N/A

-

表面贴装

CQFP

YES

208-CQFP (75x75)

208

微芯片技术

125 °C

无

A54SX32-1CQ208B

240 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.23

Military grade

SMD/SMT

240 MHz

有

1

Actel

0.372740 oz

This product may require additional documentation to export from the United States.

N

174 I/O

3 V

- 55 C

+ 125 C

3.6 V

Tray

A54SX32

活跃

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55 °C

3.3 V

20

-55°C ~ 125°C (TJ)

A54SX32

e0

3A001.A.2.C

锡铅

48000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

246

不合格

3.3,5 V

MILITARY

246

2880 CLBS, 32000 GATES

3.06 mm

现场可编程门阵列

48000

2880

MIL-STD-883 Class B

0.9 ns

2880

2880

32000

2.8 mm

29.21 mm

29.21 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

208

208-CQFP (75x75)

微芯片技术

SMD/SMT

5 MHz

有

1

Actel

Tray

APA600

活跃

2.5 V

This product may require additional documentation to export from the United States.

N

158 I/O

2.5 V

- 55 C

+ 125 C

-55°C ~ 125°C (TJ)

APA600

125 °C

-55 °C

2.5 V

15.8 kB

129024

600000

5 MHz

21504

无

N/A

-

表面贴装

BGA-456

YES

456

456-PBGA (35x35)

456

微芯片技术

BGA456,26X26,50

-40 °C

2.5 V

30

85 °C

无

APA1000-BG456I

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA1000

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

-40 to 85 °C

Tray

APA1000

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B456

356

不合格

2.5,2.5/3.3 V

INDUSTRIAL

356

1000000 GATES

2.54 mm

现场可编程门阵列

202752

1000000

STD

56320

1000000

1.73 mm

35 mm

35 mm

N/A

-

表面贴装

CQFP-84

YES

84-CQFP (42x42)

84

微芯片技术

QFF

SQUARE

活跃

MICROSEMI CORP

5.24

Military grade

N

62 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

1

Actel

This product may require additional documentation to export from the United States.

Tray

A54SX32

活跃

2.75 V

QFF,

FLATPACK

CERAMIC, METAL-SEALED COFIRED

-55 °C

2.5 V

20

125 °C

无

A54SX32A-1CQ84B

250 MHz

-55°C ~ 125°C (TJ)

A54SX32A

e0

3A001.A.2.C

锡铅

IT CAN ALSO OPERATE WITH 3.3V AND 5V

8542.39.00.01

CMOS

2.5 V

QUAD

FLAT

225

0.635 mm

compliant

S-CQFP-F84

不合格

MILITARY

1800 CLBS, 48000 GATES

2.4 mm

现场可编程门阵列

48000

2880

MIL-STD-883 Class B

1.2 ns

1800

48000

16.51 mm

16.51 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

Details

356 I/O

2.3 V

- 55 C

+ 125 C

-55°C ~ 125°C (TC)

Tray

APA600

125 °C

-55 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

21504

2.7 V

2.3 V

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.24

Details

147 I/O

3 V

0 C

+ 70 C

SMD/SMT

320 MHz

有

40

Actel

Tray

A54SX16

活跃

3.6 V

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

3.3 V

40

70 °C

有

A54SX16P-2TQG176

320 MHz

LFQFP

0°C ~ 70°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3,3.3/5 V

COMMERCIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

BGA-272

YES

272

272-PBGA (27x27)

272

微芯片技术

BGA

N

202 I/O

3 V

0 C

+ 70 C

SMD/SMT

151 MHz

有

40

Actel

5.25 V

Tray

A42MX36

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

3.3 V

30

70 °C

无

A42MX36-1BG272

83 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.19

0°C ~ 70°C (TA)

Tray

A42MX36

e0

锡铅银

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

225

1.27 mm

compliant

S-PBGA-B272

不合格

COMMERCIAL

320 B

2438 CLBS, 54000 GATES

2.5 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

5.25 V

3 V

54000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

186 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.625 V

Tray

APA150

活跃

-40°C ~ 125°C (TJ)

Tray

APA150

2.5 V

36864

150000

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

158 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

Tray

APA300

活跃

2.7 V

-55°C ~ 125°C (TC)

Tray

APA300

2.5 V

73728

300000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

CQFP-208

208-CQFP (75x75)

微芯片技术

This product may require additional documentation to export from the United States.

N

171 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

217 MHz

有

1

Actel

2.75 V

Tray

A54SX72

活跃

-55°C ~ 125°C (TJ)

A54SX72A

2.5 V

108000

6036

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

有

A54SX32A-2FGG256I

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

313 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

40

85 °C

-40°C ~ 85°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5,2.5/5 V

INDUSTRIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

AX1000-2FG484

870 MHz

BGA

0°C ~ 70°C (TA)

Tray

AX1000

e0

锡铅

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

418 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

无

AX1000-1FG676

763 MHz

BGA

0°C ~ 70°C (TA)

Tray

AX1000

e0

锡铅

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

763 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

微芯片技术

无

APA300-BG456M

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

290 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA300

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

-55 °C

2.5 V

30

125 °C

-55°C ~ 125°C (TC)

Tray

APA300

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B456

290

不合格

2.5,2.5/3.3 V

MILITARY

290

300000 GATES

2.54 mm

现场可编程门阵列

73728

300000

8192

300000

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA600

活跃

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

- 55 C

+ 125 C

-55°C ~ 125°C (TC)

Tray

APA600

125 °C

-55 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

21504

2.7 V

2.3 V

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

微芯片技术

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

171 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

250 MHz

有

1

Actel

2.75 V

Tray

A54SX72

活跃

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

-55 °C

2.5 V

20

125 °C

无

A54SX72A-1CQ208M

-55°C ~ 125°C (TC)

A54SX72A

e0

3A001.A.2.C

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

171

不合格

2.5,3.3/5 V

MILITARY

171

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

29.21 mm

29.21 mm

N/A

-

表面贴装

CQFP

YES

208-CQFP (75x75)

208

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.23

N

174 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

有

1

Actel

0.372740 oz

Tray

A54SX32

活跃

3.6 V

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

3.3 V

20

70 °C

无

A54SX32-1CQ208

240 MHz

QFF

0°C ~ 70°C (TA)

A54SX32

e0

锡铅

48000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F208

246

不合格

3.3,5 V

COMMERCIAL

246

2880 CLBS, 32000 GATES

3.06 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

32000

2.8 mm

29.21 mm

29.21 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

-40C

有

12288

表面贴装

2.7 V

Tray

APA450

活跃

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

PROASICPLUS

85C

Industrial

FBGA

450000

-40C to 85C

186

450000

0.22UM

2.7(V)

2.5(V)

无

2.3(V)

-40°C ~ 85°C (TA)

Tray

APA450

85 °C

-40 °C

2.5 V

180(MHz)

13.5 kB

110592

450000

180 MHz

STD

12288

2.7 V

2.3 V

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

40

125 °C

有

APA300-FGG256M

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

Tray

APA300

活跃

2.7 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-55 °C

2.5 V

-55°C ~ 125°C (TC)

Tray

APA300

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

186

不合格

2.5,2.5/3.3 V

MILITARY

186

300000 GATES

1.8 mm

现场可编程门阵列

73728

300000

8192

300000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

CQFP-208

208-CQFP (75x75)

微芯片技术

This product may require additional documentation to export from the United States.

N

171 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

217 MHz

有

1

Actel

Tray

A54SX72

活跃

2.75 V

-55°C ~ 125°C (TC)

A54SX72A

2.5 V

108000

6036

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

649 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

AX1000-FG484

649 MHz

BGA

0°C ~ 70°C (TA)

Tray

AX1000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

649 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

20.3 kB

990 ps

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

12096

12096

0.99 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

无

APA150-FG256

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

186 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.7 V

Tray

APA150

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

0°C ~ 70°C (TA)

Tray

APA150

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

186

不合格

2.5,2.5/3.3 V

COMMERCIAL

186

150000 GATES

1.8 mm

现场可编程门阵列

36864

150000

STD

6144

150000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

40

70 °C

有

A54SX72A-2PQG208

294 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.26

Details

171 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

294 MHz

有

24

Actel

2.5000 V

2.25 V

2.75 V

2.75 V

Tray

A54SX72

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

0 to 70 °C

Tray

A54SX72A

e3

哑光锡

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

171

不合格

2.5,3.3/5 V

COMMERCIAL

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

108000

6036

2

1.1 ns

6036

6036

108000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

BGA-456

YES

456-PBGA (35x35)

456

微芯片技术

无

APA1000-BG456M

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.54

This product may require additional documentation to export from the United States.

N

356 I/O

2.3 V

- 55 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

2.7 V

Tray

APA1000

活跃

BGA, BGA456,26X26,50

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

-55 °C

2.5 V

未说明

125 °C

-55°C ~ 125°C (TC)

Tray

APA1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

未说明

1.27 mm

unknown

S-PBGA-B456

356

不合格

2.5,2.5/3.3 V

MILITARY

356

1000000 GATES

2.54 mm

现场可编程门阵列

202752

1000000

56320

1000000

1.73 mm

35 mm

35 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Tray

APA450

活跃

2.7 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

40

85 °C

有

APA450-PQG208I

180 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

-

158 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

108 kbit

108 kbit

180 MHz

有

-

24

110592 bit

ProASICPLUS

2.5000 V

2.3 V

2.7 V

-40 to 85 °C

Tray

APA450

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

180 MHz

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

INDUSTRIAL

13.5 kB

13.5 kB

5 mA

158

450000 GATES

4.1 mm

现场可编程门阵列

110592

450000

180 MHz

STD

12288

12288

2.7 V

2.3 V

450000

3.4 mm

28 mm

28 mm

无

无铅