品牌是'Microchip' (873)
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![]() | A2F060M3E-1FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 1 MM PITCH, FBGA-256 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.5 V | 20 | 1.425 V | 无 | A2F060M3E-1FG256I | 100 MHz | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.84 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 66 | 不合格 | 1.5,1.8,2.5,3.3 V | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | 现场可编程门阵列 | 1536 | 1536 | 60000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS460TS-FCG1152IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | 活跃 | MCU - 136, FPGA - 468 | Tray | -40°C ~ 100°C | PolarFire™ | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS460T-1FCG1152EPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | 活跃 | MCU - 136, FPGA - 468 | Tray | 0°C ~ 100°C | PolarFire™ | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-FCSG325T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 325-TFBGA | 325-BGA (11x11) | 微芯片技术 | 活跃 | MCU - 102, FPGA - 80 | Tray | -40°C ~ 125°C (TJ) | - | - | 857.6KB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-1FGG484I | Microchip | 数据表 | 38 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | - | 64 kB | 微芯片技术 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 有 | M2S010T-1FGG484I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | 1.2000 V | 1.14 V | 1.26 V | 233 | Tray | M2S010 | 活跃 | - | 166 MHz | 12084 LE | SMD/SMT | -40 to 100 °C | SmartFusion®2 | e1 | 100 ppm/K | 60.4 kOhm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | 1 W | CMOS | BOTTOM | BALL | 250 | 1 mm | 通用型 | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | 1 | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
![]() | M2S005-1TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | Obsolete | 84 | Tray | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-1FCVG784T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 微芯片技术 | 活跃 | MCU - 136, FPGA - 312 | Tray | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1FG484 | Microchip Technology | 数据表 | 2353 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | - | - | 64 kB | 2000 LE | 161 I/O | 0 C | + 85 C | 有 | - | 60 | SmartFusion | Tray | A2F200 | 活跃 | N | SMD/SMT | 100 MHz | 0°C ~ 85°C (TJ) | Tray | A2F200 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1CSG288 | Microchip Technology | 数据表 | 47 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | ARM Cortex M3 | MCU - 31, FPGA - 78 | Tray | A2F200 | 微芯片技术 | 活跃 | TFBGA, BGA288,21X21,20 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA288,21X21,20 | 1.5 V | 未说明 | 1.425 V | 85 °C | 有 | A2F200M3F-1CSG288 | 100 MHz | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | Details | 100 MHz | - | - | 64 kB | 2000 LE | 有 | - | 176 | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F200 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B288 | 78 | 不合格 | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | 现场可编程门阵列 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||
![]() | M2S090-FG676 | Microchip Technology | 数据表 | 2688 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | 1.2000 V | 425 | Tray | 微芯片技术 | M2S090 | 活跃 | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S090-FG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 40 | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||
![]() | M2S060-1FG484I | Microchip Technology | 数据表 | 2450 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 60 | SmartFusion2 | 267 | Tray | M2S060 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-FCS536I | Microchip Technology | 数据表 | 2510 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | ARM Cortex M3 | 微芯片技术 | M2S150 | 活跃 | BGA, | 网格排列 | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 无 | M2S150TS-FCS536I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 90 | 1.2000 V | 293 | Tray | -40 to 100 °C | Tray | SmartFusion2 | e0 | 无 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-FCS325 | Microchip Technology | 数据表 | 2568 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | ARM Cortex M3 | M2S090 | 微芯片技术 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S090T-FCS325 | TFBGA | RECTANGULAR | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 176 | 180 | Tray | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | R-PBGA-B325 | 180 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | |||||||||||||||||||||||||||||||||
![]() | M2S060TS-VF400 | Microchip Technology | 数据表 | 2725 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 207 | Tray | 微芯片技术 | M2S060 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 85 °C | 5.87 | 1.26 V | MICROSEMI CORP | 活跃 | SQUARE | LFBGA | M2S060TS-VF400 | 无 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 90 | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||
![]() | M2S090TS-1FG484M | Microchip Technology | 数据表 | 807 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 有 | 7193 LAB | 60 | 0.892167 oz | 267 | 微芯片技术 | Tray | M2S090 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | M2S090TS-1FG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||
![]() | M2S060-VF400I | Microchip Technology | 数据表 | 2492 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | M2S060 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S060-VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 90 | SmartFusion2 | 207 | Tray | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||
![]() | M2S005-TQG144I | Microchip Technology | 数据表 | 11 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-144 | 144-TQFP (20x20) | ARM Cortex M3 | 微芯片技术 | M2S005 | 活跃 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 84 I/O | - 40 C | + 100 C | 191 kbit | 有 | 505 LAB | 60 | 0.046530 oz | 1.2000 V | 1.14 V | 1.26 V | Tray | -40 to 100 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-VFG256I | Microchip Technology | 数据表 | 2483 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | ARM Cortex M3 | 微芯片技术 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 138 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-1VFG400 | Microchip Technology | 数据表 | 39 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 有 | 1007 LAB | 90 | 2.5, 3.3 V | 1.14 V | 微芯片技术 | 1.26 V | 195 | Tray | M2S010 | 活跃 | LFBGA | M2S010T-1VFG400 | 有 | 85 °C | 1.14 V | 1.2 V | BGA400,20X20,32 | PLASTIC/EPOXY | 3 | GRID ARRAY, LOW PROFILE, FINE PITCH | VFBGA-400 | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | S-PBGA-B400 | 195 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||
![]() | M2S060T-FGG484I | Microchip Technology | 数据表 | 2534 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 60 | SmartFusion2 | 1.2000 V | 1.14 V | 微芯片技术 | 1.26 V | 267 | Tray | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 有 | M2S060T-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||
![]() | M2S005S-VF400 | Microchip Technology | 数据表 | 47 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 90 | 169 | Tray | M2S005 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 6060 LE | 有 | 505 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090TS-FGG676 | Microchip Technology | 数据表 | 2141 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | Tray | M2S090 | 微芯片技术 | 活跃 | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S090TS-FGG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 40 | 425 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||
![]() | M2S025TS-1VFG256I | Microchip Technology | 数据表 | 2002 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 2308 LAB | 119 | 138 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-FGG484I | Microchip Technology | 数据表 | 2669 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 有 | 4710 LAB | 60 | SmartFusion2 | 267 | Tray | M2S060 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 56520 LE | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-1FGG484I | Microchip Technology | 数据表 | 39 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 60 | 1.2000 V | 233 | 微芯片技术 | Tray | M2S010 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 有 | M2S010-1FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm |
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