

177 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

90

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

-40 to 85 °C

Tray

AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

INDUSTRIAL

-

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

-

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

有

M1A3P1000-FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

0°C ~ 85°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P250-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

157 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

-40 to 85 °C

Tray

A3P250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

-40 to 85 °C

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FPBGA-256

256-FPBGA (17x17)

微芯片技术

600000

130NM

1.575(V)

1.5(V)

无

1.425(V)

-40C

有

13824

表面贴装

1.575 V

Tray

AFS600

活跃

Details

7000 LE

119 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

FUSION®

85C

INDUSTRIALC

FBGA

600000

-40C to 85C

119

-40°C ~ 100°C (TJ)

Tray

AFS600

1.425V ~ 1.575V

1098.9(MHz)

256

1.5 V

-

110592

600000

STD

-

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

有

A42MX16-PQG100M

94 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

Details

83 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

172 MHz

有

66

Actel

0.062040 oz

Tray

A42MX16

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

-55°C ~ 125°C (TC)

Tray

A42MX16

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

MILITARY

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P600-2FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.22

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.425 V

1.575 V

Tray

A3P600

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

-40°C ~ 100°C (TJ)

Tray

A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

微芯片技术

1.5 V

30

100 °C

有

A3P030-2QNG68I

HVQCCN

SQUARE

活跃

MICROSEMI CORP

5.24

Details

49 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

260

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-40 °C

-40 to 85 °C

Tray

A3P030

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

1.5 V

INDUSTRIAL

2 mA

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

2

768

30000

0.88 mm

8 mm

8 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

Tray

M1A3PE1500

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40°C ~ 100°C (TJ)

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 1 month ago)

Lead, Silver, Tin

表面贴装

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

微芯片技术

2.5 V

30

70 °C

无

APA600-BG456

180 MHz

BGA

SQUARE

活跃

IC FPGA 356 I/O 456BGA

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA600

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

0 to 70 °C

Tray

APA600

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

225

1.27 mm

unknown

456

S-PBGA-B456

356

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

15.8 kB

356

600000 GATES

2.54 mm

现场可编程门阵列

129024

600000

180 MHz

STD

21504

21504

600000

1.73 mm

35 mm

35 mm

无

含铅

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

40

85 °C

有

A54SX08A-2TQG100I

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

81 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

313 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX08

活跃

LFQFP, TQFP100,.63SQ

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

-40 °C

2.5 V

-40°C ~ 85°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

130

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

130

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

0.9 ns

768

768

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

未说明

70 °C

有

A42MX16-VQG100

94 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.57

Details

83 I/O

3 V

0 C

+ 70 C

SMD/SMT

172 MHz

有

90

Actel

3.3, 5 V

3 V

5.25 V

5.25 V

Tray

A42MX16

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

0 to 70 °C

Tray

A42MX16

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

1232

24000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CQFP-84

YES

84-CQFP (42x42)

84

微芯片技术

A54SX32A-CQ84B

217 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.23

Military grade

This product may require additional documentation to export from the United States.

N

62 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

有

1

Actel

Tray

A54SX32

活跃

2.75 V

QFF,

FLATPACK

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

20

125 °C

无

-55°C ~ 125°C (TJ)

A54SX32A

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

IT CAN ALSO OPERATE WITH 3.3V AND 5V

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

225

0.635 mm

compliant

S-CQFP-F84

不合格

2.5 V

MILITARY

1800 CLBS, 48000 GATES

2.4 mm

现场可编程门阵列

48000

2880

MIL-STD-883 Class B

1.4 ns

1800

48000

16.51 mm

16.51 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

-40 °C

3.3 V

40

85 °C

有

A42MX24-PQG160I

91.8 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.28

Details

125 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

24

Actel

0.196363 oz

3.3, 5 V

3 V

5.5 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

5.5 V

Tray

A42MX24

活跃

ROHS COMPLIANT, PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

-40 to 85 °C

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

STD

1410

2.5 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

VQFP-84

YES

100-VQFP (14x14)

100

微芯片技术

A42MX09-VQG100

有

70 °C

40

3.3 V

TQFP100,.63SQ

PLASTIC/EPOXY

3

FLATPACK, THIN PROFILE, FINE PITCH

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

Details

336 LE

83 I/O

3 V

0 C

+ 70 C

SMD/SMT

215 MHz

有

-

90

Actel

Tray

A42MX09

活跃

5.25 V

1.55

MICROSEMI CORP

活跃

SQUARE

TFQFP

117 MHz

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

104

不合格

3.3 V, 5 V

3.3,3.3/5,5 V

COMMERCIAL

104

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

2.5 ns

684

684

14000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

310 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

A3P600

1.425V ~ 1.575V

1.5 V

110592

600000

2

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AGL400V5-FG256

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

178 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

90

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGL400

活跃

BGA,

网格排列

0 to 70 °C

Tray

AGL400V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

OTHER

27 uA

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

40

85 °C

有

M1A3P250-VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

M1A3P250

活跃

1.575 V

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

0 to 70 °C

Tray

M1A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

Tray

APA150

活跃

This product may require additional documentation to export from the United States.

Details

100 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

160

Actel

0.014110 oz

2.7 V

-40°C ~ 85°C (TA)

Tray

APA150

2.3V ~ 2.7V

2.5 V

36864

150000

STD

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

MICROSEMI CORP

活跃

SQUARE

LBGA

350 MHz

A3P250-1FGG144

有

85 °C

40

1.5 V

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

5.23

0 to 70 °C

Tray

A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.26

Details

49 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

有

260

ProASIC3 nano

Tray

A3PN020

活跃

1.575 V

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-40 °C

1.5 V

30

85 °C

有

A3PN020-2QNG68I

HVQCCN

-40°C ~ 100°C (TJ)

Tray

A3PN020

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

1.5 V

INDUSTRIAL

1 mA

520 CLBS, 20000 GATES

1 mm

现场可编程门阵列

20000

2

520

20000

0.88 mm

8 mm

8 mm

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

有

A3P250-2FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

157 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

Tray

A3P250

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

0°C ~ 85°C (TJ)

Tray

A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.2 mm

17 mm

17 mm