N/A

-

表面贴装

484-BGA

484-FPBGA (27X27)

Aluminum

微芯片技术

A54SX72

活跃

(2) Universal International Receptacles

P-Q7R62-M2RUV20

Grace Technologies

2.5000 V

2.25 V

2.75 V

360

Tray

0 to 70 °C

SX-A

2.25V ~ 5.25V

108000

6036

STD

IP65

N/A

-

表面贴装

64-LQFP

YES

64-TQFP (10x10)

64

微芯片技术

PLASTIC/EPOXY

-40 °C

40

125 °C

有

EX128-TQG64A

250 MHz

LFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.6

2.5000 V

2.3 V

2.7 V

46

Tray

EX128

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

-40 to 125 °C

EX

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

AUTOMOTIVE

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

STD

1 ns

6000

10 mm

10 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

1.5000 V

1.425 V

1.575 V

317

Tray

AX500

活跃

0 to 70 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

STD

N/A

-

表面贴装

329-BBGA

329-PBGA (31x31)

微芯片技术

2.5000 V

2.25 V

2.75 V

249

Tray

A54SX32

活跃

-40 to 85 °C

SX-A

2.25V ~ 5.25V

48000

2880

STD

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

Cast Iron

208

微芯片技术

1.425 V

85 °C

无

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.25

NH-BM824-50-R-140

Grove Gear

151

Tray

M1A3P400

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

C-Face Coupled

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

3

微芯片技术

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1AFS1500-FGG676

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

1.5000 V

1.425 V

1.575 V

252

Tray

M1AFS1500

活跃

FBGA-676

网格排列

0 to 70 °C

Fusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

不合格

OTHER

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

25 mm

25 mm

N/A

-

表面贴装

2915 (7338 Metric)

YES

208-PQFP (28x28)

208

5.25

1.575 V

微芯片技术

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

FQFP

350 MHz

A3P400-2PQ208

无

85 °C

1.425 V

30

1.5 V

PLASTIC/EPOXY

3

FLATPACK, FINE PITCH

--

15V

--

151

Tray

A3P400

Obsolete

FQFP,

-55°C ~ 125°C

Tape & Reel (TR)

Military, MIL-PRF-55365/13, CWR26

0.285 L x 0.150 W (7.24mm x 3.81mm)

±5%

e0

活跃

--

共形涂层

Tin/Lead (Sn/Pb)

8542.39.00.01

100µF

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

180 mOhm

B (0.1%)

--

COMMERCIAL

H

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

Military

0.125 (3.17mm)

28 mm

28 mm

N/A

-

通孔

Axial

YES

256-FPBGA (17x17)

256

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

GRID ARRAY, LOW PROFILE

3

微芯片技术

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.5 V

20

1.425 V

100 °C

无

A2F200M3F-FG256I

80 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.24

--

35V

--

MCU - 25, FPGA - 66

Tray

A2F200

-55°C ~ 125°C

Bulk

Military, MIL-PRF-39003/3, CSR23

0.185 Dia x 0.474 L (4.70mm x 12.04mm)

±20%

e0

活跃

--

密封

Tin/Lead (Sn/Pb)

8542.39.00.01

10µF

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

66

不合格

--

P (0.1%)

--

1.5,1.8,2.5,3.3 V

INDUSTRIAL

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

B

MCU, FPGA

66

4608 CLBS, 200000 GATES

1.7 mm

现场可编程门阵列

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

Military

--

17 mm

17 mm

N/A

-

表面贴装

48-VFQFN Exposed Pad

48-QFN (6x6)

微芯片技术

34

Tray

Obsolete

72641

Murrelektronik

A3PN030

-20°C ~ 85°C (TJ)

ProASIC3 nano

1.425V ~ 1.575V

30000

N/A

-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

1.5000 V

1.425 V

1.575 V

336

Tray

AX500

活跃

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

2

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (27X27)

484

BGA, BGA484,26X26,40

网格排列

3

微芯片技术

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

30

2.25 V

70 °C

无

A54SX72A-1FG484

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.75 V

5.24

2.5000 V

2.25 V

2.75 V

360

Tray

A54SX72

活跃

0 to 70 °C

SX-A

e0

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

360

不合格

2.5,3.3/5 V

COMMERCIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1

1.3 ns

6036

6036

108000

27 mm

27 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

1.575 V

1.425 V

1.5000 V

172

Tray

AFS600

活跃

-40 to 85 °C

Fusion®

1.425V ~ 1.575V

110592

600000

STD

N/A

-

Surface

100-LQFP

100-TQFP (14x14)

微芯片技术

PTHF432A-SSAC

CE, CSA, cULus, UL

SSAC

32

81

Tray

A54SX08A

Obsolete

-40°C ~ 85°C (TA)

SX-A

0.250 in Flat Blade

2.25V ~ 5.25V

120 VAC

12000

768

Percentage Repeat Cycle

固态

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

EDAC Inc.

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

Bulk

活跃

138

M2GL010

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

1.14 V

有

M2GL010-1VFG256I

LFBGA

SQUARE

-40°C ~ 100°C (TJ)

*

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B256

1.56 mm

现场可编程门阵列

12084

933888

1

14 mm

14 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

30

1.14 V

70 °C

无

M1A3PE3000L-PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

147

Tray

M1A3PE3000L

Obsolete

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.2 V

0°C ~ 85°C (TJ)

*

e0

活跃

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

表面贴装

4-SMD, No Lead

100-VQFP (14x14)

Suntsu Electronics, Inc.

Bulk

活跃

71

AGLN125

-10°C ~ 70°C

SXT214

0.079 L x 0.063 W (2.00mm x 1.60mm)

兆赫晶体

1.425V ~ 1.575V

27.12 MHz

±50ppm

100 Ohms

8pF

Fundamental

±20ppm

3072

36864

125000

STD

0.020 (0.50mm)

N/A

-

1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73H2E

活跃

-55°C ~ 155°C

RN73H

0.126 L x 0.098 W (3.20mm x 2.50mm)

±0.5%

2

±100ppm/°C

82.5 kOhms

Metal Film

0.25W, 1/4W

-

Automotive AEC-Q200, Moisture Resistant

0.028 (0.70mm)

AEC-Q200

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

Reliance North America

180

M2GL090

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090TS-FCSG325I

Microsemi Corporation

活跃

MICROSEMI CORP

5.79

Tape & Box (TB)

活跃

-40°C ~ 100°C (TJ)

*

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

PEI-Genesis

85 °C

有

M2GL025T-1FGG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

Bulk

活跃

267

Compliant

M2GL025

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

1.14 V

0°C ~ 85°C (TJ)

*

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

OTHER

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

27696

23 mm

23 mm

N/A

-

表面贴装

4-SMD, No Lead

Suntsu Electronics, Inc.

Bulk

活跃

-40°C ~ 85°C

SXT224

0.098 L x 0.079 W (2.50mm x 2.00mm)

兆赫晶体

27.12 MHz

±50ppm

80 Ohms

8pF

Fundamental

±30ppm

0.026 (0.65mm)

N/A

-

Production (Last Updated: 2 years ago)

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

PLASTIC/EPOXY

BGA256,16X16,40

微芯片技术

-40 °C

1.5 V

20

1.425 V

125 °C

无

A3P250-1FG256T

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

Automotive grade

Compliant

157

Tray

A3P250

活跃

1 MM PITCH, FBGA-256

网格排列

3

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e0

锡铅银

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

3.2 mm

compliant

S-PBGA-B256

157

不合格

1.5/3.3 V

AUTOMOTIVE

Compliant

有

56 Gbps

157

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

36864

250000

AEC-Q100

1

6144

6144

250000

60.3 mm

17 mm

UL94 V-0

N/A

-

表面贴装

1210 (3225 Metric)

YES

1210

208

-55 °C

KOA Speer Electronics, Inc.

2.5 V

30

2.25 V

125 °C

无

A54SX32A-1PQ208M

278 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.25

Tape & Reel (TR)

活跃

174

A54SX32A

PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55°C ~ 155°C

SG73S-RT

0.126 L x 0.102 W (3.20mm x 2.60mm)

±1%

e0

2

3A001.A.2.C

±200ppm/°C

154 Ohms

Tin/Lead (Sn/Pb)

厚膜

1W

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

174

不合格

-

2.5,3.3/5 V

MILITARY

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding

0.028 (0.70mm)

28 mm

28 mm

-

N/A

-

256-LBGA

YES

256-FPBGA (17x17)

256

BGA256,16X16,40

-40 °C

Glenair

1.5 V

20

1.425 V

100 °C

无

A2F500M3G-1FG256I

100 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.22

零售包装

活跃

MCU - 25, FPGA - 66

A2F500M3G

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

*

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

66

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

11520 CLBS, 500000 GATES

1.7 mm

现场可编程门阵列

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

500000

512KB

17 mm

17 mm

N/A

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

PEI-Genesis

有

A3PN030-Z2QNG68

HVQCCN

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.8

1.5 V

1.425 V

1.575 V

Bulk

活跃

49

A3PN030

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-20 °C

30

70 °C

-20°C ~ 85°C (TJ)

*

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

OTHER

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

768

30000

8 mm

8 mm

N/A

-

表面贴装

52-LCC (J-Lead)

YES

52-PLCC (19.13x19.13)

100

微芯片技术

30

2.3 V

70 °C

无

EX256-PTQ100

357 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

5.61

Volatile

81

Tray

EX256

Obsolete

TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

0°C ~ 70°C (TA)

Tape & Reel (TR)

--

e0

Obsolete

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

SRAM - Dual Port, Asynchronous

4.5 V ~ 5.5 V

QUAD

鸥翼

225

0.5 mm

unknown

IDT7014

S-PQFP-G100

COMMERCIAL

36Kb (4K x 9)

12ns

SRAM

Parallel

12000 GATES

1.6 mm

现场可编程门阵列

12ns

512

12000

0.7 ns

12000

14 mm

14 mm