N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

526.32 MHz, 892.86 MHz

微芯片技术

有

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL600V2-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

AGL600V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

1.2 V to 1.5 V

OTHER

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

有

微芯片技术

16

Actel

0.239083 oz

5.25 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

5.25

MICROSEMI CORP

活跃

SQUARE

QCCJ

56 MHz

A42MX16-FPLG84

有

70 °C

40

3.3 V

LDCC84,1.2SQ

PLASTIC/EPOXY

3

Details

608 LE

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

140

不合格

3.3 V, 5 V

3.3,3.3/5,5 V

COMMERCIAL

5.25 V

3 V

-

140

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

608

24000

103 MHz

608

-

928

4 ns

1232

1232

24000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE1500-1FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1098.9 MHz

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7AFS600-FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

M7AFS600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

STD

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

3 V

- 55 C

+ 125 C

SMD/SMT

160 MHz

微芯片技术

有

27

Actel

0.084185 oz

5.5 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX04-1PLG44M

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

34 I/O

-55°C ~ 125°C (TC)

Tube

A40MX04

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

MILITARY

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

96 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P060

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P060-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

N

-40 to 85 °C

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

1

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

83 MHz

有

微芯片技术

90

Actel

5.25 V

Tray

A40MX04

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-FVQG80

48 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

69 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

3.7 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

5000 LE

178 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

310 MHz

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P400-2FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

A3P400

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

-

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

2

-

9216

400000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

3 V

0 C

+ 70 C

SMD/SMT

83 MHz

微芯片技术

有

-

19

Actel

0.171777 oz

5.25 V

Tube

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-FPLG68

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.24

Details

547 LE

57 I/O

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

3.7 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Tray

A42MX24

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-FPQG208

50.4 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

24

Actel

5.25 V

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1410

3.4 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P400-2FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

2

9216

400000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE1500

-40 to 85 °C

Tray

A3PE1500

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

310 MHz

2

38400

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

+ 85 C

SMD/SMT

188 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.5 V

Tray

A40MX02

活跃

85 °C

有

A40MX02-3PQG100I

109 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

40

3.3 V

-40 °C

PLASTIC/EPOXY

3

FLATPACK

ROHS COMPLIANT, PLASTIC, QFP-100

Details

57 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

1.7 ns

295

3000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

微芯片技术

90

Actel

0.642332 oz

3 V

5.5 V

5.5 V

Tray

A42MX09

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-VQG100I

117 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.51

Details

336 LE

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

-

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

STD

-

2.5 ns

684

14000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

IGLOOe

0.014110 oz

1.5000 V

Tray

AGL600

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

AGL600V5-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

AGL600V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

0.239083 oz

Tray

A42MX24

活跃

5.5 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-2PLG84I

114.75 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

16

Actel

-40°C ~ 85°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

310 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

310 MHz

2

24576

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

+ 125 C

SMD/SMT

120 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A40MX02

活跃

QFP-100

FLATPACK

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A40MX02-PQG100A

116 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.59

Details

57 I/O

4.75 V

- 40 C

-40°C ~ 125°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

5 V

AUTOMOTIVE

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

STD

2.2 ns

295

3000

2.7 mm

20 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

微芯片技术

Tray

A42MX24

活跃

5.25 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-2PLG84

105 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

16

Actel

0.239083 oz

0°C ~ 70°C (TA)

Tube

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P060-1VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

N

71 I/O

-40 to 85 °C

Tray

A3P060

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

1

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

BGA-329

329-PBGA (31x31)

微芯片技术

2.75 V

Details

249 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

有

27

Actel

2.5000 V

2.25 V

2.75 V

Tray

A54SX32

活跃

-40 to 85 °C

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

1

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

Details

11000 LE

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

310 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

有

A3P1000-2FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

BGA-329

329-PBGA (31x31)

微芯片技术

This product may require additional documentation to export from the United States.

Details

249 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

238 MHz

有

27

Actel

Tray

A54SX32

活跃

2.75 V

-55°C ~ 125°C (TC)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

- 40 C

+ 85 C

SMD/SMT

有

微芯片技术

90

Actel

1 oz

5.5 V

Tray

A42MX09

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-2VQG100I

146 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.58

Details

336 LE

83 I/O

3 V

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

INDUSTRIAL

-

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

2

-

1.8 ns

684

14000

1 mm

14 mm

14 mm