N/A

-

表面贴装

144-LBGA

144-FPBGA (13x13)

微芯片技术

Tray

A3P060

活跃

96

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

1.425V ~ 1.575V

18432

60000

N/A

-

N/A

-

YES

208

3.3 V

30

3 V

70 °C

无

A54SX16-1PQ208

280 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

0.8 ns

1452

16000

28 mm

28 mm

N/A

-

YES

144

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

40

Obsolete

MICROSEMI CORP

2.75 V

5.32

Microsemi Corporation

SQUARE

LBGA

313 MHz

A54SX08A-2FGG144

有

70 °C

2.25 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

e1

锡银铜

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

COMMERCIAL

111

768 CLBS, 12000 GATES

1.55 mm

现场可编程门阵列

0.9 ns

768

768

12000

13 mm

13 mm

N/A

-

YES

484

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P1000L-1FGG484I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

BGA, BGA484,22X22,40

网格排列

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

INDUSTRIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

YES

1152

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.82

BGA, BGA1152,34X34,40

网格排列

PLASTIC

BGA1152,34X34,40

1.2 V

有

M2GL100T-1FCG1152I

BGA

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

YES

1152

活跃

MICROSEMI CORP

5.88

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

无

M2GL100S-1FC1152I

BGA

SQUARE

Microsemi Corporation

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

YES

1152

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.82

BGA, BGA1152,34X34,40

网格排列

PLASTIC

BGA1152,34X34,40

1.2 V

有

M2GL100T-1FCG1152

BGA

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

133

Tray

Obsolete

A3P125

-40°C ~ 100°C (TJ)

ProASIC3

1.425V ~ 1.575V

36864

125000

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

Tray

A3PN030

Obsolete

77

-40°C ~ 100°C (TJ)

ProASIC3 nano

1.425V ~ 1.575V

30000

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

微芯片技术

Tray

A54SX32A

Obsolete

81

0°C ~ 70°C (TA)

SX-A

2.25V ~ 5.25V

48000

2880

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

微芯片技术

Tray

A54SX16A

Obsolete

81

-40°C ~ 85°C (TA)

SX-A

2.25V ~ 5.25V

24000

1452

N/A

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

活跃

HVQCCN,

微芯片技术

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-40 °C

1.5 V

30

1.425 V

100 °C

有

A3P030-QNG68I

HVQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.22

49

Tray

A3P030

-40°C ~ 100°C (TJ)

ProASIC3

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

STD

768

30000

8 mm

8 mm

N/A

-

YES

208

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P1000L-PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

24576

24576

1000000

28 mm

28 mm

N/A

-

Non-Compliant

N/A

-

N/A

-

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

MICROSEMI CORP

Microsemi Corporation

A3P125-2TQ144I

微芯片技术

3

100

100 °C

-40 °C

Tray

PLASTIC/EPOXY

LFQFP

LFQFP,

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

Obsolete

30

5.25

无

1.575 V

1.425 V

1.5 V

A3P125

350 MHz

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.6 mm

现场可编程门阵列

36864

125000

3072

125000

20 mm

20 mm

N/A

-