N/A

-

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

有

90

IGLOO2

293

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

FBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

11000 LE

300 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

60

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

有

84

IGLOO2

248

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

有

40

微芯片技术

IGLOO2

1.2000 V

1.14 V

1.26 V

Tray

M2GL090

活跃

1.2 V

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

无

M2GL090-1FG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

425 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40 to 100 °C

Tray

M2GL090

e0

Tin/Lead (Sn/Pb)

100 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

1

86316

27 mm

27 mm

含铅

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

20

85 °C

无

M2GL005S-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

1.26 V

161

Tray

M2GL005

活跃

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

表面贴装

256-LFBGA

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

1.26 V

161

Tray

M2GL005

活跃

0°C ~ 85°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

6060

719872

N/A

-

表面贴装

FBGA-256

256-FBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

1.5 V

0 C

+ 85 C

SMD/SMT

144 kbit

144 kbit

350 MHz

-

90

1 kbit

ProASIC3

1.5 V

Tray

A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

A3P1000

1.14V ~ 1.575V

1.5 V

8 mA

700 Mb/s

147456

1000000

1

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

1.425 V

- 40 C

+ 85 C

SMD/SMT

649 MHz

有

27

微芯片技术

Actel

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AX2000

活跃

5.25

MICROSEMI CORP

活跃

SQUARE

BGA

649 MHz

AX2000-FG896I

无

85 °C

30

1.5 V

-40 °C

BGA896,30X30,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA896,30X30,40

This product may require additional documentation to export from the United States.

N

586 I/O

-40 to 85 °C

Tray

AX2000

e0

Tin/Lead (Sn/Pb)

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

896

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

294912

2000000

32256

STD

0.99 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

5.25 V

Tray

A42MX36

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-PQG208

73 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.57

Actel

24

有

131 MHz

SMD/SMT

+ 70 C

0 C

3 V

176 I/O

Details

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

COMMERCIAL

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

2560

54000

2.7 ns

2438

54000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

有

90

ProASIC3

微芯片技术

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

0 to 70 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

209 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

-

60

703 kbit

IGLOO2

1.26 V

Tray

M2GL005

活跃

This product may require additional documentation to export from the United States.

Details

6060 LE

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

1.14V ~ 2.625V

1.2 V

87.9 kB

87.9 kB

6060

719872

1

23 mm

23 mm

N/A

-

表面贴装

FPBGA-896

YES

896-FBGA (31x31)

896

SMD/SMT

有

-

微芯片技术

27

1826 kbit

IGLOO2

1.2 V

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

85 °C

有

M2GL050-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

56340 LE

377 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL050

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

1.2 V

OTHER

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

表面贴装

VFBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

0.034371 oz

1.26 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

有

M2GL010-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.57

Details

12084 LE

195 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

667 Mb/s

195

1.51 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

TQFP-144

YES

144

微芯片技术

0.578352 oz

1.26 V

Tray

M2GL005

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005-TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.54

Details

6060 LE

84 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL005

e3

Matte Tin (Sn)

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

1.2 V

-

1.6 mm

现场可编程门阵列

6060

719872

STD

-

20 mm

20 mm

N/A

-

TQFP-144

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.26 V

Tray

M2GL010

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL010S

1.14V ~ 2.625V

1.2 V

-

12084

933888

-

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

56520 LE

This product may require additional documentation to export from the United States.

1.2 V

Tray

M2GL060

活跃

IGLOO2

60

SMD/SMT

+ 125 C

- 55 C

1.2 V

267 I/O

-55°C ~ 125°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

TQFP-144

微芯片技术

Details

12084 LE

84 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL010S

1.14V ~ 2.625V

1.2 V

12084

933888

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

Details

300000 LE

512 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

Details

300000 LE

244 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C (TJ)

Tray

MPF300TL

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

PolarFire

1.03 V/1.08 V

364

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

192000 LE

970 mV/1.02 V

SMD/SMT

有

1

-40°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1.05 V

192000

13619200

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

PolarFire

1

有

7.6 Mbit

1.03 V/1.08 V

244

Tray

MPF100

活跃

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

0°C ~ 100°C (TJ)

Tray

MPF100T

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

Details

300000 LE

284 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

SMD/SMT

+ 100 C

- 40 C

0.97 V

284 I/O

192000 LE

Details

This product may require additional documentation to export from the United States.

Tray

MPF200

活跃

1.08 V

PolarFire

1

有

-40°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

192000

13619200

4 Transceiver

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

0.452847 oz

Tray

MPF300

活跃

1.08 V

-40°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

300000

21094400

4 Transceiver

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

970 mV/1.02 V

SMD/SMT

有

1

PolarFire

1.03 V/1.08 V

388

-40°C ~ 100°C (TJ)

Tray

MPF500TLS

0.97V ~ 1.08V

1.05 V

481000

33792000