品牌是'Microchip' (873)

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JESD-609代码

无铅代码

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核数量

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闪光大小

长度

宽度

A2F060M3E-1FG256I
A2F060M3E-1FG256I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

1 MM PITCH, FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

20

1.425 V

A2F060M3E-1FG256I

100 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.84

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

66

不合格

1.5,1.8,2.5,3.3 V

66

1536 CLBS, 60000 GATES

1.7 mm

现场可编程门阵列

1536

1536

60000

17 mm

17 mm

MPFS460TS-FCG1152IPP
MPFS460TS-FCG1152IPP
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

活跃

MCU - 136, FPGA - 468

Tray

-40°C ~ 100°C

PolarFire™

-

3.95MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 461K Logic Modules

128kB

MPFS460T-1FCG1152EPP
MPFS460T-1FCG1152EPP
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

活跃

MCU - 136, FPGA - 468

Tray

0°C ~ 100°C

PolarFire™

-

3.95MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 461K Logic Modules

128kB

MPFS095T-FCSG325T2
MPFS095T-FCSG325T2
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

325-TFBGA

325-BGA (11x11)

微芯片技术

活跃

MCU - 102, FPGA - 80

Tray

-40°C ~ 125°C (TJ)

-

-

857.6KB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

128KB

M2S010T-1FGG484I
M2S010T-1FGG484I
Microchip 数据表

38 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

YES

484-FPBGA (23x23)

484

-

64 kB

微芯片技术

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

M2S010T-1FGG484I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.77

1.2000 V

1.14 V

1.26 V

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-40 to 100 °C

SmartFusion®2

e1

100 ppm/K

60.4 kOhm

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

1 W

CMOS

BOTTOM

BALL

250

1 mm

通用型

compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

M2S005-1TQ144I
M2S005-1TQ144I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

144-LQFP

144-TQFP (20x20)

微芯片技术

Obsolete

84

Tray

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

128KB

MPFS160T-1FCVG784T2
MPFS160T-1FCVG784T2
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

微芯片技术

活跃

MCU - 136, FPGA - 312

Tray

-40°C ~ 125°C (TJ)

-

-

1.4125MB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

128KB

A2F200M3F-1FG484
A2F200M3F-1FG484
Microchip Technology 数据表

2353 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

-

-

64 kB

2000 LE

161 I/O

0 C

+ 85 C

-

60

SmartFusion

Tray

A2F200

活跃

N

SMD/SMT

100 MHz

0°C ~ 85°C (TJ)

Tray

A2F200

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

1 Core

256KB

A2F200M3F-1CSG288
A2F200M3F-1CSG288
Microchip Technology 数据表

47 In Stock

-

最小起订量: 1

最小包装量: 1

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

ARM Cortex M3

MCU - 31, FPGA - 78

Tray

A2F200

微芯片技术

活跃

TFBGA, BGA288,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA288,21X21,20

1.5 V

未说明

1.425 V

85 °C

A2F200M3F-1CSG288

100 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

Details

100 MHz

-

-

64 kB

2000 LE

-

176

SmartFusion

0°C ~ 85°C (TJ)

Tray

A2F200

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

现场可编程门阵列

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

11 mm

11 mm

M2S090-FG676
M2S090-FG676
Microchip Technology 数据表

2688 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

1.2000 V

425

Tray

微芯片技术

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

M2S090-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

86316 LE

7193 LAB

40

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

M2S060-1FG484I
M2S060-1FG484I
Microchip Technology 数据表

2450 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

60

SmartFusion2

267

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S150TS-FCS536I
M2S150TS-FCS536I
Microchip Technology 数据表

2510 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

ARM Cortex M3

微芯片技术

M2S150

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S150TS-FCS536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

12177 LAB

90

1.2000 V

293

Tray

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

not_compliant

536

S-PBGA-B536

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

STD

FPGA - 150K Logic Modules

1 Core

512KB

M2S090T-FCS325
M2S090T-FCS325
Microchip Technology 数据表

2568 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

M2S090

微芯片技术

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

M2S090T-FCS325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

86316 LE

7193 LAB

176

180

Tray

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S060TS-VF400
M2S060TS-VF400
Microchip Technology 数据表

2725 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

207

Tray

微芯片技术

M2S060

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

5.87

1.26 V

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2S060TS-VF400

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

90

SmartFusion2

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S090TS-1FG484M
M2S090TS-1FG484M
Microchip Technology 数据表

807 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

7193 LAB

60

0.892167 oz

267

微芯片技术

Tray

M2S090

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

1.14 V

125 °C

M2S090TS-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S060-VF400I
M2S060-VF400I
Microchip Technology 数据表

2492 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

M2S060

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

M2S060-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

90

SmartFusion2

207

Tray

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S005-TQG144I
M2S005-TQG144I
Microchip Technology 数据表

11 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-144

144-TQFP (20x20)

ARM Cortex M3

微芯片技术

M2S005

活跃

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

84 I/O

- 40 C

+ 100 C

191 kbit

505 LAB

60

0.046530 oz

1.2000 V

1.14 V

1.26 V

Tray

-40 to 100 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 5K Logic Modules

1 Core

128KB

M2S025TS-VFG256I
M2S025TS-VFG256I
Microchip Technology 数据表

2483 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LBGA

256-FPBGA (17x17)

ARM Cortex M3

微芯片技术

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

27696 LE

2308 LAB

119

138

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S010T-1VFG400
M2S010T-1VFG400
Microchip Technology 数据表

39 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

1007 LAB

90

2.5, 3.3 V

1.14 V

微芯片技术

1.26 V

195

Tray

M2S010

活跃

LFBGA

M2S010T-1VFG400

85 °C

1.14 V

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE, FINE PITCH

VFBGA-400

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

40

S-PBGA-B400

195

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

M2S060T-FGG484I
M2S060T-FGG484I
Microchip Technology 数据表

2534 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

SmartFusion2

1.2000 V

1.14 V

微芯片技术

1.26 V

267

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

M2S060T-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

4710 LAB

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 60K Logic Modules

56520

1 Core

256KB

23 mm

23 mm

M2S005S-VF400
M2S005S-VF400
Microchip Technology 数据表

47 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

90

169

Tray

M2S005

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

6060 LE

505 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S090TS-FGG676
M2S090TS-FGG676
Microchip Technology 数据表

2141 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

Tray

M2S090

微芯片技术

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

40

1.14 V

85 °C

M2S090TS-FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

86316 LE

7193 LAB

40

425

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

M2S025TS-1VFG256I
M2S025TS-1VFG256I
Microchip Technology 数据表

2002 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LBGA

256-FPBGA (17x17)

ARM Cortex M3

微芯片技术

2308 LAB

119

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S060TS-FGG484I
M2S060TS-FGG484I
Microchip Technology 数据表

2669 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S010-1FGG484I
M2S010-1FGG484I
Microchip Technology 数据表

39 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

1.2000 V

233

微芯片技术

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

M2S010-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm