N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

Other

0

无

None

Roller cam

None

81

Tray

A54SX16

Obsolete

Other

1

0

Metal

IP67

0°C ~ 70°C (TA)

SX

3V ~ 3.6V, 4.75V ~ 5.25V

24000

1452

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

2.25 V

85 °C

无

A54SX08A-2TQ100I

313 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.27

20

Transverse connector

81

Tray

A54SX08A

Obsolete

LFQFP, TQFP100,.63SQ

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

-40 °C

2.5 V

30

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,3.3/5 V

INDUSTRIAL

81

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

0.9 ns

768

768

12000

有

14 mm

14 mm

N/A

-

表面贴装

144-BQFP

144-PQFP (28x28)

微芯片技术

Transverse connector

95

Tray

Obsolete

17.5

-55°C ~ 125°C (TC)

42MX

3V ~ 3.6V, 4.75V ~ 5.25V

348

14000

有

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

115

Tray

AX250

Obsolete

Compliant

-55°C ~ 125°C (TA)

Axcelerator

1.425V ~ 1.575V

55296

250000

4224

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

微芯片技术

84

Tray

Obsolete

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

12084

933888

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

微芯片技术

84

Tray

活跃

-40°C ~ 125°C (TJ)

IGLOO2

1.14V ~ 2.625V

6060

719872

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE, FINE PITCH

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

169

Tray

M2GL005

活跃

1.26 V

1.14 V

5.28

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

LFBGA

M2GL005S-1VFG400

有

85 °C

30

1.2 V

BGA400,20X20,32

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

Obsolete

MICROSEMI CORP

1.575 V

5.25

154

Tray

M1A3P600

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P600-PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

110592

600000

13824

600000

28 mm

28 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

244

Tray

活跃

-40°C ~ 125°C (TJ)

PolarFire™

0.97V ~ 1.08V

192000

13946061

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

Tray

AGL030

活跃

1.425 V

AGL030V5-VQG100I

有

活跃

MICROSEMI CORP

TFQFP,

1.38

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

77

-40°C ~ 85°C (TA)

IGLOO

e3

Tin (Sn)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

14 mm

14 mm

N/A

-

YES

144

A54SX16P-1TQ144M

无

Obsolete

MICROSEMI CORP

LFQFP,

5.85

280 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

e0

3A001.A.2.C

锡铅

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

MILITARY

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

0.8 ns

1452

16000

20 mm

20 mm

N/A

-

YES

128

AGLP030V2-VQ128I

无

Obsolete

MICROSEMI CORP

14 X 14 MM, 1 MM HEIGHT, 0.4 MM PITCH, VQFP-128

5.32

160 MHz

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP128,.63SQ,16

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.425 V

1.5 V

未说明

8542.39.00.01

QUAD

鸥翼

未说明

0.4 mm

unknown

S-PQFP-G128

101

不合格

1.2/1.5 V

INDUSTRIAL

101

792 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

792

792

30000

14 mm

14 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

Tray

A54SX16

Obsolete

3 V

A54SX16P-2PQ208I

无

Obsolete

MICROSEMI CORP

FQFP,

5.24

320 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

175

-40°C ~ 85°C (TA)

SX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

16000

28 mm

28 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

40

113

Tray

A54SX32

活跃

3 V

A54SX32-1TQG144I

有

活跃

MICROSEMI CORP

LFQFP, QFP144,.87SQ,20

5.24

280 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

-40°C ~ 85°C (TA)

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3,5 V

INDUSTRIAL

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1

0.8 ns

2880

2880

32000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

3.3 V

40

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

81

Tray

A54SX16

活跃

3 V

A54SX16P-2VQG100

有

活跃

MICROSEMI CORP

TFQFP, TQFP100,.63SQ

5.24

320 MHz

3

70 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

0 to 70 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

COMMERCIAL

81

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

2

0.7 ns

1452

1452

16000

14 mm

14 mm

N/A

-

表面贴装

AGL030V2-VQG100T

有

活跃

MICROSEMI CORP

,

5.76

3

未说明

77

Compliant

e3

Tin (Sn)

70 °C

0 °C

8542.39.00.01

未说明

compliant

现场可编程门阵列

768

30000

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

30

81

Tray

A54SX08A

Obsolete

2.25 V

A54SX08A-1TQ100I

无

Obsolete

MICROSEMI CORP

1.40 MM HEIGHT, TQFP-100

5.26

278 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,3.3/5 V

INDUSTRIAL

81

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.1 ns

768

768

12000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

1.2, 1.5 V

1.14 V

1.575 V

77

Tray

AGL030

活跃

1.14 V

AGL030V2-VQG100

有

活跃

MICROSEMI CORP

TFQFP,

1.39

108 MHz

3

85 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.2 V

未说明

0 to 70 °C

IGLOO

e3

Tin (Sn)

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

14 mm

14 mm

N/A

-

YES

208

A54SX08A-2PQ208

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.31

313 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

2.75 V

2.5 V

30

2.25 V

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

130

不合格

2.5,3.3/5 V

COMMERCIAL

130

768 CLBS, 12000 GATES

4.1 mm

现场可编程门阵列

0.9 ns

768

768

12000

28 mm

28 mm

N/A

-

YES

176

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

40

MICROSEMI CORP

LFQFP,

5.59

280 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

A54SX32-1TQG176

有

Obsolete

e3

哑光锡

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

COMMERCIAL

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

0.8 ns

2880

32000

24 mm

24 mm

N/A

-

YES

68

AGL015V5-QNG68I

有

Obsolete

MICROSEMI CORP

HVQCCN,

5.31

100 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.5 V

未说明

1.425 V

8542.39.00.01

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

YES

256

A54SX32-1CQ256

无

Obsolete

MICROSEMI CORP

CERAMIC, QFP-256

5.24

240 MHz

70 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK256,3SQ,20

SQUARE

FLATPACK

3.63 V

3.3 V

20

2.97 V

e0

锡铅

48000 SYSTEM GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F256

246

不合格

3.3,5 V

COMMERCIAL

246

2880 CLBS, 32000 GATES

3.06 mm

现场可编程门阵列

0.9 ns

2880

2880

32000

36 mm

36 mm

N/A

-

YES

68

A3P015-QNG68I

有

Obsolete

MICROSEMI CORP

HVQCCN,

5.25

3

100 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.425 V

1.5 V

30

8542.39.00.01

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

YES

68

A3P015-2QNG68

有

Obsolete

MICROSEMI CORP

HVQCCN,

5.25

350 MHz

3

85 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.425 V

1.5 V

30

8542.39.00.01

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

COMMERCIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

表面贴装

64-LQFP

YES

64-TQFP (10x10)

64

微芯片技术

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

5.32

46

Tray

EX128

Obsolete

TQFP-64

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

30

2.3 V

85 °C

无

EX128-TQ64I

250 MHz

LFQFP

-40°C ~ 85°C (TA)

EX

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G64

INDUSTRIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

1 ns

6000

10 mm

10 mm