N/A

-

Compliant

N/A

-

N/A

-

N/A

-

N/A

-

N/A

-

YES

180

CHIP CARRIER, VERY THIN PROFILE

3

UNSPECIFIED

LGA180,20X20,20

-40 °C

1.5 V

30

1.425 V

85 °C

有

AFS090-QNG180I

350 MHz

VBCC

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.31

VBCC, LGA180,20X20,20

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BUTT

260

0.5 mm

compliant

S-XBCC-B180

60

不合格

1.5,3.3 V

INDUSTRIAL

60

2304 CLBS, 90000 GATES

0.8 mm

现场可编程门阵列

2304

2304

90000

10 mm

10 mm

N/A

-

N/A

-

YES

100

PLASTIC/EPOXY

TQFP100,.63SQ

3.3 V

40

3 V

70 °C

有

A14V40A-VQG100C

100 MHz

TFQFP

SQUARE

Microsemi Corporation

生命周期结束

MICROSEMI CORP

3.6 V

5.32

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

e3

Matte Tin (Sn)

MAX 83 I/OS

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

83

不合格

3.3 V

COMMERCIAL

83

564 CLBS, 4000 GATES

1.2 mm

现场可编程门阵列

3.9 ns

564

564

4000

14 mm

14 mm

N/A

-

YES

100

PLASTIC/EPOXY

-40 °C

5 V

40

4.5 V

85 °C

有

A1425A-VQG100I

125 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.84

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

e3

哑光锡

MAX 83 I/OS

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

310 CLBS, 2500 GATES

1.2 mm

现场可编程门阵列

3 ns

310

2500

14 mm

14 mm

N/A

-

N/A

-

Polyvinylidene with Thermoplastic Elastomer (TPE)

Black

N/A

-

Surface

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

微芯片技术

KSD34115MA-SSAC

CE, CSA, UL

SSAC

15

72

Tube

A42MX16

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

94 MHz

QCCJ

SQUARE

Obsolete

MICROSEMI CORP

3.6 V

5.23

LCC

0°C ~ 70°C (TA)

MX

e0

0.250 in Flat Blade

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

120 VAC

24000

2.8 ns

1232

24000

Flasher

29.3116 mm

29.3116 mm

N/A

-

Surface

100-LQFP

100-TQFP (14x14)

微芯片技术

PTHF432A-SSAC

CE, CSA, cULus, UL

SSAC

32

81

Tray

A54SX08A

Obsolete

-40°C ~ 85°C (TA)

SX-A

0.250 in Flat Blade

2.25V ~ 5.25V

120 VAC

12000

768

Percentage Repeat Cycle

固态

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

活跃

56520 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

ABB控制

267

Tray

M2GL060

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

1.2 V

56520

1869824

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

1.5000 V

1.425 V

1.575 V

97

Tray

活跃

A3P600

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

A3P600-2FGG144I

350 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.33

-40 to 85 °C

ProASIC3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

2

13824

600000

13 mm

13 mm

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

1.5000 V

1.425 V

1.575 V

97

Tray

A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

A3P600-1FG144I

350 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

-40 to 85 °C

ProASIC3

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

13 mm

13 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

1.5000 V

1.425 V

1.575 V

71

Tray

AGL060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

未说明

1.425 V

85 °C

有

AGL060V5-VQG100

108 MHz

TFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.62

0 to 70 °C

IGLOO

e3

Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

14 mm

14 mm

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

0.5kg

微芯片技术

A54SX08A

Obsolete

1000V

(L x W x H) 35 x 209 x 98 mm

DC

1%

0 - 10Ω

DC

第一类

4 x AA battery

20A

Manufacturers standards (no certificate)

2V

Digital

113

Tray

-40°C ~ 125°C (TA)

SX-A

Profitest PV Sun

2.25V ~ 5.25V

12000

768

98mm

35mm

209mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

M2GL050

活跃

Round

有

1x

straight

AWG27

Networks

RJ45 plug

Cable

RJ45 plug

1x

Yellow,Green

267

Compliant

Tray

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

1.14V ~ 2.625V

S/FTP

228.3 kB

56340

1869824

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

PEI-Genesis

147

M1A3PE3000

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

M1A3PE3000-1PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

Bulk

活跃

0°C ~ 85°C (TJ)

*

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

表面贴装

80

Compliant

57

70 °C

0 °C

57 MHz

5 V

5.25 V

4.75 V

3.8 ns

295

1200

295

1

147

无

N/A

-

表面贴装

81-WFBGA, CSBGA

81-CSP (5x5)

微芯片技术

活跃

52

Tray

AGLN020

-40°C ~ 100°C (TJ)

IGLOO nano

1.14V ~ 1.575V

520

20000

STD

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

微芯片技术

69

Tray

A40MX04

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX04-2PQ100I

101 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

2 ns

547

6000

20 mm

14 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

A3P400-1PQ208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

151

Tray

A3P400

Obsolete

Compliant

FQFP,

-40°C ~ 100°C (TJ)

ProASIC3

e0

3A001.A.7.B

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

272 MHz

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

6.8 kB

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

400000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

M2GL050

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

1.14 V

125 °C

有

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

10250T434H620

Cutler Hammer, Div of Eaton Co

267

Tray

-55°C ~ 125°C (TJ)

IGLOO2

3A001.A.2.C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

MILITARY

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm