对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

安装类型

包装/外壳

表面安装

供应商器件包装

终端数量

厂商

操作温度

包装

系列

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

内存大小

数据率

输入数量

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

收发器数量

逻辑单元数

长度

宽度

MPF200T-1FCG484E
MPF200T-1FCG484E
Microchip Technology 数据表

2843 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

192000 LE

244 I/O

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

Tray

MPF200

活跃

0°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1.05 V

192000

13619200

MPF300T-1FCG784E
MPF300T-1FCG784E
Microchip Technology 数据表

2228 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

FCBGA

0C to 100C

388

300000

28NM

0C

300000

表面贴装

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

388 I/O

970 mV/1.02 V

0 C

+ 100 C

SMD/SMT

1

20.6 Mbit

PolarFire

POLARFIRE

100C

Commercial

0°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

784

1.05 V

12.7 Gb/s

300000

21094400

MPF500T-1FCG784I
MPF500T-1FCG784I
Microchip Technology 数据表

505 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF500T

0.97V ~ 1.08V

1.05 V

481000

33792000

MPF200TS-FCSG325I
MPF200TS-FCSG325I
Microchip Technology 数据表

2311 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

170

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF200TS

0.97V ~ 1.08V

1.05 V

192000

13619200

MPF300TS-1FCG784I
MPF300TS-1FCG784I
Microchip Technology 数据表

629 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

388 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

MPF300TS

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

MPF300TLS-FCG484I
MPF300TLS-FCG484I
Microchip Technology 数据表

926 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

MPF300TLS

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

MPF300T-FCVG484E
MPF300T-FCVG484E
Microchip Technology 数据表

2771 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

1

20.6 Mbit

PolarFire

1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

284 I/O

0.97 V

0 C

+ 100 C

SMD/SMT

0°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

300000

21094400

4 Transceiver

MPF100T-1FCSG325E
MPF100T-1FCSG325E
Microchip Technology 数据表

2426 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

1

PolarFire

1.03 V/1.08 V

170

Tray

MPF100

0°C ~ 100°C (TJ)

Tray

MPF100T

0.97V ~ 1.08V

109000

7782400

MPF500TS-FCG784I
MPF500TS-FCG784I
Microchip Technology 数据表

948 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

388

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF500TS

0.97V ~ 1.08V

1.05 V

481000

33792000

MPF200T-1FCSG325I
MPF200T-1FCSG325I
Microchip Technology 数据表

2259 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

This product may require additional documentation to export from the United States.

Details

192000 LE

170 I/O

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

Tray

MPF200

活跃

-40°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1.05 V

192000

13619200

MPF200TLS-FCG784I
MPF200TLS-FCG784I
Microchip Technology 数据表

2851 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

364

Tray

MPF200

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF200TLS

0.97V ~ 1.08V

1.05 V

192000

13619200

MPF200T-1FCVG484I
MPF200T-1FCVG484I
Microchip Technology 数据表

2811 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

Details

192000 LE

284 I/O

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

Tray

MPF200

活跃

-40°C ~ 100°C (TJ)

Tray

MPF200T

0.97V ~ 1.08V

1.05 V

192000

13619200

MPF300T-1FCG484E
MPF300T-1FCG484E
Microchip Technology 数据表

2441 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

SMD/SMT

1

20.6 Mbit

PolarFire

1.304431 oz

Tray

MPF300

活跃

1.03 V/1.08 V

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

970 mV/1.02 V

0 C

+ 100 C

0°C ~ 100°C (TJ)

Tray

MPF300T

0.97V ~ 1.08V

1 V, 1.05 V

12.7 Gb/s

300000

21094400

8 Transceiver

MPF300TLS-FCG784I
MPF300TLS-FCG784I
Microchip Technology 数据表

2180 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

388 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

MPF300TLS

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

MPF300TS-FCG784I
MPF300TS-FCG784I
Microchip Technology 数据表

746 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

388 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

MPF300TS

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

MPF300TL-FCG484I
MPF300TL-FCG484I
Microchip Technology 数据表

632 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

This product may require additional documentation to export from the United States.

Details

300000 LE

244 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

MPF300TL

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

MPF200TS-FCG484I
MPF200TS-FCG484I
Microchip Technology 数据表

2006 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

YES

484-FCBGA (23x23)

484

微芯片技术

1.08 V

BGA,

网格排列

4

PLASTIC/EPOXY

-40 °C

1 V

未说明

100 °C

MPF200TS-FCG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.82

This product may require additional documentation to export from the United States.

Details

192000 LE

284 I/O

0.97 V

- 40 C

+ 100 C

SMD/SMT

1

PolarFire

0.667354 oz

Tray

MPF200

活跃

-40°C ~ 100°C (TJ)

Tray

MPF200TS

CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL

0.97V ~ 1.08V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B484

1.05 V

INDUSTRIAL

12.5 Gb/s

2.87 mm

现场可编程门阵列

192000

13619200

4 Transceiver

23 mm

23 mm

MPF100T-1FCG484I
MPF100T-1FCG484I
Microchip Technology 数据表

2231 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

1

PolarFire

1.03 V/1.08 V

244

Tray

MPF100

-40°C ~ 100°C (TJ)

Tray

MPF100T

0.97V ~ 1.08V

109000

7782400

MPF100TS-FCVG484I
MPF100TS-FCVG484I
Microchip Technology 数据表

2210 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

1.03 V/1.08 V

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

1

PolarFire

284

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TS

0.97V ~ 1.08V

109000

7782400

MPF500TL-FCG1152I
MPF500TL-FCG1152I
Microchip Technology 数据表

879 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

584

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF500TL

0.97V ~ 1.08V

1.05 V

481000

33792000

MPF500TLS-FCG1152I
MPF500TLS-FCG1152I
Microchip Technology 数据表

868 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

970 mV/1.02 V

SMD/SMT

1

PolarFire

1.03 V/1.08 V

584

Tray

MPF500

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

MPF500TLS

0.97V ~ 1.08V

1.05 V

481000

33792000

M2GL010TS-1FG484
M2GL010TS-1FG484
Microchip Technology 数据表

28 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

M2GL010TS-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

OTHER

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

M2GL010-1TQG144I
M2GL010-1TQG144I
Microchip Technology 数据表

55 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

M2GL010-1TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

60

IGLOO2

0.711955 oz

1.26 V

Tray

M2GL010

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

1.2 V

-

1.6 mm

现场可编程门阵列

12084

933888

-

20 mm

20 mm

M2GL090T-1FCSG325I
M2GL090T-1FCSG325I
Microchip Technology 数据表

2257 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

MICROSEMI CORP

5.8

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

M2GL090T-1FCSG325I

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

M2GL050T-1FG484
M2GL050T-1FG484
Microchip Technology 数据表

2971 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA484,22X22,40

This product may require additional documentation to export from the United States.

N

60

IGLOO2

267

Tray

M2GL050

活跃

5.3

1.26 V

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL050T-1FG484

85 °C

1.14 V

20

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm