N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

176

147

Compliant

8542390000/8542390000/8542390000/8542390000/8542390000

70 °C

0 °C

238 MHz

2.5 V

2.75 V

2.25 V

1.2 ns

1.2 ns

2880

32000

238 MHz

2880

1980

1.4 mm

24 mm

24 mm

无

2320 In Stock

• 1: ¥2,368.542975
• 10: ¥2,234.474505
• 100: ¥2,107.994815
• 500: ¥1,988.674353
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.26 V

0.538969 oz

- 40 C

60

微芯片技术

1.14 V

SMD/SMT

Microchip

Microchip Technology / Atmel

IGLOO2

N

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL090T-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.76

有

This product may require additional documentation to export from the United States.

86316

267 I/O

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL090T

100 °C

-40 °C

8542.39.00.01

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

323.3 kB

667 Mb/s

267

2.44 mm

现场可编程门阵列

86316

SoC FPGA

2648064

4 Transceiver

86316

FPGA - Field Programmable Gate Array

23 mm

23 mm

29 In Stock

• 1: ¥567.533310
• 10: ¥535.408783
• 100: ¥505.102624
• 500: ¥476.511911
查看所有的价格

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

1.2 V

SMD/SMT

195

Tray

M2GL010

活跃

12084 LE

+ 85 C

1.2 V

0 C

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

1.2 V

12084

933888

STD

4 Transceiver

795 In Stock

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

70 °C

有

A3PN250-ZVQG100

TFQFP

SQUARE

Microsemi Corporation

不推荐

MICROSEMI CORP

1.575 V

5.61

68

Tray

A3PN250

活跃

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

-20 °C

1.5 V

未说明

1.425 V

-20°C ~ 85°C (TJ)

ProASIC3 nano

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

68

不合格

1.5,1.5/3.3 V

OTHER

68

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

STD

6144

6144

250000

14 mm

14 mm

N/A

-

表面贴装

YES

400

400

207

Compliant

FBGA, BGA400,20X20,32

GRID ARRAY, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

有

M2GL050S-1VFG400I

FBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.3

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

现场可编程门阵列

56340

56340

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

有

A3PE3000L-1PQG208I

FQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.59

147

Compliant

Tray

A3PE3000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

1.14 V

85 °C

-40°C ~ 100°C (TJ)

ProASIC3L

e3

3A001.A.7.A

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.2 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

25 mA

63 kB

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3e+06

892.86 MHz

1

75264

75264

75264

3000000

3.4 mm

28 mm

28 mm

无

N/A

-

YES

208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

30

1.14 V

85 °C

无

M1A3P1000L-PQ208I

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

24576

24576

1000000

28 mm

28 mm

N/A

-

YES

208

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.6

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

AX250-PQ208

649 MHz

FQFP

e0

Tin/Lead (Sn/Pb)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

248

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

248

2816 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

0.99 ns

2816

4224

250000

28 mm

28 mm

544 In Stock

• 1: ¥6,184.081438
• 10: ¥5,834.039095
• 100: ¥5,503.810463
• 500: ¥5,192.274024
查看所有的价格

-

表面贴装

456-BBGA

456-PBGA (35x35)

微芯片技术

344

Tray

APA450

活跃

-40°C ~ 85°C (TA)

ProASICPLUS

2.3V ~ 2.7V

110592

450000

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

68

Tray

AGLN250

活跃

-20°C ~ 85°C (TJ)

IGLOO nano

1.425V ~ 1.575V

6144

36864

250000

STD

N/A

-

NO

176

Transferred

ACTEL CORP

5.25 V

5.83

CERAMIC, PGA-176

网格排列

CERAMIC, METAL-SEALED COFIRED

PGA176,15X15

5 V

30

4.75 V

70 °C

无

A1280A-PG176C

41 MHz

PGA

SQUARE

Actel Corporation

e0

Tin/Lead (Sn/Pb)

MAX 140 I/OS

现场可编程门阵列

CMOS

PERPENDICULAR

PIN/PEG

225

2.54 mm

compliant

S-CPGA-P176

140

不合格

5 V

COMMERCIAL

140

1232 CLBS, 8000 GATES

4.3688 mm

现场可编程门阵列

5 ns

1232

1232

8000

39.878 mm

39.878 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

AGLN250V5-ZVQG100I

TFQFP

SQUARE

Microsemi Corporation

不推荐

MICROSEMI CORP

1.575 V

5.61

68

Tray

AGLN250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

1.425 V

85 °C

有

-40°C ~ 100°C (TJ)

IGLOO nano

e3

Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

14 mm

14 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

AGL400V5-FG256I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

178

Tray

AGL400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

-40°C ~ 85°C (TA)

IGLOO

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

17 mm

17 mm

2739 In Stock

• 1: ¥2,299.463289
• 10: ¥2,169.304990
• 100: ¥2,046.514141
• 500: ¥1,930.673721
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

676-BGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

85 °C

有

AFS1500-FGG676

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

1.5000 V

1.425 V

1.575 V

252

Compliant

Tray

AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

0 to 70 °C

Fusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

1.0989 GHz

S-PBGA-B676

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1.5e+06

1.0989 GHz

STD

38400

38400

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

YES

208

230 MHz

QFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.84

QFP, QFP208,1.2SQ,20

FLATPACK

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

85 °C

无

A54SX16-PQ208I

现场可编程门阵列

CMOS

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G208

175

不合格

3.3,5 V

INDUSTRIAL

175

现场可编程门阵列

1452

2477 In Stock

• 1: ¥2,523.322084
• 10: ¥2,380.492534
• 100: ¥2,245.747673
• 500: ¥2,118.629876
查看所有的价格

-

表面贴装

176-LQFP

YES

176-TQFP (24x24)

176

微芯片技术

有

A42MX09-TQG176I

117 MHz

LFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.29

104

Tray

A42MX09

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

3 V

85 °C

-40°C ~ 85°C (TA)

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

STD

2.5 ns

684

14000

24 mm

24 mm

N/A

-

YES

208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.85

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

30

1.425 V

85 °C

无

A3PE600-1PQ208I

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

2267 In Stock

• 1: ¥2,984.199638
• 10: ¥2,815.282679
• 100: ¥2,655.927057
• 500: ¥2,505.591562
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

AX250

活跃

1.425 V

1.575 V

138

Tray

-40°C ~ 85°C (TA)

Axcelerator

1.425V ~ 1.575V

55296

250000

4224

STD

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

317

Tray

AX500

活跃

-55°C ~ 125°C (TA)

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

N/A

-

表面贴装

352

8542390000/8542390000/8542390000/8542390000/8542390000

248

Compliant

125 °C

-55 °C

2.5 V

15.8 kB

600000

5 MHz

21504

无

N/A

-

YES

256

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.28

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

40

1.14 V

70 °C

有

A3P250L-1FGG256

350 MHz

BGA

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

157

不合格

1.5/3.3 V

COMMERCIAL

157

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

6144

6144

250000

17 mm

17 mm

2704 In Stock

• 1: ¥2,135.392405
• 10: ¥2,014.521137
• 100: ¥1,900.491642
• 500: ¥1,792.916639
查看所有的价格

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

20

1.425 V

125 °C

无

A3P1000-FG144T

350 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

Automotive grade

97

Tray

A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.5 V

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

AUTOMOTIVE

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

AEC-Q100

24576

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

256

AGL400V2-FGG256T

Microsemi Corporation

活跃

MICROSEMI CORP

5.77

55296

Compliant

3

30

有

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

250

compliant

6.8 kB

现场可编程门阵列

9216

400000

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

208

208

A3P600L-PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

154

Compliant

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

1.14 V

85 °C

有

e3

哑光锡

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

45 mA

13.5 kB

154

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

6500

600000

781.25 MHz

13824

13824

13824

600000

3.4 mm

28 mm

28 mm

无

500 In Stock

-

YES

484

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

30

1.14 V

85 °C

无

A3P1000L-FG484I

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

INDUSTRIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm