对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

子类别

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

最大电源电压

最小电源电压

工作电源电流

速度

内存大小

核心处理器

周边设备

连接方式

数据率

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

产品类别

总 RAM 位数

阀门数量

最高频率

筛选水平

逻辑块数(LABs)

速度等级

收发器数量

主要属性

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

等效门数

闪光大小

产品类别

高度

长度

宽度

辐射硬化

A3PN010-2QNG48
A3PN010-2QNG48
Microchip 数据表

12 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

微芯片技术

1.5 V

30

1.5000 V

1.425 V

1.575 V

34

Tray

A3PN010

活跃

1.425 V

A3PN010-2QNG48

活跃

MICROSEMI CORP

HQCCN,

5.26

3

70 °C

-20 °C

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.575 V

-20 to 70 °C

ProASIC3 nano

8542.39.00.01

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

OTHER

260 CLBS, 10000 GATES

现场可编程门阵列

10000

2

260

10000

6 mm

6 mm

A3P1000-1PQ208
A3P1000-1PQ208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

Tray

A3P1000

Obsolete

1.425 V

A3P1000-1PQ208

Obsolete

MICROSEMI CORP

FQFP,

5.24

350 MHz

3

85 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

154

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

1000000

28 mm

28 mm

A40MX04-1PL44I
A40MX04-1PL44I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

微芯片技术

3.6 V

3.3 V

30

34

Tray

A40MX04

Obsolete

3 V

A40MX04-1PL44I

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.23

48 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

44

S-PQCC-J44

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

16.5862 mm

16.5862 mm

A54SX16-CQ256B
A54SX16-CQ256B
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

3.3 V

20

2.97 V

Military grade

A54SX16-CQ256B

Obsolete

MICROSEMI CORP

CERAMIC, QFP-256

5.31

205 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK256,3SQ,20

SQUARE

FLATPACK

3.63 V

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

24000 SYSTEM GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

S-CQFP-F256

172

不合格

3.3,5 V

MILITARY

172

1452 CLBS, 16000 GATES

3.06 mm

现场可编程门阵列

MIL-STD-883 Class B

1 ns

1452

1452

16000

36 mm

36 mm

AGL030V5-QNG48
AGL030V5-QNG48
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

微芯片技术

活跃

1.425 V

AGL030V5-QNG48

活跃

MICROSEMI CORP

HQCCN,

5.23

3

85 °C

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.575 V

1.5 V

未说明

34

Tray

AGL030

0°C ~ 70°C (TA)

IGLOO

8542.39.00.01

1.425V ~ 1.575V

QUAD

无铅

未说明

compliant

S-XQCC-N48

不合格

OTHER

768 CLBS, 30000 GATES

现场可编程门阵列

768

30000

STD

768

30000

A40MX04-1PL84I
A40MX04-1PL84I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

微芯片技术

3.6 V

3.3 V

30

69

Tray

A40MX04

Obsolete

3 V

A40MX04-1PL84I

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.23

48 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

29.3116 mm

29.3116 mm

A42MX09-TQG176
A42MX09-TQG176
Microchip 数据表

2044 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

176-LQFP

YES

176-TQFP (24x24)

176

微芯片技术

3.3, 5 V

104

Tray

A42MX09

活跃

3 V

A42MX09-TQG176

活跃

MICROSEMI CORP

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

1.57

117 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

40

0 to 70 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

COMMERCIAL

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

STD

2.5 ns

684

14000

24 mm

24 mm

A40MX04-2VQ80I
A40MX04-2VQ80I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

80-TQFP

YES

80-VQFP (14x14)

80

微芯片技术

3.6 V

3.3 V

30

69

Tray

A40MX04

Obsolete

3 V

A40MX04-2VQ80I

Obsolete

MICROSEMI CORP

QFP

TQFP,

5.26

101 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

80

S-PQFP-G80

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2 ns

547

6000

14 mm

14 mm

A42MX16-PQG208
A42MX16-PQG208
Microchip 数据表

2034 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

Tray

A42MX16

活跃

3 V

A42MX16-PQG208

活跃

MICROSEMI CORP

FQFP,

5.29

94 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

40

140

0°C ~ 70°C (TA)

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

28 mm

28 mm

A42MX36-PQ240I
A42MX36-PQ240I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

YES

240

240

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

202

Compliant

3 V

A42MX36-PQ240I

Obsolete

MICROSEMI CORP

QFP

PLASTIC, QFP-240

5.79

73 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP240,1.3SQ,20

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

240

S-PQFP-G240

202

不合格

5 V

3.3,3.3/5,5 V

INDUSTRIAL

5.5 V

3 V

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

131 MHz

1184

1822

2.7 ns

2438

2414

54000

3.4 mm

32.1 mm

32.1 mm

A54SX08-TQG144
A54SX08-TQG144
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

144

40

3.3 V

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

SQUARE

LFQFP

PLASTIC/EPOXY

70 °C

3

240 MHz

5.3

LFQFP,

MICROSEMI CORP

Obsolete

A54SX08-TQG144

3 V

e3

哑光锡

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

COMMERCIAL

768 CLBS, 8000 GATES

1.6 mm

现场可编程门阵列

0.9 ns

768

8000

20 mm

20 mm

APA075-TQ100I
APA075-TQ100I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

Obsolete

APA075-TQ100I

66

Tray

APA075

Obsolete

2.3 V

2.7 V

2.5 V

未说明

FLATPACK, LOW PROFILE, FINE PITCH

SQUARE

QFP100,.63SQ,20

LFQFP

PLASTIC/EPOXY

-40 °C

85 °C

3

180 MHz

5.31

0.50 MM PITCH, TQFP-100

MICROSEMI CORP

-40°C ~ 85°C (TA)

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

未说明

0.5 mm

unknown

S-PQFP-G100

66

不合格

2.5,2.5/3.3 V

INDUSTRIAL

66

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

3072

75000

14 mm

14 mm

A3P125-VQG100
A3P125-VQG100
Microchip 数据表

93 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

1.575 V

FLATPACK, THIN PROFILE, FINE PITCH

SQUARE

TFQFP

PLASTIC/EPOXY

85 °C

3

微芯片技术

350 MHz

0.73

TFQFP,

MICROSEMI CORP

活跃

A3P125-VQG100

1.5000 V

1.425 V

1.575 V

1500 LE

36864 bit

71 I/O

+ 85 C

0.017637 oz

0 C

90

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

Tray

A3P125

活跃

1.425 V

40

1.5 V

0 to 70 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

2 mA

-

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

125000

STD

-

3072

125000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

A3P060-VQG100
A3P060-VQG100
Microchip 数据表

940 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

0.73

350 MHz

3

85 °C

微芯片技术

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

40

700 LE

18432 bit

71 I/O

+ 85 C

0.017637 oz

0 C

90

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

Tray

A3P060

活跃

1.425 V

A3P060-VQG100

活跃

MICROSEMI CORP

TFQFP,

0°C ~ 85°C (TJ)

Tray

A3P060

e3

Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

2 mA

-

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

18432

60000

STD

-

1536

60000

FPGA - Field Programmable Gate Array

1 mm

14 mm

14 mm

A3P400-PQ208I
A3P400-PQ208I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

30

151

Tray

A3P400

Obsolete

1.425 V

A3P400-PQ208I

Obsolete

MICROSEMI CORP

FQFP,

5.23

350 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

A40MX04-1VQ80
A40MX04-1VQ80
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

80-TQFP

YES

80-VQFP (14x14)

80

微芯片技术

30

69

Tray

A40MX04

Obsolete

3 V

A40MX04-1VQ80

Obsolete

MICROSEMI CORP

QFP

TQFP,

5.25

48 MHz

3

70 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

3.6 V

3.3 V

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

80

S-PQFP-G80

不合格

COMMERCIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2.3 ns

547

6000

14 mm

14 mm

A42MX16-PL84M
A42MX16-PL84M
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

微芯片技术

3.6 V

3 V

3.3 V

30

72

Tray

A42MX16

Obsolete

A42MX16-PL84M

Obsolete

MICROSEMI CORP

LCC

QCCJ,

5.23

94 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

MILITARY

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

29.3116 mm

29.3116 mm

APA300-PQ208
APA300-PQ208
Microchip 数据表

66 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

30

158

Tray

APA300

Obsolete

2.3 V

APA300-PQ208

Obsolete

MICROSEMI CORP

0.50 MM PITCH, PLASTIC, QFP-208

5.3

180 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

2.7 V

2.5 V

0°C ~ 70°C (TA)

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

COMMERCIAL

158

300000 GATES

4.1 mm

现场可编程门阵列

73728

300000

8192

300000

28 mm

28 mm

M1A3P1000L-1PQG208I
M1A3P1000L-1PQG208I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

1.575 V

1.2 V

40

1.14 V

M1A3P1000L-1PQG208I

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.25

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

24576

24576

1000000

28 mm

28 mm

M1A3PE3000-2PQ208I
M1A3PE3000-2PQ208I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

1.575 V

1.5 V

30

147

Tray

M1A3PE3000

Obsolete

1.425 V

M1A3PE3000-2PQ208I

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.61

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

-40°C ~ 100°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

M1AGL250V2-VQG100I
M1AGL250V2-VQG100I
Microchip 数据表

17 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

100-TQFP

YES

100

100-VQFP (14x14)

100

微芯片技术

活跃

MICROSEMI CORP

TFQFP,

1.2, 1.5 V

1.14 V

1.575 V

8542390000/8542390000/8542390000/8542390000/8542390000

68

Compliant

Tray

M1AGL250

活跃

1.14 V

1.2 V

40

1.44

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

M1AGL250V2-VQG100I

-40 to 85 °C

IGLOO

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

1.575 V

1.14 V

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

M2GL005-TQ144
M2GL005-TQ144
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

M2GL005-TQ144

Obsolete

MICROSEMI CORP

20 X 20 MM, 0.50 MM PITCH, TQFP-144

5.57

3

85 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

20

84

Tray

Obsolete

1.14 V

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

M2S005-TQ144I
M2S005-TQ144I
Microchip 数据表

2680 In Stock

-

最小起订量: 1

最小包装量: 1

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

1.14 V

M2S005-TQ144I

Obsolete

MICROSEMI CORP

TQFP-144

5.88

3

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

30

84

Tray

Obsolete

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

鸥翼

240

0.5 mm

not_compliant

S-PQFP-G144

84

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

84

1.6 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

128KB

20 mm

20 mm

M1A3PE3000-2PQ208
M1A3PE3000-2PQ208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

30

147

Tray

M1A3PE3000

Obsolete

1.425 V

M1A3PE3000-2PQ208

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.61

350 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

M7A3P1000-PQ208I
M7A3P1000-PQ208I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

Transferred

ACTEL CORP

0.50 MM PITCH, PLASTIC, QFP-208

5.86

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

154

Tray

M7A3P1000

Obsolete

Compliant

1.425 V

M7A3P1000-PQ208I

-40°C ~ 100°C (TJ)

ProASIC3

85 °C

-40 °C

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

231 MHz

24576

1000000

3.4 mm

28 mm

28 mm