N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

60

微芯片技术

IGLOO2

0.082541 oz

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

无

M2GL060-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.7

This product may require additional documentation to export from the United States.

N

56520 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

-40°C ~ 100°C (TJ)

Tray

M2GL060

e0

Tin/Lead (Sn63Pb37)

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

1.2 V

2.44 mm

现场可编程门阵列

56520

1869824

STD

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

Tray

M2GL025

活跃

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL025T

1.14V ~ 2.625V

1.2 V

27696

1130496

STD

2 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

Tray

M2GL025

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

有

M2GL025TS-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

1.2 V

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

293

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

FBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

11000 LE

300 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

60

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

SMD/SMT

有

40

微芯片技术

IGLOO2

1.2000 V

1.14 V

1.26 V

Tray

M2GL090

活跃

1.2 V

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

无

M2GL090-1FG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

- 40 C

+ 100 C

-40 to 100 °C

Tray

M2GL090

e0

Tin/Lead (Sn/Pb)

100 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

1

86316

27 mm

27 mm

含铅

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

1.2 V

20

85 °C

无

M2GL005S-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

1.26 V

161

Tray

M2GL005

活跃

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

表面贴装

256-LFBGA

256-FPBGA (14x14)

微芯片技术

Tray

M2GL005

活跃

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

1.26 V

161

0°C ~ 85°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

6060

719872

N/A

-

表面贴装

FBGA-256

256-FBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000

1

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

未说明

77

Tray

AGL030

活跃

1.425 V

AGL030V5-VQG100I

有

活跃

MICROSEMI CORP

TFQFP,

1.38

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

-40°C ~ 85°C (TA)

IGLOO

e3

Tin (Sn)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

14 mm

14 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

30

147

Compliant

Tray

A3PE1500

Obsolete

1.425 V

A3PE1500-2PQ208I

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.61

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

-40°C ~ 100°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1.5e+06

310 MHz

2

38400

38400

38400

1500000

3.4 mm

28 mm

28 mm

无

含铅

N/A

-

YES

144

30

3 V

A54SX16P-1TQ144M

无

Obsolete

MICROSEMI CORP

LFQFP,

5.85

280 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

e0

3A001.A.2.C

锡铅

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

MILITARY

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

0.8 ns

1452

16000

20 mm

20 mm

N/A

-

YES

128

1.5 V

未说明

AGLP030V2-VQ128I

无

Obsolete

MICROSEMI CORP

14 X 14 MM, 1 MM HEIGHT, 0.4 MM PITCH, VQFP-128

5.32

160 MHz

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP128,.63SQ,16

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.425 V

8542.39.00.01

QUAD

鸥翼

未说明

0.4 mm

unknown

S-PQFP-G128

101

不合格

1.2/1.5 V

INDUSTRIAL

101

792 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

792

792

30000

14 mm

14 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

30

175

Tray

A54SX16

Obsolete

3 V

A54SX16P-2PQ208I

无

Obsolete

MICROSEMI CORP

FQFP,

5.24

320 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

-40°C ~ 85°C (TA)

SX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

16000

28 mm

28 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

3.6 V

3.3 V

40

113

Tray

A54SX32

活跃

3 V

A54SX32-1TQG144I

有

活跃

MICROSEMI CORP

LFQFP, QFP144,.87SQ,20

5.24

280 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

-40°C ~ 85°C (TA)

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3,5 V

INDUSTRIAL

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1

0.8 ns

2880

2880

32000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

3.3 V

40

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

81

Tray

A54SX16

活跃

3 V

A54SX16P-2VQG100

有

活跃

MICROSEMI CORP

TFQFP, TQFP100,.63SQ

5.24

320 MHz

3

70 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

0 to 70 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

COMMERCIAL

81

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

2

0.7 ns

1452

1452

16000

14 mm

14 mm

N/A

-

表面贴装

YES

176

176

40

128

Compliant

3 V

A54SX08-2TQG176I

有

Obsolete

MICROSEMI CORP

LFQFP,

5.31

320 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

e3

哑光锡

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

320 MHz

S-PQFP-G176

不合格

5 V

INDUSTRIAL

5.5 V

4.5 V

700 ps

700 ps

768 CLBS, 8000 GATES

1.6 mm

现场可编程门阵列

768

12000

320 MHz

768

2

256

0.7 ns

768

8000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

5.76

3

未说明

77

Compliant

AGL030V2-VQG100T

有

活跃

MICROSEMI CORP

,

e3

Tin (Sn)

70 °C

0 °C

8542.39.00.01

未说明

compliant

现场可编程门阵列

768

30000

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

Compliant

Tray

A3PE3000L

Obsolete

1.14 V

A3PE3000L-1PQ208

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.61

250 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.2 V

30

147

0°C ~ 85°C (TJ)

ProASIC3L

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.2 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3e+06

892.86 MHz

1

75264

75264

75264

3000000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

2.75 V

2.5 V

30

81

Tray

A54SX08A

Obsolete

2.25 V

A54SX08A-1TQ100I

无

Obsolete

MICROSEMI CORP

1.40 MM HEIGHT, TQFP-100

5.26

278 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,3.3/5 V

INDUSTRIAL

81

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.1 ns

768

768

12000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

1.2 V

未说明

1.2, 1.5 V

1.14 V

1.575 V

77

Tray

AGL030

活跃

1.14 V

AGL030V2-VQG100

有

活跃

MICROSEMI CORP

TFQFP,

1.39

108 MHz

3

85 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

0 to 70 °C

IGLOO

e3

Tin (Sn)

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

14 mm

14 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

160-BQFP

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

Tray

A42MX24

Obsolete

3 V

A42MX24-3PQ160I

无

Obsolete

MICROSEMI CORP

QFP

QFP,

5.25

3

85 °C

-40 °C

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

3.6 V

3.3 V

30

125

Compliant

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

160

S-PQFP-G160

不合格

5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

YES

176

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A42MX16-1TQ176I

无

Obsolete

MICROSEMI CORP

QFP

LFQFP, QFP176,1.0SQ,20

5.23

108 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

e0

锡铅

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

176

S-PQFP-G176

140

不合格

3.3,3.3/5,5 V

INDUSTRIAL

140

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

2.4 ns

1232

1232

24000

24 mm

24 mm

N/A

-

YES

176

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A42MX24-2TQ176I

无

Obsolete

MICROSEMI CORP

QFP

1.40 MM HEIGHT, PLASTIC, TQFP-176

5.25

114.75 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

unknown

176

S-PQFP-G176

150

不合格

3.3,3.3/5,5 V

INDUSTRIAL

150

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

1.8 ns

1890

1866

36000

24 mm

24 mm