N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P1000-2FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

0 to 70 °C

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

60

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS600-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

-40°C ~ 100°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

1.0989 GHz

S-PBGA-B484

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

SMD/SMT

763 MHz

微芯片技术

有

40

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-55 °C

1.5 V

40

125 °C

有

AX1000-1FGG676M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

Details

418 I/O

1.425 V

- 55 C

+ 125 C

-55°C ~ 125°C (TA)

Tray

AX1000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

20.3 kB

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

MIL-STD-883 Class B

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

A3P250

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P250-2VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

68 I/O

0 to 70 °C

Tray

A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PE1500-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

1282.05 MHz

微芯片技术

有

60

Fusion

0.014110 oz

Tray

M1AFS600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS600-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

172 I/O

1.425 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

160

IGLOOe

0.014110 oz

Tray

M1AGL250

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AGL250V5-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

3000 LE

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

有

0°C ~ 70°C (TA)

Tray

M1AGL250V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

4.5 kB

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

1.575 V

1.425 V

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

- 40 C

+ 100 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3

0.356867 oz

1.575 V

Tray

A3P060

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P060-VQ100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.51

N

700 LE

71 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

A3P060

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

-

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

STD

-

1536

60000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

763 MHz

微芯片技术

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.5 V

40

125 °C

有

AX1000-1FGG484M

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

- 55 C

+ 125 C

-55°C ~ 125°C (TA)

Tray

AX1000

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

763 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

MIL-STD-883 Class B

12096

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

1.575 V

Tray

M1A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

-40 to 85 °C

Tray

M1A3P1000

1.5 V

147456

1000000

1

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

0°C ~ 85°C (TJ)

Tray

A3P600

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

231 MHz

STD

13824

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

SMD/SMT

1282.05 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS600-1FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

N

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

M7AFS600

85 °C

-40 °C

1.5 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

0 C

微芯片技术

1.425 V

97 I/O

N

This product may require additional documentation to export from the United States.

1.5000 V

1.575 V

Tray

M7A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

M7A3P1000-2FG144

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

0.014110 oz

ProASIC3

160

有

310 MHz

SMD/SMT

+ 70 C

0 to 70 °C

Tray

M7A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

310 MHz

2

24576

24576

1.575 V

1.425 V

1000000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

160

0.014110 oz

ProASIC3

Tray

M1A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P1000-2FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3P250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P250-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.22

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

0 to 70 °C

Tray

A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

Tray

M1A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P1000-FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

SMD/SMT

有

微芯片技术

160

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

5.26

MICROSEMI CORP

活跃

SQUARE

LBGA

108 MHz

M1AGL600V5-FG144I

无

100 °C

30

1.5 V

-40 °C

PLASTIC/EPOXY

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

M1AGL600V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.425 V

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

- 40 C

+ 85 C

SMD/SMT

微芯片技术

有

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL250

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

M1AGL250V2-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

3000 LE

97 I/O

1.14 V

-40 to 85 °C

Tray

M1AGL250V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

4.5 kB

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

1.575 V

1.14 V

250000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE3000-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

A3PE3000

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

77 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P030

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P030-1VQG100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

330 LE

-40 to 85 °C

Tray

A3P030

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

-

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

1

-

768

30000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS600-2FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

0°C ~ 85°C (TJ)

Tray

M1AFS600

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

This product may require additional documentation to export from the United States.

Details

3000 LE

68 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

310 MHz

有

-

90

36864 bit

ProASIC3

0.673915 oz

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P250-2VQG100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

-40°C ~ 100°C (TJ)

Tray

A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

30 mA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

2

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE1500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

M1A3PE1500-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5/3.3 V

COMMERCIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

M7AFS600-1FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

0°C ~ 70°C (TA)

Tray

M7AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

1

600000

1.2 mm

17 mm

17 mm