N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

PEI-Genesis

BGA484,22X22,40

1.2 V

1.14 V

85 °C

有

M2GL025T-1FGG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

Bulk

活跃

267

Compliant

M2GL025

0°C ~ 85°C (TJ)

*

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

OTHER

138 kB

267

2.44 mm

现场可编程门阵列

27696

1130496

27696

23 mm

23 mm

N/A

-

表面贴装

4-SMD, No Lead

Suntsu Electronics, Inc.

Bulk

活跃

-40°C ~ 85°C

SXT224

0.098 L x 0.079 W (2.50mm x 2.00mm)

兆赫晶体

27.12 MHz

±50ppm

80 Ohms

8pF

Fundamental

±30ppm

0.026 (0.65mm)

N/A

-

面板安装

Flange

Aluminum

Thermoplastic

-

Amphenol Aerospace Operations

Gold

-

Bulk

Metal

TVP00RW

活跃

Copper Alloy

-65°C ~ 175°C

MIL-DTL-38999 Series III, Tri-Start™ TV

Crimp

Receptacle, Male Pins

43

橄榄色

Aviation, Marine, Military

Threaded

-

E

Shielded

抗环境干扰

橄榄色镉

25-43

-

-

-

50.0µin (1.27µm)

-

N/A

-

Free Hanging (In-Line)

68-VFQFN Exposed Pad

YES

-

Thermoplastic

68-QFN (8x8)

68

NLDFT

活跃

Silver

49

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

ITT Cannon, LLC

3

UNSPECIFIED

-20 °C

1.5 V

未说明

1.425 V

70 °C

有

AGLN015V5-QNG68

HVQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.51

1000VAC, 1500VDC

Bulk

Plastic

-30°C ~ 125°C

Powerlock

固定螺钉

Line Drain, Female Sockets

1

-

8542.39.00.01

卡口锁

400A

CMOS

1.425V ~ 1.575V

QUAD

Keyed

无铅

-

未说明

IP67 - Dust Tight, Waterproof

0.4 mm

compliant

-

-

S-XQCC-N68

不合格

OTHER

-

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

STD

384

15000

Hand Grip, Locking Pin

8 mm

8 mm

-

N/A

-

PEI-Genesis

Bulk

活跃

*

N/A

-

PEI-Genesis

Bulk

活跃

*

N/A

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-20 °C

PEI-Genesis

30

70 °C

有

A3PN030-Z2QNG68

HVQCCN

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.8

1.5 V

1.425 V

1.575 V

Bulk

活跃

49

A3PN030

-20°C ~ 85°C (TJ)

*

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

OTHER

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

768

30000

8 mm

8 mm

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

活跃

97

A3P250

5.23

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

Analog Devices Inc.

SQUARE

LBGA

350 MHz

A3P250-1FG144T

无

125 °C

1.425 V

20

1.5 V

-40 °C

BGA144,12X12,40

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

LBGA, BGA144,12X12,40

Automotive grade

Tray

-40°C ~ 125°C (TA)

-

e0

锡铅银

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

AUTOMOTIVE

97

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

AEC-Q100

1

6144

6144

250000

13 mm

13 mm

N/A

-

表面贴装

81-WFBGA, CSBGA

81-CSP (5x5)

Infineon Technologies

Box

Obsolete

60

AGLN060

-20°C ~ 85°C (TJ)

-

-

1.14V ~ 1.575V

-

-

Board(s)

1536

18432

60000

STD

-

-

-

N/A

-

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

Glenair

未说明

1.425 V

100 °C

无

AGL600V5-CS281I

108 MHz

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

零售包装

活跃

215

AGL600

-40°C ~ 85°C (TA)

*

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B281

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

10 mm

10 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Obsolete

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

微芯片技术

1.2 V

30

1.14 V

70 °C

无

M1A3PE3000L-PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

147

Tray

M1A3PE3000L

0°C ~ 85°C (TJ)

*

e0

活跃

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

面板安装

196-TFBGA, CSBGA

YES

Flange

Circular

Composite

196-CSP (8x8)

Plastic

196

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

微芯片技术

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

1.14 V

100 °C

有

AGL400V2-CSG196I

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.28

--

16

143

Tray

AGL400

活跃

-65°C ~ 200°C

Bulk

MIL-DTL-38999 Series III, ACT

活跃

--

插座外壳

用于公引脚

16

8542.39.00.01

Threaded

Crimp

CMOS

1.14V ~ 1.575V

BOTTOM

A

BALL

Shielded

未说明

抗环境干扰

0.5 mm

compliant

化学镍

21-16

S-PBGA-B196

不合格

Silver

INDUSTRIAL

不包括触点

G

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

--

55296

400000

STD

9216

400000

--

8 mm

8 mm

--

N/A

-

面板安装

Flange

Circular

Composite

Plastic

--

16

-65°C ~ 200°C

Bulk

MIL-DTL-38999 Series III, ACT

活跃

--

插座外壳

用于内螺纹插座

8

Threaded

Crimp

N (Normal)

Shielded

抗环境干扰

化学镍

17-8

Silver

不包括触点

E

--

--

--

N/A

-

面板安装

400-LFBGA

YES

Bulkhead - Front Side Nut

Circular

铝合金

400-VFBGA (17x17)

Plastic

400

PLASTIC/EPOXY

微芯片技术

BGA400,20X20,32

1.2 V

20

1.14 V

无

M2GL025-1VF400I

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

1.74

--

22D

207

Tray

M2GL025

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

-65°C ~ 175°C

Bulk

MIL-DTL-38999 Series III, DTS

活跃

--

插座外壳

用于内螺纹插座

55

8542.39.00.01

Threaded

现场可编程门阵列

Crimp

1.14V ~ 2.625V

BOTTOM

A

BALL

Shielded

240

抗环境干扰

0.8 mm

compliant

Chromate over Cadmium

17-35

S-PBGA-B400

207

不合格

橄榄色

1.2 V

不包括触点

--

207

1.51 mm

现场可编程门阵列

27696

--

1130496

1

27696

--

17 mm

17 mm

--

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

活跃

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

PLASTIC/EPOXY

微芯片技术

BGA1152,34X34,40

-55 °C

1.2 V

1.14 V

125 °C

有

M2GL150TS-1FCG1152M

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

Compliant

574

Tray

M2GL150

-55°C ~ 125°C (TJ)

IGLOO2

3A001.A.2.C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B1152

574

不合格

1.2 V

MILITARY

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

Molex

Bulk

093608

活跃

81

0°C ~ 70°C (TA)

*

2.25V ~ 5.25V

24000

1452

N/A

-

N/A

-

YES

208

GQFF

TPAK208,2.9SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

未说明

0.5 mm

compliant

未说明

S-CQFP-F208

173

不合格

MILITARY

173

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535 Class V

1.4 ns

2880

2880

48000

100k Rad(Si) V

29.21 mm

29.21 mm

N/A

-

YES

352

SQUARE

FLATPACK

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-352

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK352,2.9SQ,20

e0

9A515.E

锡铅

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

198

不合格

MILITARY

198

12096 CLBS, 1000000 GATES

2.89 mm

现场可编程门阵列

MIL-STD-883 Class B

0.93 ns

12096

1000000

48 mm

48 mm

N/A

-

活跃

MICROCHIP TECHNOLOGY INC

9A515.E

8542.39.00.01

compliant

现场可编程门阵列

N/A

-

YES

208

2.5 V

2.3 V

2.7 V

FLATPACK, FINE PITCH

SQUARE

有

活跃

MICROCHIP TECHNOLOGY INC

0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-208

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

30

S-PQFP-G208

不合格

INDUSTRIAL

3.3 mm

现场可编程门阵列

29.21 mm

29.21 mm

N/A

-

YES

208

FLATPACK, GUARD RING

SQUARE

TPAK208,2.9SQ,20

GQFF

CERAMIC, METAL-SEALED COFIRED

-55 °C

125 °C

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

310 MHz

2.5 V

2.25 V

2.75 V

e0

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

20

S-CQFP-F208

227

不合格

MILITARY

227

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-STD-883 Class B

1.2 ns

2880

2880

48000

100k Rad(Si) V

29.21 mm

29.21 mm

N/A

-

N/A

-

YES

352

Obsolete

MICROCHIP TECHNOLOGY INC

CERAMIC, MQFP-352

CERAMIC, METAL-SEALED COFIRED

HGQFF

SQUARE

FLATPACK, HEAT SINK/SLUG, GUARD RING

1.95 V

1.65 V

1.8 V

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

280000 GATES

3.5 mm

现场可编程门阵列

280000

48 mm

48 mm

N/A

-

YES

624

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

LGA-624

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

LGA

LGA624,25X25,50

9A515.E

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

无铅

未说明

1.27 mm

compliant

未说明

S-CBGA-N624

684

不合格

MILITARY

684

21504 CLBS, 2000000 GATES

2.96 mm

现场可编程门阵列

MIL-STD-883 Class B

0.93 ns

21504

32256

2000000

32.5 mm

32.5 mm