N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

160

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

A3P1000L-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

-40 to 85 °C

Tray

A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

ProASIC3

1.5000 V

1.425 V

微芯片技术

1.575 V

Tray

M1A3P250

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-2VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

90

0 to 70 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

+ 85 C

SMD/SMT

892.86 MHz

有

160

ProASIC3

0.014110 oz

微芯片技术

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

M1A3P600L-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

- 40 C

-40 to 85 °C

Tray

M1A3P600L

e0

锡铅银

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

M1AGL600V2-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

有

90

IGLOOe

0.014110 oz

1.575 V

Tray

M1AGL600

活跃

0°C ~ 70°C (TA)

Tray

M1AGL600V2

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.14 V

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

SMD/SMT

有

160

IGLOOe

0.014110 oz

FBGA

微芯片技术

1.5000 V

1.425 V

600000

97

600000

1.575 V

表面贴装

Tray

M1AGL600

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AGL600V5-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Commercial grade

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M1AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

Commercial

STD

13824

13824

1.575 V

1.425 V

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

SMD/SMT

781.25 MHz

有

160

ProASIC3

0.014110 oz

微芯片技术

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

70 °C

无

M1A3P600L-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 C

+ 70 C

0 to 70 °C

Tray

M1A3P600L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

COMMERCIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

1.14 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

M1AGL600V2-FGG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

有

90

IGLOOe

0.014110 oz

1.2, 1.5 V

0 to 70 °C

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.14 V

600000

1.2 mm

17 mm

17 mm

无铅

N/A

-

表面贴装

CSP

YES

281-CSP (10x10)

281

IGLOOe

微芯片技术

Tray

AGL1000

活跃

1.575 V

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

未说明

85 °C

无

AGL1000V2-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

11000 LE

215 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

184

0°C ~ 70°C (TA)

Tray

AGL1000V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B281

不合格

OTHER

44 uA

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

0.71 mm

10 mm

10 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

160

ProASIC3

微芯片技术

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

A3P1000L-FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

11000 LE

97 I/O

-40 to 85 °C

Tray

A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

Tray

A3PE3000

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-2FG324

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

221 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0.014110 oz

ProASIC3

84

有

310 MHz

1.5000 V

1.575 V

0 to 70 °C

Tray

A3PE3000

e0

锡铅银

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

不合格

COMMERCIAL

63 kB

25 mA

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

310 MHz

2

75264

75264

1.575 V

1.425 V

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

Tray

M1AFS1500

活跃

1.575 V

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

40

ProASIC3

0.014110 oz

微芯片技术

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

无

M1A3PE1500-1FG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

0°C ~ 85°C (TJ)

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5/3.3 V

COMMERCIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

892.86 MHz

有

60

ProASIC3

0.014110 oz

微芯片技术

1.2000 V

Tray

M1A3PE3000

活跃

1.26 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

30

85 °C

无

M1A3PE3000L-1FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

-40 to 85 °C

Tray

M1A3PE3000L

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

INDUSTRIAL

25 mA

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

310 MHz

有

60

ProASIC3

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-2FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

M1A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

IGLOOe

0.014110 oz

微芯片技术

1.2, 1.5 V

1.14 V

1.575 V

Tray

M1AGL250

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

40

100 °C

有

M1AGL250V2-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

3000 LE

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

有

160

-40 to 85 °C

Tray

M1AGL250V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

4.5 kB

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

1.575 V

1.14 V

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

177 I/O

1.425 V

微芯片技术

1.575 V

Tray

M1A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-2FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 C

+ 70 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

231 MHz

有

24

ProASIC3

1.5000 V

微芯片技术

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

M1A3PE3000-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

M1A3PE3000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

504 kbit

250 MHz

3500 LAB

60

微芯片技术

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

5.24

MICROSEMI CORP

活跃

SQUARE

BGA

M1AGLE3000V5-FGG484I

有

85 °C

30

1.5 V

-40 °C

PLASTIC/EPOXY

3

网格排列

BGA,

This product may require additional documentation to export from the United States.

Details

35000 LE

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40 to 85 °C

Tray

M1AGLE3000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

63 kB

700 Mb/s

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

1.425 V

1.5000 V

1.575 V

Tray

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AGL600V5-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

有

90

IGLOOe

0.014110 oz

1.575 V

0 to 70 °C

Tray

M1AGL600V5

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

231 MHz

有

27

ProASIC3

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

30

70 °C

无

M1A3PE3000-FG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

M1A3PE3000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

504 kbit

250 MHz

3500 LAB

60

微芯片技术

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

网格排列

BGA,

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

有

M1AGLE3000V2-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

35000 LE

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

-40 to 85 °C

Tray

M1AGLE3000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

63 kB

700 Mb/s

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

1.575 V

1.14 V

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

有

60

ProASIC3

0.014110 oz

微芯片技术

1.5000 V

Tray

M1A3PE3000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

M1A3PE3000-1FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

0 to 70 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

272 MHz

有

27

ProASIC3

0.014110 oz

微芯片技术

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

40

70 °C

有

M1A3PE3000-1FGG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

微芯片技术

1.5000 V

1.425 V

1.575 V

Tray

M1A3PE3000

活跃

1.575 V

无

M1A3PE3000-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

160

ProASIC3

0.014110 oz

1.575 V

微芯片技术

1.425 V

1.5000 V

1.575 V

Tray

M1A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

0 to 70 °C

Tray

M1A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm