N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

SMD/SMT

有

微芯片技术

176

IGLOO2

Tray

M2GL025

活跃

1.2 V

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

5.27

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL025-1FCSG325I

有

1.2 V

BGA325,21X21,20

This product may require additional documentation to export from the United States.

Details

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL025

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

27696

1130496

27696

N/A

-

Obsolete (Last Updated: 2 months ago)

通孔

624

418

Compliant

125 °C

-55 °C

1.5 V

20.3 kB

990 ps

12096

1e+06

12096

无

N/A

-

表面贴装

YES

240

240

无

A42MX36-3PQ240

100 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.79

QFP

202

Compliant

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

3.3 V

30

3 V

70 °C

e0

锡铅

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G240

202

不合格

3.3,3.3/5,5 V

COMMERCIAL

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

180 MHz

1184

3

1822

1.9 ns

2438

2414

5.25 V

3 V

54000

3.4 mm

32 mm

32 mm

无

N/A

-

YES

256

3.3 V

3.63 V

FLATPACK, GUARD RING

SQUARE

GQFF

CERAMIC, METAL-SEALED COFIRED

-55 °C

125 °C

5.26

GQFF,

MICROSEMI CORP

Obsolete

5962-9956904QXC

2.97 V

Military grade

e4

3A001.A.2.C

GOLD

ALSO REQUIRES 5V SUPPLY

8542.39.00.01

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F256

Qualified

MILITARY

1452 CLBS, 16000 GATES

3.81 mm

现场可编程门阵列

MIL-PRF-38535 Class Q

1452

16000

36 mm

36 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

有

M2GL050T-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.29

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

STD

56340

17 mm

17 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

209

Tray

M2GL005

活跃

1.26 V

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

6060

719872

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

896-FBGA (31x31)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

27

IGLOO2

1.2000 V

377

Tray

M2GL050

活跃

-40 to 100 °C

Tray

M2GL050T

100 °C

-40 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

1.14 V

有

90

IGLOO2

169

1.26 V

Tray

M2GL005

-40°C ~ 100°C (TJ)

Tray

M2GL005S

100 °C

-40 °C

1.14V ~ 2.625V

87.9 kB

6060

719872

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

有

MICROSEMI CORP

1.26 V

5.27

活跃

SQUARE

BGA

M2GL050-1FCSG325I

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

1.14 V

有

90

IGLOO2

169

1.26 V

Tray

M2GL005

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

1.14V ~ 2.625V

87.9 kB

6060

719872

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

85 °C

无

M2GL150-FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

24

IGLOO2

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

146124

35 mm

35 mm

N/A

-

表面贴装

484-BFBGA

484-BGA

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

PLASTIC/EPOXY

1.2 V

1.14 V

85 °C

有

M2GL150TS-FCVG484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

0°C ~ 85°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

293

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

60

IGLOO2

267

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050T

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

IGLOO2

90

有

N

This product may require additional documentation to export from the United States.

207

Tray

M2GL050

活跃

0°C ~ 85°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

4

PLASTIC/EPOXY

1.2 V

1.14 V

85 °C

有

M2GL150T-FCVG484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484

GRID ARRAY, FINE PITCH

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

Tray

M2GL150TS

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

有

M2GL050T-1FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

1.14 V

85 °C

无

M2GL050-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

60

IGLOO2

267

Tray

M2GL050

活跃

BGA, BGA484,22X22,40

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

表面贴装

484-BFBGA

484-BGA

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

无

M1AGL1000V2-FG484

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

60

IGLOOe

300

Tray

M1AGL1000

0°C ~ 70°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

600000

600000

97

微芯片技术

Tray

M1A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P600-2FGG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

160

ProASIC3

-40°C ~ 100°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

13824

600000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-144

YES

144

144-FPBGA (13x13)

144

微芯片技术

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

无

M1AGL1000V2-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

160

IGLOOe

97

Tray

M1AGL1000

-40°C ~ 85°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

OTHER

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1e+06

24576

1000000

13 mm

13 mm