Microchip的片上系统（SoC）_正品采购_价格信息

品牌是'Microchip' (873)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量					Core													厂商																																								操作温度	包装	系列	尺寸/尺寸	JESD-609代码	无铅代码	类型	端子表面处理	附加功能	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况
MPFS160TL-FCVG784I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-784	784-FCBGA (23x23)	RV64GC, RV64IMAC	微芯片技术	312 I/O	0 C	+ 100 C	1	Tray	活跃				This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	161000 LE	-40°C ~ 100°C	Tray	PolarFire™																				1 V			-	1.4125MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 161K Logic Modules		5 Core	128kB
MPFS095T-1FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-536	536-LFBGA	RV64GC, RV64IMAC	微芯片技术	276 I/O	0 C	+ 100 C	1	Tray	活跃				This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	93000 LE	-40°C ~ 100°C	Tray	PolarFire®																				1 V			-	857.6kB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 93K Logic Modules		5 Core	128kB
MPFS095TL-FCVG784I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-784	784-BGA	RV64GC, RV64IMAC	微芯片技术	276 I/O	- 40 C	+ 100 C	1	Tray	活跃				This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	93000 LE	-40°C ~ 100°C	Tray	PolarFire®																				1 V			-	857.6kB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 93K Logic Modules		5 Core	128kB
MPFS095T-1FCSG536E	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-536	536-LFBGA	RV64GC, RV64IMAC	微芯片技术	276 I/O	0 C	+ 100 C	1	Tray	活跃				This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	93000 LE	0°C ~ 100°C	Tray	PolarFire®																				1 V			-	857.6kB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 93K Logic Modules		5 Core	128kB
MPFS095T-1FCVG484E	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	484-FCBGA (19x19)	RV64GC, RV64IMAC	微芯片技术	276 I/O	0 C	+ 100 C	1	Tray	活跃				This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	93000 LE	0°C ~ 100°C	Tray	PolarFire®																				1 V			-	857.6kB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 93K Logic Modules		5 Core	128kB
MPFS160TS-FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	484-FCBGA (19x19)	RV64GC, RV64IMAC	微芯片技术	312 I/O	0 C	+ 100 C	1	Tray	活跃				This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	161000 LE	-40°C ~ 100°C	Tray	PolarFire™																				1 V			-	1.4125MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 161K Logic Modules		5 Core	128kB
MPFS160TL-FCVG784E	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-784	784-FCBGA (23x23)	RV64GC, RV64IMAC	微芯片技术	312 I/O	0 C	+ 100 C	1	Tray	活跃				This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	161000 LE	0°C ~ 100°C	Tray	PolarFire™																				1 V			-	1.4125MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 161K Logic Modules		5 Core	128kB
M2S050TS-FGG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	微芯片技术	Non-Compliant	267	Tray	M2S050		活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	1.14 V	有	M2S050TS-FGG484I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.82	-40°C ~ 100°C (TJ)		SmartFusion®2		e1			Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	1 mm	compliant	40		S-PBGA-B484	267	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列				FPGA - 50K Logic Modules	56340	1 Core	256KB				23 mm	23 mm
M2S060TS-FCSG325	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	微芯片技术	5.81		200	Tray	M2S060	活跃		-	166 MHz	56520 LE	-	64 kB	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S060TS-FCSG325	TFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	0°C ~ 85°C (TJ)		SmartFusion®2		e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	200	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列				FPGA - 60K Logic Modules	56520	1 Core	256KB				11 mm	11 mm
M2S050T-FG896I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	896-BGA	YES	896-FBGA (31x31)	896	微芯片技术	1.26 V	5.81	Non-Compliant	377	Tray	M2S050		活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB	BGA, BGA896,30X30,40	网格排列	3	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	30	1.14 V	无	M2S050T-FG896I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	-40°C ~ 100°C (TJ)		SmartFusion®2		e0			Tin/Lead (Sn/Pb)		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B896	377	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	2.44 mm	现场可编程门阵列				FPGA - 50K Logic Modules	56340	1 Core	256KB				31 mm	31 mm
M2S025TS-FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	微芯片技术	Non-Compliant	267	Tray	M2S025		活跃	-	166 MHz	27696 LE	SMD/SMT	-	64 kB			-40°C ~ 100°C (TJ)		SmartFusion®2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 25K Logic Modules		1 Core	256KB
M2S060T-VF400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	微芯片技术	Tray	M2S060		活跃	-	166 MHz	56520 LE	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S060T-VF400I	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.88	Non-Compliant	207	-40°C ~ 100°C (TJ)		SmartFusion®2		e0			Tin/Lead (Sn/Pb)		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	207	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列				FPGA - 60K Logic Modules	56520	1 Core	256KB				17 mm	17 mm
M2S150T-FCV484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	微芯片技术	M2S150	活跃		-	166 MHz	146124 LE	-	64 kB	VFBGA-484	GRID ARRAY, FINE PITCH	5.81	1.26 V	MICROSEMI CORP	活跃	Microsemi Corporation	SQUARE	FBGA	M2S150T-FCV484I	无	1.14 V	30	1.2 V	BGA484,22X22,32	PLASTIC/EPOXY		273	Tray	-40°C ~ 100°C (TJ)		SmartFusion®2		e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B484	273	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	273	3.15 mm	现场可编程门阵列				FPGA - 150K Logic Modules	146124	1 Core	512KB				19 mm	19 mm
M2S050-FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	微芯片技术	-	166 MHz	56340 LE	60	SMD/SMT	4695 LAB	Microchip	Microchip Technology / Atmel	N	-	64 kB	267	Tray	M2S050	活跃				SMARTFUSION2	100C	Industrial	FPBGA		-40C to 100C	267	56340	65nm	1.26(V)	1.2(V)	无	1.14(V)	-40C	有	56340	表面贴装	有	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2								SOC - Systems on a Chip								484							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				SoC FPGA			FPGA - 50K Logic Modules		1 Core	256KB	SoC FPGA
M2S025T-VFG400	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术		-	166 MHz	27696 LE	-	64 kB				207	Tray	M2S025	活跃	0°C ~ 85°C (TJ)		SmartFusion®2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 25K Logic Modules		1 Core	256KB
MPFS250T-FCVG784EES	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	微芯片技术	MCU - 136, FPGA - 372	Tray	活跃					0°C ~ 100°C		PolarFire™																							-	2.2MB	RISC-V	DMA, PCI, PWM		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 254K Logic Modules			128kB
M2S150-1FC1152I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	微芯片技术	574	Tray	M2S150	活跃		-	166 MHz	146124 LE	SMD/SMT	-	64 kB	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	30	1.14 V	无	M2S150-1FC1152I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81		-40°C ~ 100°C (TJ)		SmartFusion®2		e0			Tin/Lead (Sn/Pb)		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B1152	574	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	574	2.9 mm	现场可编程门阵列				FPGA - 150K Logic Modules	146124	1 Core	512KB				35 mm	35 mm
M2S050TS-FCS325	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	325-FCBGA (11x11)	微芯片技术		活跃	-	166 MHz	56340 LE	-	64 kB			Non-Compliant	200	Tray	M2S050	0°C ~ 85°C (TJ)		SmartFusion®2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 50K Logic Modules		1 Core	256KB
A2F500M3G-PQG208	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	208-BFQFP	208-PQFP (28x28)	微芯片技术	活跃				2XR8I+2XR8I	ACS8802XR8I+2XR8IIP42	ACS880-17-1110A-5+B4+C+H-ABBI	ABB		Panel	MCU - 22, FPGA - 66	A2F500	0°C ~ 85°C (TJ)		SmartFusion®																							80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		Ethernet, I²C, SPI, UART/USART	MCU, FPGA					500 Hz	STD	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops			512KB			IP42
A2F200M3F-1FG256I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LBGA	256-FPBGA (17x17)	微芯片技术	MCU - 25, FPGA - 66	Tray	A2F200	活跃					-40°C ~ 100°C (TJ)		SmartFusion®																							100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA							ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops			256KB
M2S150-FCV484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	微芯片技术	1.2000 V	273	Tray	M2S150		活跃	-	166 MHz	146124 LE	-	64 kB				-40 to 100 °C		SmartFusion®2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						STD	FPGA - 150K Logic Modules		1 Core	512KB
M2S025TS-1VFG400T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术	M2S025TS-1VFG400T2	Microsemi Corporation	活跃	MICROSEMI CORP	5.81				1.2000 V	207	Tray	M2S025		活跃	40	有	0 to 85 °C		Automotive, AEC-Q100, SmartFusion®2		e1	有		Tin/Silver/Copper (Sn/Ag/Cu)							250		compliant									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			现场可编程门阵列			1	FPGA - 25K Logic Modules			256KB
M2S060T-VFG400	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	PEI-Genesis	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40	1.14 V	85 °C	有	M2S060T-VFG400	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81	Bulk	活跃	Non-Compliant	207		M2S060	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	0°C ~ 85°C (TJ)		*		e1			Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B400	207	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列				FPGA - 60K Logic Modules	56520		256KB				17 mm	17 mm
M2S010T-VF400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	Amphenol PCD	1.26 V	5.81	Box	SJT5	-	活跃		Non-Compliant	195	-	166 MHz	12084 LE	SMD/SMT	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S010T-VF400I	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	-40°C ~ 100°C (TJ)		SJT	4.144 L x 0.885 W x 0.900 H (105.26mm x 22.48mm x 22.86mm)	e0		Rail	Tin/Lead (Sn/Pb)		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	195	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	195	1.51 mm	现场可编程门阵列				FPGA - 10K Logic Modules	12084	1 Core	256KB	8			17 mm	17 mm
M2S090TS-FG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	PEI-Genesis	5.86		Bulk	活跃	267	M2S090		-	166 MHz	86316 LE	-	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S090TS-FG484	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	0°C ~ 85°C (TJ)		*		e0			Tin/Lead (Sn/Pb)		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	267	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列				FPGA - 90K Logic Modules	86316	1 Core	512KB				23 mm	23 mm