N/A

-

微芯片技术

5.82

195

Tray

M2GL010

活跃

,

未说明

有

M2GL010TS-1VFG400T2

Microsemi Corporation

活跃

MICROSEMI CORP

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100, IGLOO2

有

1.14V ~ 2.625V

未说明

compliant

现场可编程门阵列

12084

933888

1

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

252

Tray

M1AFS1500

活跃

5.3

微芯片技术

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

M1AFS1500-FG676I

无

85 °C

1.425 V

30

1.5 V

-40 °C

PLASTIC/EPOXY

3

网格排列

BGA,

1.5000 V

1.425 V

1.575 V

-40 to 85 °C

Fusion®

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

不合格

INDUSTRIAL

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

25 mm

25 mm

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-UCSP (4x4)

81

Tray

AGL030

活跃

VFBGA,

微芯片技术

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

未说明

1.425 V

85 °C

有

AGL030V5-UCG81

108 MHz

VFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

0.81

1.5000 V

1.425 V

1.575 V

66

0 to 70 °C

IGLOO

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B81

不合格

OTHER

768 CLBS, 30000 GATES

0.8 mm

现场可编程门阵列

768

30000

STD

768

30000

4 mm

4 mm

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

34

Tray

A3PN010

活跃

HQCCN,

微芯片技术

CHIP CARRIER, HEAT SINK/SLUG

3

UNSPECIFIED

-20 °C

1.5 V

30

1.425 V

70 °C

有

A3PN010-1QNG48

HQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.44

1.5000 V

1.425 V

1.575 V

-20 to 70 °C

ProASIC3 nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

OTHER

260 CLBS, 10000 GATES

现场可编程门阵列

10000

1

260

10000

6 mm

6 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

AX500

活跃

1.5000 V

1.425 V

1.575 V

115

Tray

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

2

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

3.63, 5.25 V

111

Tray

A54SX08

活跃

LBGA, BGA144,12X12,40

微芯片技术

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

3.3 V

30

3 V

70 °C

无

A54SX08-FG144

240 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

3.3, 5 V

2.97, 4.75 V

0 to 70 °C

SX

e0

Tin/Lead/Silver (Sn/Pb/Ag)

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

3.3,5 V

COMMERCIAL

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

12000

768

STD

0.9 ns

768

768

8000

13 mm

13 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (27X27)

Aluminum

微芯片技术

P-Q7R62-M2RUV20

Grace Technologies

2.5000 V

2.25 V

2.75 V

360

Tray

A54SX72

活跃

(2) Universal International Receptacles

0 to 70 °C

SX-A

2.25V ~ 5.25V

108000

6036

STD

IP65

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

Tray

M1AFS1500

活跃

FBGA-676

微芯片技术

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1AFS1500-FGG676

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

1.5000 V

1.425 V

1.575 V

252

0 to 70 °C

Fusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

不合格

OTHER

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

25 mm

25 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

115

Tray

AX500

Obsolete

0°C ~ 70°C (TA)

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

微芯片技术

113

Tray

A54SX32A

Obsolete

0°C ~ 70°C (TA)

SX-A

2.25V ~ 5.25V

48000

2880

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

1.5000 V

115

Tray

AX500

活跃

0 to 70 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

STD

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

3 V

5.5 V

57

Tray

A40MX02

活跃

微芯片技术

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

3 V

85 °C

有

A40MX02-PQG100I

80 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

3.6 V

1.54

Honeywell-Microswitch

3.3, 5 V

-40 to 85 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

STD

2.7 ns

295

3000

20 mm

14 mm

N/A

-

表面贴装

196-TFBGA, CSBGA

YES

196-CSP (8x8)

196

Hubbell

1.5000 V

1.425 V

1.575 V

133

Tray

微芯片技术

AGL125

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

1.425 V

100 °C

无

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

PT2X2IGBRS

cULus

-40 to 85 °C

IGLOO

Brass

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

20 A

S-PBGA-B196

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

8 mm

8 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

297836

CE, cULus

Pepperl Fuchs

1,000 Hz

2.5000 V

2.25 V

2.75 V

113

微芯片技术

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

2.25 V

70 °C

有

172 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

2.75 V

5.24

0 to 70 °C

SX-A

e3

Matte Tin (Sn)

Non-Metallic

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

PNP

2.5,2.5/5 V

COMMERCIAL

Light On

113

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

F

1.7 ns

2880

2880

48000

Cable

DC

20 mm

20 mm

N/A

-

表面贴装

676-BGA

676-FBGA (27x27)

微芯片技术

Johnson Controls

1.5000 V

1.425 V

1.575 V

336

Tray

AX500

活跃

VH7441CT+3003B

0 to 70 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

1

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

1.575 V

165

Tray

A3PE600

活跃

微芯片技术

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

85 °C

无

A3PE600-2FG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.29

GE - General Electric

1.5000 V

1.425 V

-40 to 85 °C

ProASIC3E

e0

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

17 mm

17 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

Turck

1.2, 1.5 V

1.14 V

1.575 V

165

Tray

AGLE600

微芯片技术

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

1.2 V

30

1.14 V

85 °C

无

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

U-92501

-40 to 85 °C

IGLOOe

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

165

不合格

1.2/1.5 V

INDUSTRIAL

165

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

13824

600000

17 mm

17 mm

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

1.575 V

34

Tray

A3PN010

活跃

微芯片技术

6 X 6 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48

CHIP CARRIER, HEAT SINK/SLUG

5.26

1.575 V

MICROSEMI CORP

活跃

SQUARE

HQCCN

A3PN010-2QNG48I

有

85 °C

1.425 V

30

1.5 V

-40 °C

UNSPECIFIED

3

Miscellaneous

1.5000 V

1.425 V

-40 to 85 °C

ProASIC3 nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

INDUSTRIAL

260 CLBS, 10000 GATES

现场可编程门阵列

10000

2

260

10000

6 mm

6 mm

N/A

-

YES

144

PLASTIC/EPOXY

1.2 V

LEMO

20

1.14 V

无

M2GL010S-TQ144I

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.57

Bulk

活跃

84

20 X 20 MM, 0.50 MM PITCH, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

-40°C ~ 100°C (TJ)

-

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

1.6 mm

现场可编程门阵列

12084

933888

20 mm

20 mm

N/A

-

面板安装

144-LQFP

YES

Bulkhead - Front Side Nut

Circular

Composite

144-TQFP (20x20)

-

144

3

Amphenol Aerospace Operations

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

2.5 V

30

2.25 V

85 °C

无

A54SX16A-1TQ144I

263 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.25

Bulk

D38999/24JC

20

活跃

113

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

-65°C ~ 175°C

Military, MIL-DTL-38999 Series III, Tri-Start™ TV

e0

插座外壳

用于内螺纹插座

10

Tin/Lead (Sn/Pb)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

Threaded

现场可编程门阵列

Crimp

CMOS

2.25V ~ 5.25V

QUAD

B

鸥翼

Shielded

225

抗环境干扰

0.5 mm

compliant

Cadmium

13-98

S-PQFP-G144

113

不合格

橄榄色

2.5,3.3/5 V

INDUSTRIAL

不包括触点

C

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

-

24000

1452

1.2 ns

1452

1452

24000

-

20 mm

20 mm

-

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

A3PN030

Obsolete

HA1F-21C65V-W

CSA, UL

IDEC

77

Tray

-40°C ~ 100°C (TJ)

ProASIC3 nano

1.425V ~ 1.575V

White

30000

Incandescent

DPDT

IP65

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

AX500

活跃

ACH580-BCR-027A-4+B056+J429+L501

ABB

1.5000 V

317

Tray

0 to 70 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

2

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

151

Tray

A3P250

Obsolete

0°C ~ 85°C (TJ)

ProASIC3

1.425V ~ 1.575V

36864

250000

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

Momentary

10250T30R

CE, CSA, UL

Cutler Hammer, Div of Eaton Co

1.5000 V

1.425 V

1.575 V

115

Tray

AX500

活跃

-40 to 85 °C

Axcelerator

1.425V ~ 1.575V

Screw

73728

500000

8064

STD

1NO, 1NC

IP65

N/A

-

Non-Compliant

Female

Socket