2598 In Stock

• 1: ¥1,230.577440
• 10: ¥1,160.922115
• 100: ¥1,095.209540
• 500: ¥1,033.216545
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

有

M2GL050T-1FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

2523 In Stock

• 1: ¥1,568.859879
• 10: ¥1,480.056486
• 100: ¥1,396.279711
• 500: ¥1,317.245010
查看所有的价格

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

SMD/SMT

有

微芯片技术

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

85 °C

有

M2GL060T-1FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

1.2 V

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

2721 In Stock

• 1: ¥1,351.352990
• 10: ¥1,274.861307
• 100: ¥1,202.699351
• 500: ¥1,134.622030
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

1.14 V

85 °C

无

M2GL050-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

60

IGLOO2

267

Tray

M2GL050

活跃

BGA, BGA484,22X22,40

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

2956 In Stock

• 1: ¥3,887.390801
• 10: ¥3,667.349813
• 100: ¥3,459.763973
• 500: ¥3,263.928276
查看所有的价格

-

表面贴装

484-BFBGA

484-BGA

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

19 In Stock

• 1: ¥153.914946
• 10: ¥145.202779
• 100: ¥136.983758
• 500: ¥129.229954
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

SMD/SMT

有

微芯片技术

90

IGLOO2

1.26 V

Tray

M2GL005

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL005-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

6060 LE

171 I/O

1.14 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

OTHER

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

2225 In Stock

• 1: ¥1,097.015340
• 10: ¥1,034.920132
• 100: ¥976.339749
• 500: ¥921.075234
查看所有的价格

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

+ 85 C

SMD/SMT

有

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060TS-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

200 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

2472 In Stock

• 1: ¥1,074.535731
• 10: ¥1,013.712955
• 100: ¥956.332978
• 500: ¥902.200922
查看所有的价格

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

2 Transceiver

19 In Stock

• 1: ¥718.415029
• 10: ¥677.750027
• 100: ¥639.386821
• 500: ¥603.195109
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-2FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

2724 In Stock

• 1: ¥3,588.172242
• 10: ¥3,385.068155
• 100: ¥3,193.460523
• 500: ¥3,012.698610
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Details

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

M1A3PE3000-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3PE3000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

35000 LE

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

504 kbit

微芯片技术

250 MHz

3500 LAB

60

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

有

M1AGLE3000V5-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

-40 to 85 °C

Tray

M1AGLE3000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

700 Mb/s

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

2210 In Stock

• 1: ¥1,060.342083
• 10: ¥1,000.322720
• 100: ¥943.700675
• 500: ¥890.283658
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

SMD/SMT

有

90

微芯片技术

IGLOOe

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AGL600V5-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M1AGL600V5

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

1.575 V

1.425 V

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

876 In Stock

• 1: ¥4,479.871319
• 10: ¥4,226.293700
• 100: ¥3,987.069526
• 500: ¥3,761.386345
查看所有的价格

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

30

70 °C

无

M1A3PE3000-FG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

564 In Stock

• 1: ¥8,255.108250
• 10: ¥7,787.837970
• 100: ¥7,347.016956
• 500: ¥6,931.148070
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

35000 LE

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

504 kbit

微芯片技术

250 MHz

3500 LAB

60

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

有

M1AGLE3000V2-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

-40 to 85 °C

Tray

M1AGLE3000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

63 kB

700 Mb/s

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

3000000

1.73 mm

23 mm

23 mm

2351 In Stock

• 1: ¥4,077.405049
• 10: ¥3,846.608537
• 100: ¥3,628.875979
• 500: ¥3,423.467906
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

Tray

M1A3PE3000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

M1A3PE3000-1FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

0 to 70 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

27

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

40

70 °C

有

M1A3PE3000-1FGG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

2409 In Stock

• 1: ¥4,069.565541
• 10: ¥3,839.212777
• 100: ¥3,621.898848
• 500: ¥3,416.885701
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3PE3000

活跃

1.575 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

M1A3PE3000-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

19 In Stock

• 1: ¥250.253604
• 10: ¥236.088306
• 100: ¥222.724820
• 500: ¥210.117756
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

97 I/O

0 to 70 °C

Tray

M1A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm

2840 In Stock

• 1: ¥1,519.297510
• 10: ¥1,433.299538
• 100: ¥1,352.169373
• 500: ¥1,275.631485
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

1470.59 MHz

有

微芯片技术

90

Fusion

0.014110 oz

Tray

M1AFS250

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS250-2FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

114 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.2 mm

17 mm

17 mm

678 In Stock

• 1: ¥6,547.961383
• 10: ¥6,177.322057
• 100: ¥5,827.662319
• 500: ¥5,497.794636
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

1098.9 MHz

有

60

微芯片技术

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS1500-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

223 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

1.73 mm

23 mm

23 mm

947 In Stock

• 1: ¥10,473.221568
• 10: ¥10,128.840976
• 25: ¥10,058.431948
• 50: ¥9,988.512362
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

A3PE3000L-1FGG484I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

-40 to 85 °C

Tray

A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

25 mA

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

2942 In Stock

• 1: ¥2,673.347890
• 10: ¥2,522.026312
• 100: ¥2,379.270106
• 500: ¥2,244.594441
查看所有的价格

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3PE1500

活跃

1.575 V

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

无

M1A3PE1500-2FG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

27 mm

27 mm

2565 In Stock

• 1: ¥904.485739
• 10: ¥853.288430
• 100: ¥804.989085
• 500: ¥759.423663
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

+ 85 C

SMD/SMT

有

160

微芯片技术

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

40

100 °C

有

M1AGL600V2-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

97 I/O

1.14 V

- 40 C

-40 to 85 °C

Tray

M1AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

无铅

19 In Stock

• 1: ¥514.324993
• 10: ¥485.212255
• 100: ¥457.747412
• 500: ¥431.837180
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

微芯片技术

24

ProASIC3

1.5000 V

1.575 V

Tray

M1A3P600

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-1PQG208I

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

-40 to 85 °C

Tray

M1A3P600

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

1

13824

600000

3.4 mm

28 mm

28 mm

2112 In Stock

• 1: ¥2,309.534174
• 10: ¥2,178.805822
• 100: ¥2,055.477191
• 500: ¥1,939.129428
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3PE1500

活跃

1.575 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

M1A3PE1500-1FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

36 In Stock

• 1: ¥210.460442
• 10: ¥198.547589
• 100: ¥187.309046
• 500: ¥176.706644
查看所有的价格

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

90

微芯片技术

ProASIC3

1.425 V

1.575 V

1.5000 V

Tray

M1A3P250

活跃

1.575 V

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P250-2VQ100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

-40 to 85 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm